Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GAA | P10253 | 3/20 | 0.50 |
| ▸ | ALOX15 | P16050 | 3/20 | 0.50 |
| ▸ | HPGD | P15428 | 3/20 | 0.50 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.50 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.50 |
| ▸ | USP2 | O75604 | 1/20 | 0.50 |
| ▸ | PKM | P14618 | 1/20 | 0.50 |
| ▸ | HKDC1 | Q2TB90 | 1/20 | 0.46 |
| ▸ | MAPT | P10636 | 4/20 | 0.45 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.45 |
| ▸ | MEN1 | O00255 | 2/20 | 0.45 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.45 |
| ▸ | POLB | P06746 | 1/20 | 0.45 |
| ▸ | RAB9A | P51151 | 1/20 | 0.45 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.45 |
| ▸ | TDP1 | Q9NUW8 | 4/20 | 0.43 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.43 |
| ▸ | SHBG | P04278 | 1/20 | 0.43 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.42 |
| ▸ | HTT | P42858 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19810582 | 0.93 | ALDH1A1 (0.62) | GAAALOX15HPGDHSD17B10ALDH1A1 | |
| SCHEMBL272899 | 0.84 | ALDH1A1 (0.70) | GAAALOX15HPGDHSD17B10ALDH1A1 | |
| SCHEMBL8666486 | 0.82 | GAA (0.59) | GAAALOX15HPGDHSD17B10ALDH1A1 | |
| SCHEMBL18319295 | 0.81 | MMP2 (0.44) | GAAALOX15HPGDHSD17B10ALDH1A1 | |
| SCHEMBL3934205 | 0.81 | TDP1 (0.56) | ALOX15HPGDHSD17B10ALDH1A1MAPT | |
| SCHEMBL28295994 | 0.78 | CYP3A4 (0.46) | GAAALOX15HPGDHSD17B10ALDH1A1 | |
| SCHEMBL31545523 | 0.78 | PTGS1 (0.61) | GAAALOX15HPGDHSD17B10ALDH1A1 | |
| SCHEMBL5595265 | 0.77 | GAA (0.69) | GAAALOX15HPGDHSD17B10ALDH1A1 | |
| SCHEMBL30659005 | 0.77 | GAA (0.69) | GAAALOX15HPGDHSD17B10ALDH1A1 | |
| SCHEMBL5673396 | 0.77 | GAA (0.52) | GAAALOX15HPGDHSD17B10ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 380 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8449978-B2 | Insulated wire and insulating varnish used therefor | HITACHI CABLE, LTD. (JP) | 2013-05-28 | — | — | US | claimed |
| US-20070202375-A1 | Polymer electrolyte membrane, method of manufacturing the same and fuel cell including the polymer electrolyte membrane | SAMSUNG SDI CO., LTD. (KR) | 2007-08-30 | — | — | US | claimed |
| CN-1301282-C | Polyimide comprising sulfonic acid group at the terminal of side chain, and polymer electrolyte and fuel cell using the same | SAMSUNG SDI CO LTD (KR) | 2007-02-21 | — | — | CN | claimed |
| CN-1660922-A | Polyimide comprising sulfonic acid group at the terminal of side chain, and polymer electrolyte and fuel cell using the same | SAMSUNG SDI ELECTRONICS CO LTD (KR) | 2005-08-31 | — | — | CN | claimed |
| US-20050181257-A1 | Polyimide comprising sulfonic acid group at the terminal of side chain, and polymer electrolyte and fuel cell using the same | SAMSUNG SDI CO., LTD. (KR) | 2005-08-18 | — | — | US | claimed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-12547074-B2 | Photosensitive resin composition, method for producing patterned cured film, patterned cured film and semiconductor element | RESONAC CORPORATION (JP) | 2026-02-10 | — | — | US | disclosed |
| US-12534399-B2 | Laminate and manufacturing method of semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2026-01-27 | — | — | US | disclosed |
| US-20250291248-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER AND SEMICONDUCTOR DEVICE USING THE SAME | SAMSUNG SDI CO., LTD. (KR) | 2025-09-18 | — | — | US | disclosed |
| US-12405198-B2 | Photosensitive resin composition, method for selecting photosensitive resin composition, method for producing patterned cured film, and method for producing semiconductor device | RESONAC CORPORATION (JP) | 2025-09-02 | — | — | US | disclosed |
| WO-2025128334-A1 | POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2025-06-19 | — | — | WO | disclosed |
| WO-2025128333-A1 | POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2025-06-19 | — | — | WO | disclosed |
| US-6329110-B1 | POSITIVES, POLYIMIDE SOLUBLE IN AN AQUEOUS ALKALINE SOLUTION; QUINONEDIAZIDE CAPABLE OF GENERATING AN ACID WHEN EXPOSED TO LIGHT; COMPOUND HAVING A PHENOLIC HYDROXYL GROUP; | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) | 2001-12-11 | — | — | US | disclosed |
| US-20010031419-A1 | Photosensitive polymer composition, method for forming relief patterns, and electronic parts | NUNOMURA MASATAKA (JP) | 2001-10-18 | — | — | US | disclosed |
| EP-1132773-A1 | POSITIVE-TYPE PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITION | TORAY INDUSTRIES, INC. (JP) | 2001-09-12 | — | — | EP | disclosed |
| US-20010009746-A1 | Photosensitive polymer composition, method for forming relief patterns, and electronic parts | NUNOMURA MASATAKA (JP) | 2001-07-26 | — | — | US | disclosed |
| US-6232032-B1 | MIXTURE OF POLYBENZOXAZOLE AND POLYAMIDE | HITACHI CHEMICAL DUPONT MICROSYSTEMS L.L.C. | 2001-05-15 | — | — | US | disclosed |
| EP-0997777-A1 | Photosensitive polymer composition, method for forming relief patterns, and electronic parts | Hitachi Chemical DuPont MicroSystems Ltd. (JP) | 2000-05-03 | — | — | EP | disclosed |
| EP-0961169-A1 | Photosensitive polymer composition, method for forming relief patterns, and electronic parts | Hitachi Chemical DuPont MicroSystems Ltd. (JP) | 1999-12-01 | — | — | EP | disclosed |
| EP-0863436-A1 | Heat resistant photosensitive polymer composition, process for forming pattern and semiconductor device | HITACHI CHEMICAL CO., LTD. (JP) | 1998-09-09 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ARCN1, GLRA1, PSMA1 | GAA 2886/4885ALOX15 2472/4885HPGD 3226/4885 |
| US-12547074-B2 | Photosensitive resin composition, method for producing patterned cured film, patterned cured film and semiconductor element | JMJD6, RARA, BCR | GAA 4549/4885ALOX15 2728/4885HPGD 2750/4885 |
| US-12534399-B2 | Laminate and manufacturing method of semiconductor device | LCP1, CDH1, L1CAM | GAA 2194/4885ALOX15 1479/4885HPGD 4685/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.