Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 9/20 | 0.64 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.55 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.55 |
| ▸ | RECQL | P46063 | 2/20 | 0.55 |
| ▸ | TLR9 | Q9NR96 | 4/20 | 0.53 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.50 |
| ▸ | PTGS1 | P23219 | 2/20 | 0.50 |
| ▸ | PTGS2 | P35354 | 2/20 | 0.50 |
| ▸ | HSP90AA1 | P07900 | 2/20 | 0.50 |
| ▸ | ATM | Q13315 | 2/20 | 0.50 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.50 |
| ▸ | PKM | P14618 | 1/20 | 0.50 |
| ▸ | CCR6 | P51684 | 1/20 | 0.50 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.47 |
| ▸ | ESR1 | P03372 | 1/20 | 0.47 |
| ▸ | ITGB3 | P05106 | 1/20 | 0.47 |
| ▸ | ITGA2B | P08514 | 1/20 | 0.47 |
| ▸ | HMGB1 | P09429 | 1/20 | 0.47 |
| ▸ | HPGD | P15428 | 1/20 | 0.47 |
| ▸ | TSHR | P16473 | 1/20 | 0.47 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29836708 | 1.00 | MGLL (0.64) | MGLLALDH1A1HSD17B10RECQLTLR9 | |
| SCHEMBL3937146 | 0.83 | MGLL (0.59) | MGLLALDH1A1HSD17B10RECQLTLR9 | |
| SCHEMBL17044642 | 0.81 | PTGS1 (0.49) | MGLLALDH1A1HSD17B10RECQLTLR9 | |
| SCHEMBL29707908 | 0.81 | PTGS1 (0.49) | MGLLALDH1A1HSD17B10RECQLTLR9 | |
| SCHEMBL29425266 | 0.80 | MGLL (0.55) | MGLLALDH1A1RECQLTLR9TDP1 | |
| SCHEMBL7616418 | 0.80 | MGLL (0.55) | MGLLALDH1A1RECQLTLR9TDP1 | |
| SCHEMBL141734 | 0.78 | MGLL (1.00) | MGLLALDH1A1TLR9HSP90AA1NPSR1 | |
| SCHEMBL29439366 | 0.78 | MGLL (1.00) | MGLLALDH1A1TLR9HSP90AA1NPSR1 | |
| SCHEMBL9320871 | 0.77 | MGLL (0.71) | MGLLALDH1A1TLR9TDP1HSP90AA1 | |
| SCHEMBL14582696 | 0.77 | MGLL (0.53) | MGLLALDH1A1HSD17B10RECQLTLR9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0202498-B1 | USE OF A THERMO-SETTING, POLYMERIZABLE COMPOSITION AND WIRING BOARD | HITACHI, LTD. (JP) | 1990-07-11 | — | — | EP | claimed |
| EP-0202498-A2 | Use of a thermo-setting, polymerizable composition and wiring board | HITACHI, LTD. (JP) | 1986-11-26 | — | — | EP | claimed |
| CN-113234194-B | Copolymer, primer composition, double-layer system and application of double-layer system in double-layer stripping process | 北京科华微电子材料有限公司 | 2022-08-12 | — | — | CN | disclosed |
| CN-113234194-A | Copolymer, primer composition, double-layer system and application of double-layer system in double-layer stripping process | 北京科华微电子材料有限公司 | 2021-08-10 | — | — | CN | disclosed |
| EP-0720060-B1 | Process for the development of irradiated radiation-sensitive recording materials | AGFA GEVAERT AG (DE) | 1998-03-25 | — | — | EP | disclosed |
| EP-0720060-A1 | Process for the development of irradiated radiation-sensitive recording materials | HOECHST AKTIENGESELLSCHAFT (DE) | 1996-07-03 | — | — | EP | disclosed |
| EP-0315211-B1 | Thermosetting resin composition, and prepreg and laminated sheet which use the same | HITACHI LTD (JP) | 1995-05-24 | — | — | EP | disclosed |
| EP-0293908-B1 | Molding material for optics | MITSUBISHI GAS CHEMICAL CO (JP) | 1994-04-06 | — | — | EP | disclosed |
| US-5212244-A | Heat and fire resistance, dimensional stability, printed circuits | HITACHI, LTD. (JP) | 1993-05-18 | — | — | US | disclosed |
| US-5080965-A | PREPREG FROM POLY(P-HYDROXYSTYRENE), EPOXY-MODIFIED POLYBUTADIENE AND MALEIMIDE | HITACHI, LTD. (JP) | 1992-01-14 | — | — | US | disclosed |
| EP-0269021-B1 | RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND SUCH BOARD FORMED BY USE THEREOF | HITACHI, LTD. (JP) | 1991-10-23 | — | — | EP | disclosed |
| EP-0202498-A2 | Use of a thermo-setting, polymerizable composition and wiring board | HITACHI, LTD. (JP) | 1986-11-26 | — | — | EP | disclosed |
| EP-0078039-B1 | THERMOSETTING RESIN COMPOSITION, PREPOLYMER THEREOF AND CURED ARTICLE THEREOF | Hitachi, Ltd. (JP) | 1986-01-22 | — | — | EP | disclosed |
| US-4546168-A | POLYMERIZABLE EPOXY COMPOUNDS, PHENOLIC COMPOUNDS, AND TRIALLYL ISOCYANURATE COMPOUNDS | HITACHI, LTD. (JP) | 1985-10-08 | — | — | US | disclosed |
| US-4482703-A | Thermosetting resin composition comprising dicyanamide and polyvalent imide | HITACHI, LTD. (JP) | 1984-11-13 | — | — | US | disclosed |
| EP-0123262-A2 | Resin encapsulated semiconductor device and process for producing the same | HITACHI, LTD. (JP) | 1984-10-31 | — | — | EP | disclosed |
| US-4400438-A | MALEIMIDE RESING AND HALOGENATED DIPHENYL ETHER | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1983-08-23 | — | — | US | disclosed |
| EP-0078039-A1 | Thermosetting resin composition, prepolymer thereof and cured article thereof | Hitachi, Ltd. (JP) | 1983-05-04 | — | — | EP | disclosed |
| US-4289699-A | DISSOLVING CORRESPONSING ESTER IN OXYACID, HYDROLYSIS, PRECIPITATION | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1981-09-15 | — | — | US | disclosed |
| US-4231934-A | TREATING A N-(HYDROXYPHENYL)MALEAMIC ACID WITH A DEHYDRATING AGENT | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1980-11-04 | — | — | US | disclosed |