SCHEMBL879227

SCHEMBL879227

CC(C)(C)CC(C(=O)OC1C2CC3C(=O)OC1C3C2)C(C)(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18468958 0.90
SCHEMBL13924632 0.84
SCHEMBL20171477 0.83
SCHEMBL13206568 0.80
SCHEMBL9925266 0.80
SCHEMBL15084174 0.80
SCHEMBL12973908 0.79 NLRP3 (0.37)
SCHEMBL13178003 0.79
SCHEMBL21709895 0.79
SCHEMBL10285168 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11119408-B2 Compound, resin and photoresist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2021-09-14 US disclosed
US-9983478-B2 Resin, resist composition and method for producing resist pattern SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2018-05-29 US disclosed
US-9951159-B2 Compound, resin, resist composition and method for producing resist pattern SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2018-04-24 US disclosed
US-20180031969-A1 COMPOUND, RESIN AND PHOTORESIST COMPOSITION SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2018-02-01 US disclosed
US-9612533-B2 Salt and photoresist composition comprising the same SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2017-04-04 US disclosed
US-9599897-B2 Salt, resin, resist composition and method for producing resist pattern SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2017-03-21 US disclosed
US-9563125-B2 Resist composition and method for producing resist pattern SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2017-02-07 US disclosed
EP-2296039-B1 Positive photosensitive composition FUJIFILM CORP (JP) 2013-09-25 EP disclosed
EP-1273970-B1 Positive photosensitive composition FUJIFILM CORP (JP) 2012-03-28 EP disclosed
EP-1589375-B1 RESIST COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2011-10-19 EP disclosed
US-7964331-B2 Positive resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2011-06-21 US disclosed
US-7892722-B2 Pattern forming method FUJIFILM CORPORATION (JP) 2011-02-22 US disclosed
US-7892722-B2 Pattern forming method FUJIFILM CORPORATION (JP) 2011-02-22 US disclosed
US-20100248133-A1 POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD (JP) 2010-09-30 US disclosed
US-20100124718-A1 POLYMERIC COMPOUND, POSITIVE RESIST COMPOSITION, AND METHOD OF FORMING RESITS PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2010-05-20 US disclosed
EP-1296190-B1 Positive resist composition FUJIFILM CORP (JP) 2010-05-05 EP disclosed