SCHEMBL8660205

SCHEMBL8660205

C(OCC1CO1)C1CO1.c1ccc(CC2CO2)c(CC2CO2)c1

nearest known ligand 0.50

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.50
ALDH1A1 P00352 5/20 0.46
GLA P06280 1/20 0.46
TSHR P16473 5/20 0.44
TP53 P04637 3/20 0.44
SMN1; SMN2 Q16637 2/20 0.44
HIF1A Q16665 2/20 0.44
CYP3A4 P08684 1/20 0.44
MAPK1 P28482 1/20 0.39
MEN1 O00255 3/20 0.39
KMT2A Q03164 3/20 0.39
MGLL Q99685 2/20 0.37
MAPT P10636 2/20 0.36
HPGD P15428 2/20 0.36
CYP1A2 P05177 1/20 0.36
PPARG P37231 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28135919 0.88 TDP1 (0.43) TDP1ALDH1A1GLATSHRTP53
SCHEMBL6480647 0.87 TDP1 (0.45) TDP1ALDH1A1GLATSHRTP53
SCHEMBL29826970 0.87 TDP1 (0.45) TDP1ALDH1A1GLATSHRTP53
Ammonia Solution, Strong SCHEMBL27798784 0.85 TDP1 (0.43) TDP1ALDH1A1GLATSHRTP53
Methane SCHEMBL27917831 0.85 TDP1 (0.43) TDP1ALDH1A1GLATSHRTP53
SCHEMBL4464583 0.84 TDP1 (0.41) TDP1ALDH1A1GLATSHRTP53
SCHEMBL732957 0.82 TDP1 (0.48) TDP1ALDH1A1GLATSHRTP53
SCHEMBL170098 0.82 TDP1 (0.53) TDP1ALDH1A1GLATSHRTP53
SCHEMBL732958 0.82 TDP1 (0.52) TDP1ALDH1A1GLATSHRTP53
Naphthalene SCHEMBL1054782 0.81 TDP1 (0.55) TDP1ALDH1A1GLATSHRTP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111087809-B Thermosetting resin composition, prepreg, metal foil laminate and printed wiring board using the same 台燿科技股份有限公司 2022-09-13 CN disclosed
EP-0872504-A1 CURABLE EPOXY RESIN COMPOSITION WHICH GIVES FLEXIBLE CURED ARTICLE ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 1998-10-21 EP disclosed
EP-0870790-A1 CURABLE EPOXY RESIN COMPOSITION ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 1998-10-14 EP disclosed