SCHEMBL272899

SCHEMBL272899

CCC(c1ccc(O)c(N)c1)c1ccc(O)c(N)c1

nearest known ligand 0.70

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.70
GAA P10253 5/20 0.70
ALOX15 P16050 5/20 0.70
HSD17B10 Q99714 4/20 0.70
HPGD P15428 3/20 0.70
USP2 O75604 2/20 0.70
PKM P14618 2/20 0.70
ALOX12 P18054 3/20 0.62
HTT P42858 2/20 0.62
HIF1A Q16665 1/20 0.62
BCHE P06276 2/20 0.45
TYR P14679 2/20 0.45
ACHE P22303 2/20 0.45
KDM4E B2RXH2 3/20 0.43
TDP1 Q9NUW8 3/20 0.43
MAPK1 P28482 2/20 0.43
SHBG P04278 1/20 0.43
CYP17A1 P05093 2/20 0.43
MAPT P10636 4/20 0.42
MEN1 O00255 3/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19810582 0.93 ALDH1A1 (0.62) ALDH1A1GAAALOX15HSD17B10HPGD
SCHEMBL18382557 0.85 ALDH1A1 (0.61) ALDH1A1GAAALOX15HSD17B10HPGD
SCHEMBL14125921 0.84 ALDH1A1 (0.53) ALDH1A1GAAALOX15HSD17B10HPGD
SCHEMBL272365 0.84 GAA (0.50) ALDH1A1GAAALOX15HSD17B10HPGD
SCHEMBL8546420 0.82 ALDH1A1 (1.00) ALDH1A1GAAALOX15HSD17B10HPGD
SCHEMBL13746777 0.82 ALDH1A1 (0.68) ALDH1A1GAAALOX15HSD17B10HPGD
SCHEMBL1789405 0.81 ALDH1A1 (0.53) ALDH1A1GAAALOX15HSD17B10HPGD
SCHEMBL3934205 0.81 TDP1 (0.56) ALDH1A1ALOX15HSD17B10HPGDALOX12
SCHEMBL30341147 0.81 ALDH1A1 (0.66) ALDH1A1GAAALOX15HSD17B10HPGD
SCHEMBL5099274 0.80 ALDH1A1 (0.60) ALDH1A1GAAALOX15HSD17B10HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 696 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119735806-A Fluorine-free alkali-soluble resin, composition containing the same, cured film, and pattern processing method 武汉柔显科技股份有限公司 2025-04-01 CN claimed
CN-119381692-A High-temperature-resistant battery diaphragm and preparation method thereof 东莞市晶致光学薄膜有限公司 2025-01-28 CN claimed
CN-118108661-B Diamine monomer with nitrogen heterocycle and benzocyclobutene structure, and preparation method and application thereof 波米科技有限公司 2024-09-20 CN claimed
CN-118108661-A Diamine monomer with nitrogen heterocycle and benzocyclobutene structure, and preparation method and application thereof 波米科技有限公司 2024-05-31 CN claimed
CN-114524938-B Polymer, photosensitive resin composition, cured film prepared from polymer and photosensitive resin composition, and electronic element 江苏三月科技股份有限公司 2024-02-09 CN claimed
CN-116490541-A Optical film having improved optical properties, display device including the same, and method of manufacturing the same 可隆工业株式会社 2023-07-25 CN claimed
CN-111522201-B Positive photosensitive resin composition, cured film prepared from positive photosensitive resin composition and electronic element 江苏三月科技股份有限公司 2023-03-10 CN claimed
CN-114315686-B Alkynyl-containing diamine, preparation method thereof and application thereof in preparation of photosensitive resin composition 波米科技有限公司 2022-09-06 CN claimed
CN-114524938-A Polymer, photosensitive resin composition, cured film prepared from same and electronic element 江苏三月科技股份有限公司 2022-05-24 CN claimed
CN-114315686-A Alkynyl-containing diamine, preparation method thereof and application thereof in preparation of photosensitive resin composition 波米科技有限公司 2022-04-12 CN claimed
CN-104804189-A Semi-alicyclic polyimide containing phenolic hydroxyl groups, and preparation method and application thereof NANXIONG MATERIAL PRODUCTION BASE OF GUANGZHOU INST OF CHEMISTRY CHINESE ACADEMY OF SCIENCES 2015-07-29 CN claimed
EP-2011842-B1 PHOTOSENSITIVE INK COMPOSITION FOR SCREEN PRINTING AND METHOD OF FORMING POSITIVE RELIEF PATTERN WITH USE THEREOF PI R & D CO LTD (JP) 2014-02-26 EP claimed
US-8449978-B2 Insulated wire and insulating varnish used therefor HITACHI CABLE, LTD. (JP) 2013-05-28 US claimed
US-8349537-B2 Photosensitive ink composition for screen printing and method of forming positive relief pattern with use thereof PI R&D CO., LTD. (JP) 2013-01-08 US claimed
US-20110111351-A1 Photosensitive Ink Composition for Screen Printing and Method of Forming Positive Relief Pattern with Use Thereof WIN MAW SOE 2011-05-12 US claimed
US-20090186295-A1 Photosensitive Ink Composition for Screen Printing and Method of Forming Positive Relief Pattern with Use Thereof PI R&D CO., LTD. (JP) 2009-07-23 US claimed
EP-2011842-A1 PHOTOSENSITIVE INK COMPOSITION FOR SCREEN PRINTING AND METHOD OF FORMING POSITIVE RELIEF PATTERN WITH USE THEREOF PI R & D Co., Ltd. (JP) 2009-01-07 EP claimed
EP-1262509-B1 IMIDE-BENZOXAZOLE POLYCONDENSATE AND PROCESS FOR PRODUCING THE SAME PI R & D CO LTD (JP) 2007-01-10 EP claimed
US-6890626-B1 Imide-benzoxazole polycondensate and process for producing the same PI R&D CO., LTD. (JP) 2005-05-10 US claimed
EP-1262509-A1 IMIDE-BENZOXAZOLE POLYCONDENSATE AND PROCESS FOR PRODUCING THE SAME PI R & D Co., Ltd. (JP) 2002-12-04 EP claimed