SCHEMBL8515722

SCHEMBL8515722

Nc1cc(Oc2cccc(Oc3ccc(S)c(N)c3)c2)ccc1S

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.57
SMN1; SMN2 Q16637 2/20 0.57
MEN1 O00255 2/20 0.57
KMT2A Q03164 2/20 0.57
MAPT P10636 2/20 0.57
GAA P10253 2/20 0.57
MITF O75030 1/20 0.57
GFER P55789 1/20 0.57
NLRP1 Q9C000 1/20 0.57
NOD2 Q9HC29 1/20 0.57
NR4A1 P22736 1/20 0.52
MAOB P27338 1/20 0.45
FURIN P09958 2/20 0.44
F2 P00734 1/20 0.44
F10 P00742 1/20 0.44
NPC1 O15118 1/20 0.41
RAB9A P51151 1/20 0.41
NLRP3 Q96P20 1/20 0.41
MAOA P21397 1/20 0.40
LMNA P02545 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL718947 0.91 NR4A1 (0.61) ALDH1A1SMN1; SMN2MEN1KMT2AMAPT
SCHEMBL720000 0.89 NR4A1 (0.58) ALDH1A1SMN1; SMN2MEN1KMT2AMAPT
SCHEMBL8512532 0.83 NR4A1 (0.58) ALDH1A1SMN1; SMN2MEN1KMT2AMAPT
SCHEMBL719999 0.82 GAA (0.52) ALDH1A1SMN1; SMN2MEN1KMT2AMAPT
SCHEMBL4455238 0.80 NR4A1 (0.81) ALDH1A1SMN1; SMN2MEN1KMT2AMAPT
Hydrochloric Acid SCHEMBL11780508 0.78 NR4A1 (0.77) ALDH1A1SMN1; SMN2MEN1KMT2AMAPT
SCHEMBL8510280 0.76 RAB9A (0.46) ALDH1A1SMN1; SMN2MEN1KMT2AMAPT
SCHEMBL23956832 0.75 ALDH1A1 (0.57) ALDH1A1SMN1; SMN2MEN1KMT2AMAPT
SCHEMBL29464082 0.75 ALDH1A1 (0.57) ALDH1A1SMN1; SMN2MEN1KMT2AMAPT
SCHEMBL1554345 0.75 ALDH1A1 (0.57) ALDH1A1SMN1; SMN2MEN1KMT2AMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20120135251-A1 PHOTOSENSITIVE POLYIMIDE HAVING SILICON MODIFIED GROUP, ADHESIVE COMPOSITION AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-05-31 US disclosed