SCHEMBL8510280

SCHEMBL8510280

CC(C)(c1ccc(Oc2ccc(S)c(N)c2)cc1)c1ccc(Oc2ccc(S)c(N)c2)cc1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
RAB9A P51151 5/20 0.46
MAPT P10636 5/20 0.46
ALDH1A1 P00352 5/20 0.46
NPC1 O15118 3/20 0.46
HPGD P15428 1/20 0.46
MAPK1 P28482 1/20 0.46
NR4A1 P22736 1/20 0.44
L3MBTL1 Q9Y468 3/20 0.40
LMNA P02545 1/20 0.37
ATM Q13315 1/20 0.37
SMN1; SMN2 Q16637 4/20 0.36
MEN1 O00255 1/20 0.36
MITF O75030 1/20 0.36
GAA P10253 1/20 0.36
GFER P55789 1/20 0.36
KMT2A Q03164 1/20 0.36
NLRP1 Q9C000 1/20 0.36
NOD2 Q9HC29 1/20 0.36
POLB P06746 2/20 0.35
CYP2C9 P11712 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL720000 0.85 NR4A1 (0.58) RAB9AMAPTALDH1A1NPC1HPGD
SCHEMBL7866785 0.84 NR4A1 (0.65) RAB9AMAPTALDH1A1NPC1HPGD
SCHEMBL718947 0.83 NR4A1 (0.61) RAB9AMAPTALDH1A1NPC1MAPK1
SCHEMBL8513956 0.81 NR4A1 (0.42) RAB9AMAPTALDH1A1NPC1HPGD
SCHEMBL8174397 0.81 ALDH1A1 (0.47) RAB9AMAPTALDH1A1NPC1HPGD
SCHEMBL29464075 0.79 ALDH1A1 (0.55) RAB9AMAPTALDH1A1NPC1HPGD
SCHEMBL1553689 0.79 ALDH1A1 (0.55) RAB9AMAPTALDH1A1NPC1HPGD
SCHEMBL715892 0.79 ALDH1A1 (0.42) RAB9AMAPTALDH1A1HPGDL3MBTL1
SCHEMBL8166370 0.77 ALDH1A1 (0.47) RAB9AMAPTALDH1A1NPC1HPGD
SCHEMBL24683907 0.77 NR4A1 (0.55) RAB9AMAPTALDH1A1NPC1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20120135251-A1 PHOTOSENSITIVE POLYIMIDE HAVING SILICON MODIFIED GROUP, ADHESIVE COMPOSITION AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-05-31 US disclosed