1,3-Propanediol

1,3-Propanediol

SCHEMBL868133

CC(S)CC(=O)O.CC(S)CC(=O)O.OCCCO

nearest known ligand 0.46

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CAMK2A Q9UQM7 1/20 0.40
GPR84 Q9NQS5 5/20 0.37
FFAR1 O14842 1/20 0.37
FFAR4 Q5NUL3 1/20 0.37
SLC22A6 Q4U2R8 1/20 0.36
TDP1 Q9NUW8 2/20 0.35
MAPT P10636 2/20 0.35
ALDH1A1 P00352 1/20 0.35
LMNA P02545 1/20 0.35
PTGS2 P35354 1/20 0.35
RNPEP Q9H4A4 1/20 0.34
CACNA2D1 P54289 2/20 0.34
CACNB3 P54284 1/20 0.34
CACNA1C Q13936 1/20 0.34
PGR P06401 1/20 0.34
ADRA1A P35348 1/20 0.34
HTR2B P41595 1/20 0.34
CACNA2D2 Q9NY47 1/20 0.34
SMN1; SMN2 Q16637 1/20 0.33
GABRR1 P24046 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
1,4-Butanediol SCHEMBL868841 0.95 GPR84 (0.42) CAMK2AGPR84FFAR1FFAR4SLC22A6
1,6-Hexanediol SCHEMBL15379163 0.93 GPR84 (0.46) CAMK2AGPR84FFAR1FFAR4SLC22A6
SCHEMBL4450251 0.93 GPR84 (0.46) CAMK2AGPR84FFAR1FFAR4SLC22A6
SCHEMBL15378892 0.93 GPR84 (0.46) CAMK2AGPR84FFAR1FFAR4SLC22A6
Ethylene Glycol SCHEMBL29687230 0.90 SLC22A6 (0.39) SLC22A6TDP1MAPTALDH1A1LMNA
Ethylene Glycol SCHEMBL869747 0.90 SLC22A6 (0.39) SLC22A6TDP1MAPTALDH1A1LMNA
Butyl Alcohol SCHEMBL30611643 0.89 ALDH1A1 (0.46) GPR84FFAR1FFAR4SLC22A6TDP1
SCHEMBL8612540 0.87
SCHEMBL20966262 0.87
SCHEMBL98745 0.87

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8242217-B2 Epoxy resin curing agent, process for preparing the same, and epoxy resin composition SHOWA DENKO K.K. (JP) 2012-08-14 US claimed
EP-2226347-B1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO KK (JP) 2012-06-27 EP claimed
US-20100273940-A1 EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2010-10-28 US claimed
EP-4667546-A1 PHOTOCURABLE COMPOSITION Bostik SA (FR) 2025-12-24 EP disclosed
EP-4667545-A1 PHOTOCURABLE COMPOSITION Bostik SA (FR) 2025-12-24 EP disclosed
EP-4570860-A1 COUMARIN THIOESTER PHOTOINITIATORS ARKEMA FRANCE (FR) 2025-06-18 EP disclosed
EP-4570811-A1 POLYMERIZABLE PHOSPHINE OXIDE-BASED PHOTOINITIATORS ARKEMA FRANCE (FR) 2025-06-18 EP disclosed
EP-4570791-A1 THIOESTER PHOTOINITIATORS ARKEMA FRANCE (FR) 2025-06-18 EP disclosed
EP-4393720-A1 PHOSPHINE OXIDE-BASED PHOTOINITIATORS ARKEMA FRANCE (FR) 2024-07-03 EP disclosed
US-9709952-B2 Photosensitive composition for volume hologram recording, photosensitive substrate for volume hologram recording, and volume hologram recorded medium DAI NIPPON PRINTING CO., LTD. (JP) 2017-07-18 US disclosed
EP-2889700-B1 PHOTOSENSITIVE COMPOSITION FOR VOLUME HOLOGRAM RECORDING, PHOTOSENSITIVE SUBSTRATE FOR VOLUME HOLOGRAM RECORDING, AND VOLUME HOLOGRAM-RECORDED OBJECT DAINIPPON PRINTING CO LTD (JP) 2017-01-25 EP disclosed
EP-2436715-B1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO KK (JP) 2016-08-24 EP disclosed
US-20150212487-A1 PHOTOSENSITIVE COMPOSITION FOR VOLUME HOLOGRAM RECORDING, PHOTOSENSITIVE SUBSTRATE FOR VOLUME HOLOGRAM RECORDING, AND VOLUME HOLOGRAM RECORDED MEDIUM DAI NIPPON PRINTING CO., LTD. 2015-07-30 US disclosed
EP-2889700-A1 PHOTOSENSITIVE COMPOSITION FOR VOLUME HOLOGRAM RECORDING, PHOTOSENSITIVE SUBSTRATE FOR VOLUME HOLOGRAM RECORDING, AND VOLUME HOLOGRAM-RECORDED OBJECT Dai Nippon Printing Co., Ltd. (JP) 2015-07-01 EP disclosed
US-8865801-B2 Epoxy resin-based coating composition SHOWA DENKO K.K. (JP) 2014-10-21 US disclosed
US-8242217-B2 Epoxy resin curing agent, process for preparing the same, and epoxy resin composition SHOWA DENKO K.K. (JP) 2012-08-14 US disclosed
EP-2226347-B1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO KK (JP) 2012-06-27 EP disclosed
US-20120077903-A1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO K.K. (JP) 2012-03-29 US disclosed
US-20100273940-A1 EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2010-10-28 US disclosed
EP-2226347-A1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION Showa Denko K.K. (JP) 2010-09-08 EP disclosed