SCHEMBL8745405

SCHEMBL8745405

O=C1OC(=O)Oc2ccc3c4cc5oc(=O)oc(=O)oc5c5cccc(c6ccc(c2c63)O1)c45

nearest known ligand 0.30

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
MAOA P21397 2/20 0.30
EGFR P00533 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL297185 0.72 TYMS (0.31)
SCHEMBL2591498 0.72 TYMS (0.44) MAOA
SCHEMBL2485360 0.71 TYMS (0.36)
SCHEMBL3792305 0.70 MEN1 (0.30)
SCHEMBL10886753 0.69 MAOA (0.38) MAOAEGFR
SCHEMBL17555050 0.68 KDM4E (0.40)
SCHEMBL3657417 0.68 MAOA (0.34) MAOAEGFR
SCHEMBL16612995 0.68 MAOA (0.46) MAOAEGFR
SCHEMBL8762664 0.68 MAOA (0.47) MAOAEGFR
SCHEMBL6267811 0.66 MAPT (0.31) MAOA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0621299-B1 Solutions of polyimide-forming substances and their use as coating material BASF LACKE & FARBEN (DE) 1997-07-09 EP disclosed
EP-0596150-B1 Solutions of polyimide precursors BASF LACKE & FARBEN (DE) 1997-02-05 EP disclosed
EP-0513642-B1 Method of making thin polyimide protection layers on ceramic superconductors or high temperature superconductors BASF AG (DE) 1996-09-04 EP disclosed
EP-0379468-B1 Curable epoxy resin composition containing a thermoplastic resin having phenolic end groups CIBA GEIGY AG (CH) 1995-03-01 EP disclosed
EP-0621299-A1 Solutions of polyimide-forming substances and their use as coating material BASF Lacke + Farben AG (DE) 1994-10-26 EP disclosed
EP-0596150-A1 Solutions of polyimide precursors BASF Lacke + Farben Aktiengesellschaft (DE) 1994-05-11 EP disclosed
EP-0513642-A2 Method of making thin polyimide protection layers on ceramic superconductors or high temperature superconductors BASF Aktiengesellschaft (DE) 1992-11-19 EP disclosed
EP-0141781-B1 LIGHT-SENSITIVE COATING COMPOSITION AND USE THEREOF CIBA-GEIGY AG (CH) 1991-09-04 EP disclosed
EP-0162017-B1 HOMO AND COPOLYMER, PROCESS OF THEIR CROSSLINKING AND THEIR USE CIBA-GEIGY AG (CH) 1991-08-21 EP disclosed
EP-0203030-B1 COATED MATERIAL AND ITS USE CIBA-GEIGY AG (CH) 1991-03-20 EP disclosed
EP-0182745-A2 Polyimides, process for their fabrication, and their use CIBA-GEIGY AG (CH) 1986-05-28 EP disclosed
EP-0181837-A2 Process for the manufacture of films and relief pictures from polyimides CIBA-GEIGY AG (CH) 1986-05-21 EP disclosed
EP-0099338-B1 EPOXY RESIN SYSTEMS MODIFIED WITH THERMOPLASTIC RESINS CIBA-GEIGY AG (CH) 1986-05-14 EP disclosed
EP-0162017-A2 Homo and copolymer, process of their crosslinking and their use CIBA-GEIGY AG (CH) 1985-11-21 EP disclosed
EP-0141781-A2 Light-sensitive coating composition and use thereof CIBA-GEIGY AG (CH) 1985-05-15 EP disclosed
EP-0134752-A1 Layered material and its use CIBA-GEIGY AG (CH) 1985-03-20 EP disclosed
EP-0132221-A1 Polyimide, process for its preparation and its use CIBA-GEIGY AG (CH) 1985-01-23 EP disclosed
EP-0119162-A2 Photopolymerisable composition, material coated therewith, and process for obtaining relief images CIBA-GEIGY AG (CH) 1984-09-19 EP disclosed
EP-0099338-A1 Epoxy resin systems modified with thermoplastic resins CIBA-GEIGY AG (CH) 1984-01-25 EP disclosed
EP-0092524-A2 Radiation-sensible coating composition and its use CIBA-GEIGY AG (CH) 1983-10-26 EP disclosed