SCHEMBL8174397

SCHEMBL8174397

Cc1ccc(Oc2ccc(C(C)(C)c3ccc(Oc4ccc(C)c(N)c4)cc3)cc2)cc1N

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.47
MAPT P10636 7/20 0.47
HPGD P15428 4/20 0.47
RAB9A P51151 3/20 0.47
NPC1 O15118 2/20 0.47
MAPK1 P28482 1/20 0.47
NR4A1 P22736 1/20 0.45
TDP1 Q9NUW8 2/20 0.41
CASP1 P29466 1/20 0.41
KMT2A Q03164 4/20 0.41
SMN1; SMN2 Q16637 3/20 0.41
MEN1 O00255 3/20 0.41
TEAD4 Q15561 1/20 0.38
CYP3A4 P08684 1/20 0.38
L3MBTL1 Q9Y468 2/20 0.38
GFER P55789 2/20 0.38
LMNA P02545 1/20 0.38
BCHE P06276 2/20 0.37
ACHE P22303 2/20 0.37
POLB P06746 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8166370 0.86 ALDH1A1 (0.47) ALDH1A1MAPTHPGDRAB9ANPC1
SCHEMBL7866785 0.85 NR4A1 (0.65) ALDH1A1MAPTHPGDRAB9ANPC1
SCHEMBL24683907 0.85 NR4A1 (0.55) ALDH1A1MAPTHPGDRAB9ANPC1
SCHEMBL8167265 0.84 NR4A1 (0.61) ALDH1A1MAPTHPGDMAPK1NR4A1
SCHEMBL47863 0.83 KMT2A (0.49) ALDH1A1MAPTHPGDRAB9ANPC1
SCHEMBL14407074 0.81 TEAD4 (0.59) ALDH1A1MAPTHPGDNR4A1TDP1
SCHEMBL8644207 0.81 ALDH1A1 (0.61) ALDH1A1MAPTHPGDRAB9ANPC1
SCHEMBL8510280 0.81 RAB9A (0.46) ALDH1A1MAPTHPGDRAB9ANPC1
SCHEMBL1553689 0.81 ALDH1A1 (0.55) ALDH1A1MAPTHPGDRAB9ANPC1
SCHEMBL29464075 0.81 ALDH1A1 (0.55) ALDH1A1MAPTHPGDRAB9ANPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2022210788-A1 PHOTOSENSITIVE RESIN COMPOSITION 味の素株式会社 2022-10-06 WO disclosed
WO-2019181721-A1 CURABLE RESIN COMPOSITION, ADHESIVE, ADHESIVE FILM, COVER LAY FILM, AND FLEXIBLE COPPER-CLAD LAMINATE 積水化学工業株式会社 2019-09-26 WO disclosed
US-6051722-A PRECURSOR FOR POLYIMIDE COPOLYMER; USABLE IN OPTICAL LONG-DISTANCE COMMUNICATION, SIGNAL PROCESSING, PHOTOELECTRIC HYBRID CIRCUITS AND OPTICAL COMPUTERS HITACHI CHEMICAL COMPANY, LTD. (JP) 2000-04-18 US disclosed