SCHEMBL8780461

SCHEMBL8780461

CCCCCCCCCCCCCCCCCCc1c(C(N)=O)ccc(C(N)=O)c1CCCCCCCCCCCCCCCCCC

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 3/20 0.50
KMT2A Q03164 3/20 0.50
ADRA2A P08913 3/20 0.50
SLC6A3 Q01959 3/20 0.50
MAPT P10636 2/20 0.50
LMNA P02545 2/20 0.50
CHRM2 P08172 2/20 0.50
CYP3A4 P08684 2/20 0.50
NR1I2 O75469 1/20 0.50
OPRK1 P41145 1/20 0.50
HTR2B P41595 1/20 0.50
HDAC6 Q9UBN7 1/20 0.50
PPARA Q07869 2/20 0.46
RARB P10826 5/20 0.45
APAF1 O14727 1/20 0.45
RGS12 O14924 1/20 0.45
HSP90AA1 P07900 1/20 0.45
MAPK1 P28482 1/20 0.45
PLK1 P53350 1/20 0.43
PPARG P37231 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6534893 1.00 MEN1 (0.50) MEN1KMT2AADRA2ASLC6A3MAPT
SCHEMBL1049187 1.00 MEN1 (0.50) MEN1KMT2AADRA2ASLC6A3MAPT
SCHEMBL27265024 1.00 MEN1 (0.50) MEN1KMT2AADRA2ASLC6A3MAPT
SCHEMBL29074022 1.00 MEN1 (0.50) MEN1KMT2AADRA2ASLC6A3MAPT
SCHEMBL8780464 0.93 PPARA (0.53) MEN1KMT2AADRA2ASLC6A3MAPT
SCHEMBL31186255 0.93 PPARA (0.53) MEN1KMT2AADRA2ASLC6A3MAPT
SCHEMBL28436765 0.93 MEN1 (0.45) MEN1KMT2AADRA2ASLC6A3MAPT
SCHEMBL9781027 0.92 MEN1 (0.45) MEN1KMT2AADRA2ASLC6A3MAPT
SCHEMBL6535320 0.89 LMNA (0.55) MEN1KMT2AADRA2ASLC6A3MAPT
SCHEMBL27405674 0.89 LMNA (0.55) MEN1KMT2AADRA2ASLC6A3MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-57135194-A None JP disclosed
JP-60141747-A None JP disclosed
CN-118755080-A Preparation method of polyamide 66 with high strength and high elongation at break 江苏扬农化工集团有限公司 2024-10-11 CN disclosed
CN-117916318-A Polyamide resin composition UBE株式会社 2024-04-19 CN disclosed
WO-2023171754-A1 POLYETHYLENE TEREPHTHALATE RESIN COMPOSITION AND MOLDED ARTICLE 三菱ケミカル株式会社 2023-09-14 WO disclosed
CN-116670210-A Material for molded article in contact with high-pressure gas UBE株式会社 2023-08-29 CN disclosed
CN-116555938-A PLA fiber and nonwoven made therefrom 道达尔能源科碧恩私人有限公司 2023-08-08 CN disclosed
WO-2023085082-A1 RESIN ADDITIVE MASTERBATCH, SYNTHETIC RESIN COMPOSITION, AND MOLDED OBJECT 株式会社ADEKA 2023-05-19 WO disclosed
WO-2019181912-A1 SEMI-AROMATIC POLYAMIDE FIBER AND METHOD FOR PRODUCING SAME 株式会社クラレ 2019-09-26 WO disclosed
US-20150353714-A1 THERMOPLASTIC RESIN COMPOSITION, RESIN MOLDED ARTICLE, AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE HAVING A PLATED LAYER MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2015-12-10 US disclosed
CN-101142525-A Pattern formation material, pattern formation device, and pattern formation method FUJI FILM CORP (JP) 2008-03-12 CN disclosed
CN-1914279-A Flame resistant thermoplastic resin composition NIPPON ELECTRIC CO (JP) 2007-02-14 CN disclosed
EP-0809556-A1 BINDER FOR USE IN METAL POWDER INJECTION MOLDING AND DEBINDING METHOD BY THE USE OF THE SAME KOMATSU LTD. (JP) 1997-12-03 EP disclosed
EP-0152083-B1 PROCESS FOR PRODUCING POWDER OF MICROCAPSULES KANZAKI PAPER MANUFACTURING COMPANY LIMITED (JP) 1989-05-03 EP disclosed
US-4601863-A Process for producing powder of microcapsules KANZAKI PAPER MANUFACTURING CO., LTD. (JP) 1986-07-22 US disclosed
EP-0152083-A2 Process for producing powder of microcapsules KANZAKI PAPER MANUFACTURING COMPANY LIMITED (JP) 1985-08-21 EP disclosed
JP-S60141747-A VINYL RESIN FILM FOR AGRICULTURAL USE C I KASEI CO LTD 1985-07-26 JP disclosed
JP-S57135194-A THERMOSENSITIVE RECORDING MATERIAL RICOH CO LTD 1982-08-20 JP disclosed