SCHEMBL8853237

SCHEMBL8853237

CCc1ccc(Oc2ccc(N3C(=O)C=CC3=O)cc2)c(Cl)c1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 9/20 0.56
FAAH O00519 3/20 0.44
ALDH1A1 P00352 2/20 0.42
HSP90AA1 P07900 2/20 0.42
HPGD P15428 2/20 0.42
HTT P42858 2/20 0.42
CACNA1B Q00975 1/20 0.42
APBA1 Q02410 1/20 0.42
NPSR1 Q6W5P4 1/20 0.42
TDP1 Q9NUW8 1/20 0.42
NPBWR1 P48145 2/20 0.41
MCHR1 Q99705 2/20 0.41
FFAR1 O14842 1/20 0.40
ACACB O00763 4/20 0.40
MEN1 O00255 1/20 0.39
LMNA P02545 1/20 0.39
PKM P14618 1/20 0.39
CCR6 P51684 1/20 0.39
KMT2A Q03164 1/20 0.39
ATM Q13315 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8853362 0.90 MGLL (0.58) MGLLFAAHFFAR1ACACB
SCHEMBL348925 0.89 MGLL (0.54) MGLLFAAHALDH1A1HSP90AA1HPGD
SCHEMBL8853248 0.85 MGLL (0.58) MGLLFAAHALDH1A1HSP90AA1HPGD
SCHEMBL8852750 0.84 MGLL (0.56) MGLLFAAHALDH1A1HSP90AA1HPGD
SCHEMBL8767472 0.82 MGLL (0.53) MGLLFAAHALDH1A1HSP90AA1HPGD
SCHEMBL11594023 0.82 MGLL (0.56) MGLLFAAHALDH1A1HSP90AA1HPGD
SCHEMBL8853360 0.81 MGLL (0.79) MGLLFAAHALDH1A1HSP90AA1HPGD
SCHEMBL15442737 0.80 MGLL (0.54) MGLLFAAHALDH1A1HSP90AA1HPGD
SCHEMBL349863 0.79 MGLL (0.53) MGLLFAAHALDH1A1HSP90AA1HPGD
SCHEMBL348056 0.79 MGLL (0.47) MGLLFAAHALDH1A1HSP90AA1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117539127-A Composition for forming resist underlayer film containing amide solvent 日产化学株式会社 2024-02-09 CN disclosed
CN-110192152-B Composition for forming resist underlayer film containing amide solvent 日产化学株式会社 2023-11-03 CN disclosed
CN-115975155-A Composition for forming cured film for alignment material, and retardation material 日产化学株式会社 2023-04-18 CN disclosed
CN-111683986-A Composition for forming cured film, alignment material, and phase difference material 日产化学株式会社 2020-09-18 CN disclosed
CN-102344816-B Liquid crystal alignment agent, liquid crystal alignment film prepared from same and liquid crystal display element CHI MEI CORP 2014-02-19 CN disclosed
CN-102395614-B Photosensitive polyester composition for use in forming thermally cured film NISSAN CHEMICAL IND LTD 2013-10-30 CN disclosed
CN-102361932-B Polyester composition for forming thermosetting film NISSAN CHEMICAL IND LTD 2013-07-17 CN disclosed
CN-102369230-B Polyester composition for forming thermoset films NISSAN CHEMICAL IND LTD 2013-07-10 CN disclosed
CN-101679633-B Resin composition for forming heat-cured film NISSAN CHEMICAL IND LTD 2012-09-19 CN disclosed
CN-102395614-A Photosensitive polyester composition for use in forming thermally cured film NISSAN CHEMICAL IND LTD 2012-03-28 CN disclosed
CN-102369230-A Polyester composite for forming thermoset films NISSAN CHEMICAL IND LTD 2012-03-07 CN disclosed
CN-102369231-A Polyester composite for forming thermoset films NISSAN CHEMICAL IND LTD 2012-03-07 CN disclosed
CN-102361932-A Polyester composition for forming thermosetting film NISSAN CHEMICAL IND LTD 2012-02-22 CN disclosed
CN-101679633-A Resin composition for forming heat-cured film NISSAN CHEMICAL IND LTD 2010-03-24 CN disclosed
US-5686191-A POLYIMIDE ADHESIVE, ELASTICITY HITACHI, LTD. (JP) 1997-11-11 US disclosed