Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.46 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.42 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.42 |
| ▸ | TYMS | P04818 | 3/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.33 |
| ▸ | MEN1 | O00255 | 1/20 | 0.33 |
| ▸ | POLB | P06746 | 1/20 | 0.33 |
| ▸ | MAPT | P10636 | 1/20 | 0.33 |
| ▸ | HTT | P42858 | 1/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.33 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.33 |
| ▸ | PTPRC | P08575 | 1/20 | 0.32 |
| ▸ | S100A4 | P26447 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29462451 | 1.00 | TSHR (0.46) | TSHRALOX15TDP1TYMSALDH1A1 | |
| SCHEMBL20496850 | 0.79 | ALOX15 (0.39) | TSHRALOX15TDP1TYMSALDH1A1 | |
| SCHEMBL854984 | 0.79 | TSHR (0.43) | TSHRALOX15TDP1TYMSALDH1A1 | |
| SCHEMBL29245225 | 0.76 | TSHR (0.40) | TSHRALOX15TDP1TYMSALDH1A1 | |
| SCHEMBL7144842 | 0.76 | ALOX15 (0.37) | TSHRALOX15TDP1TYMSALDH1A1 | |
| SCHEMBL29688935 | 0.76 | TSHR (0.52) | TSHRALOX15TDP1TYMSALDH1A1 | |
| SCHEMBL855646 | 0.76 | TSHR (0.52) | TSHRALOX15TDP1TYMSALDH1A1 | |
| SCHEMBL29569862 | 0.76 | ALOX15 (0.50) | TSHRALOX15TDP1TYMSALDH1A1 | |
| SCHEMBL550679 | 0.76 | ALOX15 (0.50) | TSHRALOX15TDP1TYMSALDH1A1 | |
| SCHEMBL127867 | 0.76 | TSHR (0.54) | TSHRALOX15TDP1TYMSALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 109 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12415892-B2 | Polyimide film preparation method and application thereof | INSTITUTE OF CHEMISTRY CHINESE ACADEMY OF SCIENCES (CN) | 2025-09-16 | — | — | US | claimed |
| CN-117555204-B | Negative photosensitive polyimide glue solution and glue film suitable for flexible circuit board | 明士(北京)新材料开发有限公司 | 2024-04-26 | — | — | CN | claimed |
| CN-117430812-B | Photosensitive polyamic acid ester resin, resin composition and application | 明士(北京)新材料开发有限公司 | 2024-03-19 | — | — | CN | claimed |
| CN-117555204-A | Negative photosensitive polyimide glue solution and glue film suitable for flexible circuit board | 明士(北京)新材料开发有限公司 | 2024-02-13 | — | — | CN | claimed |
| CN-117430812-A | Photosensitive polyamic acid ester resin, resin composition and application | 明士(北京)新材料开发有限公司 | 2024-01-23 | — | — | CN | claimed |
| CN-117384378-A | Photosensitive polyamic acid ester resin, resin composition, preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2024-01-12 | — | — | CN | claimed |
| CN-116577965-B | Negative photosensitive solid adhesive film and preparation method thereof | 明士(北京)新材料开发有限公司 | 2023-10-03 | — | — | CN | claimed |
| CN-114230792-B | Positive photosensitive polyimide resin, resin composition, and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2023-10-03 | — | — | CN | claimed |
| CN-116577965-A | Negative photosensitive solid adhesive film and preparation method thereof | 明士(北京)新材料开发有限公司 | 2023-08-11 | — | — | CN | claimed |
| CN-115407610-B | Photosensitive resin composition, preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2023-05-16 | — | — | CN | claimed |
| CN-114995060-B | Negative photosensitive resin composition capable of being cured at low temperature and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2022-11-01 | — | — | CN | claimed |
| CN-114995060-A | Negative photosensitive resin composition capable of being cured at low temperature and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2022-09-02 | — | — | CN | claimed |
| US-20220177650-A1 | POLYIMIDE FILM PREPARATION METHOD AND APPLICATION THEREOF | INSTITUTE OF CHEMISTRY CHINESE ACADEMY OF SCIENCES (CN) | 2022-06-09 | — | — | US | claimed |
| CN-114280887-A | Negative photosensitive solid glue film developed by alkaline water system and preparation method thereof | 明士(北京)新材料开发有限公司 | 2022-04-05 | — | — | CN | claimed |
| CN-114230792-A | Positive photosensitive polyimide resin, resin composition, and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2022-03-25 | — | — | CN | claimed |
| CN-111286083-A | Bromine flame retardant and preparation method thereof | 广州埃登达化工有限公司 | 2020-06-16 | — | — | CN | claimed |
| CN-108101831-A | A kind of aromatic amine compound of isoindoline containing tetramethyl or its oxide structure and preparation method thereof | 兰州大学 | 2018-06-01 | — | — | CN | claimed |
| EP-0401589-B1 | Method of producing imide bond-containing resins | DAI ICHI KOGYO SEIYAKU CO LTD (JP) | 1994-10-26 | — | — | EP | claimed |
| US-5086114-A | Reacting anhydride-containing copolymer with diisocyanate and halogenated phthalic anhydride in the prense of quaternary phosphonium compound | DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) | 1992-02-04 | — | — | US | claimed |
| EP-0401589-A2 | Method of producing imide bond-containing resins | DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) | 1990-12-12 | — | — | EP | claimed |