Known targets — ChEMBL curated mechanism
GABBR1GABBR2GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQGRIN1GRIN2AGRIN2BGRIN2CGRIN2DGRIN3AGRIN3BHMGCRMMP1MMP13MMP7MMP8PTGS1PTGS2ileSpolrplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO
The experimentally established mechanism targets of Hexacosanoic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | FABP3 | P05413 | 7/20 | 0.72 |
| ▸ | CA1 | P00915 | 1/20 | 0.71 |
| ▸ | CES2 | O00748 | 4/20 | 0.67 |
| ▸ | CES1 | P23141 | 4/20 | 0.67 |
| ▸ | FFAR3 | O14843 | 1/20 | 0.57 |
| ▸ | HDAC3 | O15379 | 1/20 | 0.57 |
| ▸ | HDAC1 | Q13547 | 1/20 | 0.57 |
| ▸ | HDAC2 | Q92769 | 1/20 | 0.57 |
| ▸ | HDAC8 | Q9BY41 | 1/20 | 0.57 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.57 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Behenic Acid SCHEMBL93398 | 1.00 | FABP3 (0.72) | FABP3CA1CES2CES1FFAR3 | |
| N-Octacosanoic Acid SCHEMBL945953 | 1.00 | FABP3 (0.72) | FABP3CA1CES2CES1FFAR3 | |
| SCHEMBL8742990 | 1.00 | FABP3 (0.72) | FABP3CA1CES2CES1FFAR3 | |
| Stearic Acid SCHEMBL12487272 | 1.00 | FABP3 (0.72) | FABP3CA1CES2CES1FFAR3 | |
| Pentadecanoic Acid SCHEMBL870275 | 1.00 | FABP3 (0.72) | FABP3CA1CES2CES1FFAR3 | |
| Behenic Acid SCHEMBL1707610 | 1.00 | FABP3 (0.72) | FABP3CA1CES2CES1FFAR3 | |
| Stearic Acid SCHEMBL9710145 | 1.00 | FABP3 (0.72) | FABP3CA1CES2CES1FFAR3 | |
| Heptadecanoic Acid SCHEMBL869938 | 1.00 | FABP3 (0.72) | FABP3CA1CES2CES1FFAR3 | |
| Stearic Acid SCHEMBL5032895 | 1.00 | FABP3 (0.72) | FABP3CA1CES2CES1FFAR3 | |
| SCHEMBL8743307 | 1.00 | FABP3 (0.72) | FABP3CA1CES2CES1FFAR3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4746003-A1 | COMPOUND, VARNISH, BOND MAGNET, AND MOTOR | Asahi Kasei Kabushiki Kaisha (JP) | 2026-05-20 | — | — | EP | disclosed |
| US-20250353078-A1 | COMPOUND, MOLDED BODY AND CURED PRODUCT | RESONAC CORP (JP) | 2025-11-20 | — | — | US | disclosed |
| EP-4525004-A1 | COMPOUND, MOLDED BODY AND CURED PRODUCT | Resonac Corporation (JP) | 2025-03-19 | — | — | EP | disclosed |
| US-12098278-B2 | Polyamide resin composition | TOYOBO MC CORPORATION (JP) | 2024-09-24 | — | — | US | disclosed |
| US-12071512-B2 | Polyamide resin composition | TOYOBO MC CORPORATION (JP) | 2024-08-27 | — | — | US | disclosed |
| US-12053820-B2 | Dust core compound, molded body, and dust core | RESONAC CORPORATION (JP) | 2024-08-06 | — | — | US | disclosed |
| WO-2023238752-A1 | COMPOUND, MOLDED BODY AND CURED PRODUCT | 株式会社レゾナック | 2023-12-14 | — | — | WO | disclosed |
| WO-2023238338-A1 | COMPOUND, MOULDED ARTICLE, AND CURED PRODUCT | 株式会社レゾナック | 2023-12-14 | — | — | WO | disclosed |
| WO-2023157139-A1 | COMPOUND POWDER,COMPACT, BONDED MAGNET, AND DUST CORE | 株式会社レゾナック | 2023-08-24 | — | — | WO | disclosed |
| WO-2023157398-A1 | COMPOUND POWDER,COMPACT, BONDED MAGNET, AND DUST CORE | 株式会社レゾナック | 2023-08-24 | — | — | WO | disclosed |
| US-20230191480-A1 | DUST CORE COMPOUND, MOLDED BODY, AND DUST CORE | RESONAC CORPORATION (JP) | 2023-06-22 | — | — | US | disclosed |
| EP-4137250-A1 | DUST CORE COMPOUND, MOLDED BODY, AND DUST CORE | Showa Denko Materials Co., Ltd. (JP) | 2023-02-22 | — | — | EP | disclosed |
| EP-4137249-A1 | COMPUND FOR BONDED MAGNETS, MOLDED BODY AND BONDED MAGNET | Showa Denko Materials Co., Ltd. (JP) | 2023-02-22 | — | — | EP | disclosed |
| US-20220195185-A1 | POLYAMIDE RESIN COMPOSITION | TOYOBO CO., LTD. (JP) | 2022-06-23 | — | — | US | disclosed |
| US-20220162381-A1 | POLYAMIDE RESIN COMPOSITION | TOYOBO CO., LTD. (JP) | 2022-05-26 | — | — | US | disclosed |
| EP-3559102-A1 | POLY(BUTYLENE TEREPHTHALATE) COMPOSITION FOR ARTICLES HAVING HIGH DIMENSIONAL STABILITY | SABIC Global Technologies B.V. (NL) | 2019-10-30 | — | — | EP | disclosed |
| WO-2018115293-A1 | POLY(BUTYLENE TEREPHTHALATE) COMPOSITION FOR ARTICLES HAVING HIGH DIMENSIONAL STABILITY | SABIC GLOBAL TECHNOLOGIES B.V. (NL) | 2018-06-28 | — | — | WO | disclosed |
| EP-0535930-B1 | Thermoreversible recording material, thermoreversible recording medium and recording method | OKI ELECTRIC IND CO LTD (JP) | 1997-01-02 | — | — | EP | disclosed |
| US-5310611-A | Comprising polyvinyl acetal matrix and low molecular weight organic compound; transparency change with heat history | OKI ELECTRIC INDUSTRY CO., LTD. (JP) | 1994-05-10 | — | — | US | disclosed |
| EP-0535930-A1 | Thermoreversible recording material, thermoreversible recording medium and recording method | Oki Electric Industry Co., Ltd. (JP) | 1993-04-07 | — | — | EP | disclosed |