Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | THRB | P10828 | 2/20 | 0.68 |
| ▸ | TSHR | P16473 | 9/20 | 0.50 |
| ▸ | MEN1 | O00255 | 2/20 | 0.46 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.46 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.40 |
| ▸ | TP53 | P04637 | 2/20 | 0.39 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.39 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.39 |
| ▸ | HTT | P42858 | 2/20 | 0.38 |
| ▸ | POLB | P06746 | 1/20 | 0.38 |
| ▸ | APEX1 | P27695 | 1/20 | 0.38 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.38 |
| ▸ | MAPT | P10636 | 1/20 | 0.38 |
| ▸ | CA1 | P00915 | 3/20 | 0.33 |
| ▸ | CA2 | P00918 | 3/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2804854 | 1.00 | THRB (0.68) | THRBTSHRMEN1KMT2AMAPK1 | |
| SCHEMBL863839 | 1.00 | THRB (0.68) | THRBTSHRMEN1KMT2AMAPK1 | |
| SCHEMBL9860990 | 1.00 | THRB (0.68) | THRBTSHRMEN1KMT2AMAPK1 | |
| Di(Hydroxyethyl)Ether SCHEMBL18317889 | 1.00 | THRB (0.68) | THRBTSHRMEN1KMT2AMAPK1 | |
| SCHEMBL629901 | 1.00 | THRB (0.68) | THRBTSHRMEN1KMT2AMAPK1 | |
| SCHEMBL2809295 | 1.00 | THRB (0.68) | THRBTSHRMEN1KMT2AMAPK1 | |
| Tetraethylene Glycol SCHEMBL8659912 | 1.00 | THRB (0.68) | THRBTSHRMEN1KMT2AMAPK1 | |
| SCHEMBL33376 | 1.00 | THRB (0.68) | THRBTSHRMEN1KMT2AMAPK1 | |
| SCHEMBL2367411 | 1.00 | THRB (0.68) | THRBTSHRMEN1KMT2AMAPK1 | |
| SCHEMBL61385 | 1.00 | THRB (0.68) | THRBTSHRMEN1KMT2AMAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 191 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2630948-B1 | EXTERNAL OIL-IN-WATER-TYPE SKIN PREPARATION | SHISEIDO CO LTD (JP) | 2018-08-22 | — | — | EP | claimed |
| WO-2024150782-A1 | ADHESIVE COMPOSITION, ADHESIVE LAYER, OPTICAL FILM WITH ADHESIVE LAYER, AND DISPLAY DEVICE | 住友化学株式会社 | 2024-07-18 | — | — | WO | disclosed |
| WO-2024150781-A1 | ADHESIVE COMPOSITION, ADHESIVE LAYER, ADHESIVE LAYER-ATTACHED OPTICAL FILM AND DISPLAY DEVICE | 住友化学株式会社 | 2024-07-18 | — | — | WO | disclosed |
| WO-2024150783-A1 | ADHESIVE COMPOSITION, ADHESIVE LAYER, OPTICAL FILM WITH ADHESIVE LAYER, AND DISPLAY DEVICE | 住友化学株式会社 | 2024-07-18 | — | — | WO | disclosed |
| WO-2024150784-A1 | ADHESIVE COMPOSITION, ADHESIVE LAYER, OPTICAL FILM WITH ADHESIVE LAYER, AND DISPLAY DEVICE | 住友化学株式会社 | 2024-07-18 | — | — | WO | disclosed |
| WO-2024075584-A1 | (METH)ACRYLIC RESIN COMPOSITION, FILM AND POLARIZING PLATE | 住友化学株式会社 | 2024-04-11 | — | — | WO | disclosed |
| US-20240118609-A1 | RESIN COMPOSITION FOR SOLDER RESIST, SOLDER RESIST FILM, AND CIRCUIT BOARD | SEKISUI KASEI CO., LTD. (JP) | 2024-04-11 | — | — | US | disclosed |
| US-20240059810-A1 | HOLLOW RESIN PARTICLES USED IN RESIN COMPOSITION FOR SEMICONDUCTOR MEMBER | SEKISUI KASEI CO., LTD. (JP) | 2024-02-22 | — | — | US | disclosed |
| US-20240057252-A1 | LAMINATE, LAMINATE WITH BUILDUP LAYER, LAMINATE WITH METAL FOIL, AND CIRCUIT BOARD | SEKISUI KASEI CO., LTD. (JP) | 2024-02-15 | — | — | US | disclosed |
| US-20240055308-A1 | RESIN COMPOSITION FOR SEMICONDUCTOR SEALING, UNDERFILL MATERIAL, MOLD RESIN, AND SEMICONDUCTOR PACKAGE | SEKISUI KASEI CO., LTD. (JP) | 2024-02-15 | — | — | US | disclosed |
| EP-0442358-A1 | Process for the preparation of polymeric printing plates | HOECHST AKTIENGESELLSCHAFT (DE) | 1991-08-21 | — | — | EP | disclosed |
| EP-0430073-A2 | Optical material of low specific gravity and excellent impact resistance, optical molding product using the optical material and manufacturing method thereof | NIPPON SHOKUBAI CO., LTD. (JP) | 1991-06-05 | — | — | EP | disclosed |
| US-4983644-A | BLEND OF POLYURETHANE, ISOCYANATE GROUP CONTAINING SILANE, AND UNSATURATED MONOMER | MITSUBISHI RAYON COMPANY, LIMITED (JP) | 1991-01-08 | — | — | US | disclosed |
| US-4973640-A | COPOLYMER OF DIACRYLATE MONOMER AND STYRENE | NIPPON SHOKUBAI KAGAKU KOGYO CO., LTD. (JP) | 1990-11-27 | — | — | US | disclosed |
| EP-0393617-A2 | Dental adhesive composition | MITSUBISHI RAYON CO., LTD. (JP) | 1990-10-24 | — | — | EP | disclosed |
| EP-0358524-A2 | Optical material composed of resin having high refractive index | NIPPON SHOKUBAI KAGAKU KOGYO CO. LTD. (JP) | 1990-03-14 | — | — | EP | disclosed |
| EP-0347711-A2 | Dental adhesive composition | MITSUBISHI RAYON CO., LTD. (JP) | 1989-12-27 | — | — | EP | disclosed |
| EP-0270709-A1 | Process for the production of vinyl polymers | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1988-06-15 | — | — | EP | disclosed |
| US-4740553-A | Molding composition containing an elastomer-containing styrene resin, a polycarbonate resin, and a polymer of an acrylate monomer possessing environmental stress cracking resistance | DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 1988-04-26 | — | — | US | disclosed |
| EP-0218229-A2 | Thermoplastic resin composition and process for its preparation | DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 1987-04-15 | — | — | EP | disclosed |