Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 16/20 | 0.79 |
| ▸ | FAAH | O00519 | 5/20 | 0.56 |
| ▸ | HSP90AA1 | P07900 | 3/20 | 0.51 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.51 |
| ▸ | HPGD | P15428 | 2/20 | 0.51 |
| ▸ | HTT | P42858 | 2/20 | 0.51 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.51 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.51 |
| ▸ | CACNA1B | Q00975 | 1/20 | 0.51 |
| ▸ | APBA1 | Q02410 | 1/20 | 0.51 |
| ▸ | PKM | P14618 | 2/20 | 0.49 |
| ▸ | MEN1 | O00255 | 1/20 | 0.49 |
| ▸ | LMNA | P02545 | 1/20 | 0.49 |
| ▸ | CCR6 | P51684 | 1/20 | 0.49 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.49 |
| ▸ | ATM | Q13315 | 1/20 | 0.49 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.44 |
| ▸ | NPBWR1 | P48145 | 1/20 | 0.43 |
| ▸ | MCHR1 | Q99705 | 1/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL112959 | 0.89 | MGLL (1.00) | MGLLFAAHHSP90AA1ALDH1A1HPGD | |
| SCHEMBL8048971 | 0.87 | MGLL (0.81) | MGLLFAAHHSP90AA1ALDH1A1HPGD | |
| SCHEMBL29573151 | 0.86 | MGLL (0.65) | MGLLFAAHHSP90AA1ALDH1A1HTT | |
| SCHEMBL2944426 | 0.86 | MGLL (0.65) | MGLLFAAHHSP90AA1ALDH1A1HTT | |
| SCHEMBL486996 | 0.86 | MGLL (0.68) | MGLLFAAHHSP90AA1ALDH1A1HPGD | |
| SCHEMBL349106 | 0.86 | MGLL (0.78) | MGLLFAAHHSP90AA1ALDH1A1HPGD | |
| SCHEMBL4385482 | 0.85 | MGLL (0.84) | MGLLFAAHHSP90AA1ALDH1A1HPGD | |
| SCHEMBL331752 | 0.85 | MGLL (0.84) | MGLLFAAHHSP90AA1ALDH1A1HPGD | |
| SCHEMBL487033 | 0.85 | MGLL (0.84) | MGLLFAAHHSP90AA1ALDH1A1HPGD | |
| SCHEMBL27174528 | 0.84 | MGLL (0.72) | MGLLFAAHHSP90AA1ALDH1A1HPGD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 49 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118256088-A | Resin composition and application thereof | 广东生益科技股份有限公司 | 2024-06-28 | — | — | CN | claimed |
| CN-118240342-A | Thermosetting resin composition and application thereof | 广东生益科技股份有限公司 | 2024-06-25 | — | — | CN | claimed |
| CN-118240341-A | Thermosetting resin composition and application thereof | 广东生益科技股份有限公司 | 2024-06-25 | — | — | CN | claimed |
| CN-116410594-B | Resin composition, prepreg and metal foil-clad laminate | 广东生益科技股份有限公司 | 2024-06-14 | — | — | CN | claimed |
| CN-116496199-A | Modified maleimide compound and application thereof | 广东生益科技股份有限公司 | 2023-07-28 | — | — | CN | claimed |
| CN-116410596-A | Resin composition and application thereof | 广东生益科技股份有限公司 | 2023-07-11 | — | — | CN | claimed |
| CN-116410594-A | Resin composition, prepreg and metal foil-clad laminate | 广东生益科技股份有限公司 | 2023-07-11 | — | — | CN | claimed |
| CN-116410595-A | Resin composition, prepreg comprising same, and metal foil-clad laminate | 广东生益科技股份有限公司 | 2023-07-11 | — | — | CN | claimed |
| CN-118256088-A | Resin composition and application thereof | 广东生益科技股份有限公司 | 2024-06-28 | — | — | CN | disclosed |
| CN-118240342-A | Thermosetting resin composition and application thereof | 广东生益科技股份有限公司 | 2024-06-25 | — | — | CN | disclosed |
| CN-118240341-A | Thermosetting resin composition and application thereof | 广东生益科技股份有限公司 | 2024-06-25 | — | — | CN | disclosed |
| CN-116410594-B | Resin composition, prepreg and metal foil-clad laminate | 广东生益科技股份有限公司 | 2024-06-14 | — | — | CN | disclosed |
| CN-117539127-A | Composition for forming resist underlayer film containing amide solvent | 日产化学株式会社 | 2024-02-09 | — | — | CN | disclosed |
| CN-110192152-B | Composition for forming resist underlayer film containing amide solvent | 日产化学株式会社 | 2023-11-03 | — | — | CN | disclosed |
| US-8057952-B2 | Polymer electrolyte membrane, method of manufacturing the same and fuel cell including the polymer electrolyte membrane | SAMSUNG SDI CO., LTD. (KR) | 2011-11-15 | — | — | US | disclosed |
| CN-101679633-A | Resin composition for forming heat-cured film | NISSAN CHEMICAL IND LTD | 2010-03-24 | — | — | CN | disclosed |
| US-20070202375-A1 | Polymer electrolyte membrane, method of manufacturing the same and fuel cell including the polymer electrolyte membrane | SAMSUNG SDI CO., LTD. (KR) | 2007-08-30 | — | — | US | disclosed |
| US-20070202375-A1 | Polymer electrolyte membrane, method of manufacturing the same and fuel cell including the polymer electrolyte membrane | SAMSUNG SDI CO., LTD. (KR) | 2007-08-30 | — | — | US | disclosed |
| CN-1317329-C | Resin composition, prepreg and laminate using the composition | MITSUI CHEMICALS INC (JP) | 2007-05-23 | — | — | CN | disclosed |
| US-5686191-A | POLYIMIDE ADHESIVE, ELASTICITY | HITACHI, LTD. (JP) | 1997-11-11 | — | — | US | disclosed |