Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2513 | 0.78 | — | — | |
| Iodide SCHEMBL13274496 | 0.76 | — | — | |
| Ethane SCHEMBL15300165 | 0.76 | — | — | |
| SCHEMBL16694372 | 0.76 | — | — | |
| SCHEMBL27813661 | 0.74 | GRM5 (0.38) | NPC1RAB9A | |
| SCHEMBL18106839 | 0.69 | KDM4E (0.35) | NPC1RAB9A | |
| Quinoline SCHEMBL27286824 | 0.69 | ALDH1A1 (0.59) | NPC1RAB9A | |
| Piperazine SCHEMBL3259121 | 0.69 | — | — | |
| SCHEMBL143876 | 0.68 | ALDH1A1 (0.50) | NPC1RAB9A | |
| Benzene SCHEMBL31091106 | 0.68 | ALDH1A1 (0.50) | NPC1RAB9A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2023190596-A1 | NOVEL COMPOSITE MATERIAL, METHOD FOR PRODUCING COMPOSITE MATERIAL, AND COMPOSITE | 京セラ株式会社 | 2023-10-05 | — | — | WO | disclosed |
| WO-2019187184-A1 | SEMICONDUCTOR PROCESSING TAPE | 古河電気工業株式会社 | 2019-10-03 | — | — | WO | disclosed |
| WO-2019187187-A1 | TAPE FOR SEMICONDUCTOR PROCESSING | 古河電気工業株式会社 | 2019-10-03 | — | — | WO | disclosed |
| WO-2019187185-A1 | SEMICONDUCTOR PROCESSING TAPE | 古河電気工業株式会社 | 2019-10-03 | — | — | WO | disclosed |
| WO-2019187186-A1 | TAPE FOR SEMICONDUCTOR PROCESSING | 古河電気工業株式会社 | 2019-10-03 | — | — | WO | disclosed |
| US-5780145-A | CURED EPXOY AND OR IMIDE RESINS WITH FILLERS AND GLOBULAR POWDER WITH SPECIFIC PARTICLE SIZE USED AS A SEALING MATERIALS FOR SEMICONDUCTORS | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1998-07-14 | — | — | US | disclosed |
| US-5719225-A | RESIN COMPOSITION CONTAINING FILLER COMPRISING GLOBULAR POWDERS OF DIFFERENT PARTICLE SIZES IN SPECIFIED RATIOS | SUMITOMO CHEMICAL COMPANY, LTD. (JP) | 1998-02-17 | — | — | US | disclosed |