SCHEMBL487151

SCHEMBL487151

O=C1C=CC(=O)N1c1cccc(Oc2ccc(Oc3ccc(Oc4cccc(N5C(=O)C=CC5=O)c4)cc3)cc2)c1

nearest known ligand 0.70

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 13/20 0.70
FAAH O00519 5/20 0.67
HSP90AA1 P07900 4/20 0.56
ALDH1A1 P00352 3/20 0.55
PKM P14618 2/20 0.55
HTT P42858 2/20 0.55
ATM Q13315 2/20 0.55
HPN P05981 1/20 0.50
MEN1 O00255 2/20 0.44
KMT2A Q03164 2/20 0.44
LMNA P02545 1/20 0.44
HPGD P15428 1/20 0.44
CCR6 P51684 1/20 0.44
MITF O75030 1/20 0.44
GAA P10253 1/20 0.44
MAPT P10636 1/20 0.44
GFER P55789 1/20 0.44
SMN1; SMN2 Q16637 1/20 0.44
NLRP1 Q9C000 1/20 0.44
NOD2 Q9HC29 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9491223 1.00 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL29391228 1.00 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL29754402 1.00 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL2120468 0.96 MGLL (0.77) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL2120164 0.96 MGLL (0.72) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL24119952 0.95 MGLL (0.74) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL30793027 0.95 MGLL (0.64) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL331306 0.95 MGLL (0.64) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL4263923 0.94 MGLL (0.73) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL332317 0.94 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 186 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118256088-A Resin composition and application thereof 广东生益科技股份有限公司 2024-06-28 CN claimed
CN-118240342-A Thermosetting resin composition and application thereof 广东生益科技股份有限公司 2024-06-25 CN claimed
CN-118240341-A Thermosetting resin composition and application thereof 广东生益科技股份有限公司 2024-06-25 CN claimed
CN-116410594-B Resin composition, prepreg and metal foil-clad laminate 广东生益科技股份有限公司 2024-06-14 CN claimed
CN-116496199-A Modified maleimide compound and application thereof 广东生益科技股份有限公司 2023-07-28 CN claimed
CN-116410596-A Resin composition and application thereof 广东生益科技股份有限公司 2023-07-11 CN claimed
CN-116410595-A Resin composition, prepreg comprising same, and metal foil-clad laminate 广东生益科技股份有限公司 2023-07-11 CN claimed
CN-116410594-A Resin composition, prepreg and metal foil-clad laminate 广东生益科技股份有限公司 2023-07-11 CN claimed
EP-0372775-B1 Thermosetting-resin-forming compositions MITSUI TOATSU CHEMICALS (JP) 1994-05-18 EP claimed
US-4968762-A IMPACT STRENGTH, TOUGHNESS, LOW WATER ABSORPTION MITSUI TOATSU CHEMICALS, INC. (JP) 1990-11-06 US claimed
EP-0372775-A1 Thermosetting-resin-forming compositions MITSUI TOATSU CHEMICALS, Inc. (JP) 1990-06-13 EP claimed
JP-10218994-A None JP disclosed
US-20260071011-A1 COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE RESONAC CORP (JP) 2026-03-12 US disclosed
US-20250326929-A1 RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE RESONAC CORP (JP) 2025-10-23 US disclosed
US-20250326893-A1 RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE RESONAC CORP (JP) 2025-10-23 US disclosed
US-4831102-A Thermosetting resin composition from poly-arylene-oxy-bis-maleimide and polyarylene diamine MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1989-05-16 US disclosed
EP-0294931-A1 Self-lubricating thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-12-14 EP disclosed
EP-0294930-A1 Thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-12-14 EP disclosed
EP-0288251-A1 Thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-10-26 EP disclosed
EP-0253586-A1 Thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-01-20 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260071011-A1 COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE CD79B, C1R, TGFBR1 MGLL 3867/4885FAAH 4069/4885HSP90AA1 3849/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.