SCHEMBL8666486

SCHEMBL8666486

CCC(c1ccc(N)c(O)c1)c1ccc(N)c(O)c1.Nc1cc(S(=O)(=O)c2ccc(O)c(N)c2)ccc1O

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 6/20 0.59
MAPT P10636 3/20 0.59
ALDH1A1 P00352 4/20 0.50
HSD17B10 Q99714 3/20 0.50
PKM P14618 3/20 0.50
USP2 O75604 1/20 0.50
HPGD P15428 1/20 0.50
ALOX15 P16050 1/20 0.50
CA2 P00918 4/20 0.47
CA12 O43570 1/20 0.47
CA1 P00915 1/20 0.47
CA9 Q16790 1/20 0.47
HIF1A Q16665 3/20 0.41
HTT P42858 2/20 0.41
ALOX12 P18054 1/20 0.41
HTR6 P50406 1/20 0.40
KDM4E B2RXH2 4/20 0.36
MEN1 O00255 1/20 0.36
RAB9A P51151 1/20 0.36
KMT2A Q03164 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19810582 0.85 ALDH1A1 (0.62) GAAMAPTALDH1A1HSD17B10PKM
SCHEMBL272365 0.82 GAA (0.50) GAAMAPTALDH1A1HSD17B10PKM
SCHEMBL6853711 0.81 GAA (0.85) GAAMAPTALDH1A1HSD17B10PKM
SCHEMBL272899 0.79 ALDH1A1 (0.70) GAAMAPTALDH1A1HSD17B10PKM
SCHEMBL29871288 0.77 GAA (1.00) GAAMAPTALDH1A1HSD17B10PKM
SCHEMBL109925 0.77 GAA (1.00) GAAMAPTALDH1A1HSD17B10PKM
SCHEMBL29363328 0.77 GAA (1.00) GAAMAPTALDH1A1HSD17B10PKM
SCHEMBL1732796 0.77 GAA (1.00) GAAMAPTALDH1A1HSD17B10PKM
Hydrochloric Acid SCHEMBL28556898 0.75 GAA (0.96) GAAMAPTALDH1A1HSD17B10PKM
Hydrochloric Acid SCHEMBL9447766 0.75 GAA (0.96) GAAMAPTALDH1A1HSD17B10PKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10175577-B2 Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component HITACHI CHEMICAL COMPANY, LTD. (JP) 2019-01-08 US disclosed
US-20150024173-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED FILM, AND ELECTRONIC COMPONENT RESONAC CORPORATION (JP) 2015-01-22 US disclosed
EP-0863436-A1 Heat resistant photosensitive polymer composition, process for forming pattern and semiconductor device HITACHI CHEMICAL CO., LTD. (JP) 1998-09-09 EP disclosed