SCHEMBL8854677

SCHEMBL8854677

CCCCCCCCCCCCCCCCC(CC)C(=O)OC(=O)C(CC)CCCCCCCCCCCCCCCC

nearest known ligand 0.62

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
CA2 P00918 7/20 0.62
CA1 P00915 4/20 0.62
MAPK1 P28482 1/20 0.52
ZDHHC7 Q9NXF8 1/20 0.48
GRIK1 P39086 1/20 0.46
GRIK2 Q13002 1/20 0.46
GPR84 Q9NQS5 3/20 0.45
NAAA Q02083 1/20 0.45
FFAR1 O14842 1/20 0.45
MAPT P10636 1/20 0.44
LCK P06239 1/20 0.44
PPARD Q03181 1/20 0.44
ZDHHC20 Q5W0Z9 1/20 0.44
ZDHHC2 Q9UIJ5 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27555272 0.96 CA2 (0.63) CA2CA1MAPK1ZDHHC7GRIK1
SCHEMBL27923496 0.93 CA2 (0.55) CA2CA1MAPK1ZDHHC7GRIK1
SCHEMBL3075648 0.91 CA2 (0.55) CA2CA1MAPK1ZDHHC7GRIK1
SCHEMBL21409705 0.91 CA2 (0.55) CA2CA1MAPK1ZDHHC7GRIK1
SCHEMBL240950 0.91 CA2 (0.73) CA2CA1MAPK1NAAAMAPT
SCHEMBL28540003 0.91 CA2 (0.53) CA2CA1MAPK1ZDHHC7GRIK1
SCHEMBL11358680 0.90 CA2 (0.56) CA2CA1MAPK1ZDHHC7GRIK1
SCHEMBL21066774 0.90 CA2 (0.56) CA2CA1MAPK1ZDHHC7GRIK1
SCHEMBL11689199 0.90 CA2 (0.56) CA2CA1MAPK1ZDHHC7GRIK1
SCHEMBL26108846 0.90 CA2 (0.56) CA2CA1MAPK1ZDHHC7GRIK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2731993-B1 EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME LG INNOTEK CO LTD (KR) 2023-08-30 EP disclosed
CN-111909618-B Inner-surface reflection preventing black coating, inner-surface reflection preventing black coating film, and optical element 佳能化成株式会社 2022-09-13 CN disclosed
CN-114672218-A Surface reflection preventing paint and surface reflection preventing coating film 佳能化成株式会社 2022-06-28 CN disclosed
CN-111909618-A Inner-surface reflection preventing black coating, inner-surface reflection preventing black coating film, and optical element 佳能化成株式会社 2020-11-10 CN disclosed
EP-2710075-B1 EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME LG INNOTEK CO LTD (KR) 2019-10-16 EP disclosed
US-9974172-B2 Epoxy resin compound and radiant heat circuit board using the same LG INNOTEK CO., LTD. (KR) 2018-05-15 US disclosed
US-9812618-B2 Epoxy resin composition and light-emitting apparatus using the same LG INNOTEK CO., LTD. (KR) 2017-11-07 US disclosed
US-9451695-B2 Epoxy resin compound and radiant heat circuit board using the same LG INNOTEK CO., LTD. (KR) 2016-09-20 US disclosed
US-9357630-B2 Epoxy resin compound and radiant heat circuit board using the same LG INNOTEK CO., LTD. (KR) 2016-05-31 US disclosed
US-20160005937-A1 Epoxy Resin Composition and Light-Emitting Apparatus Using the Same LG INNOTEK CO., LTD. (KR) 2016-01-07 US disclosed
US-20140231122-A1 EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME LG INNOTEK CO., LTD. (KR) 2014-08-21 US disclosed
EP-2731993-A2 EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME LG Innotek Co., Ltd. (KR) 2014-05-21 EP disclosed
EP-2710075-A2 EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME LG Innotek Co., Ltd. (KR) 2014-03-26 EP disclosed
WO-2013032238-A9 EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME LG INNOTEK CO., LTD. (KR) 2013-06-06 WO disclosed
WO-2012161490-A9 EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME LG INNOTEK CO., LTD. (KR) 2013-05-23 WO disclosed
WO-2013009114-A9 EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME LG INNOTEK CO., LTD. (KR) 2013-04-04 WO disclosed
WO-2013032238-A2 EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME LG INNOTEK CO., LTD. (KR) 2013-03-07 WO disclosed
WO-2013009114-A2 EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME LG INNOTEK CO., LTD. (KR) 2013-01-17 WO disclosed
WO-2012161490-A2 EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME LG INNOTEK CO., LTD. (KR) 2012-11-29 WO disclosed
US-5677380-A COATING ON IRREGULAR SURFACE MATERIAL COMPRISING ADDITION POLYMER, HEAT CURING AGENT, HALATION PREVENTIVE AGENT, HEATING TO FLUIDIZE AND CURE FILM TOSOH CORPORATION (JP) 1997-10-14 US disclosed