SCHEMBL8901129

SCHEMBL8901129

Cc1c(Cc2ccc(OC#N)c(C)c2C)ccc(OC#N)c1C

nearest known ligand 0.34

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.34
MEN1 O00255 1/20 0.34
TSHR P16473 1/20 0.34
KMT2A Q03164 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16707418 0.85 ALDH1A1 (0.31) ALDH1A1
SCHEMBL31084408 0.85 ALDH1A1 (0.31) ALDH1A1
SCHEMBL28886301 0.83 MEN1 (0.32) ALDH1A1MEN1TSHRKMT2A
SCHEMBL8855659 0.82 HTR1B (0.33)
SCHEMBL8579897 0.80
SCHEMBL8779461 0.77 POLB (0.30)
SCHEMBL16707474 0.77 NCEH1 (0.31)
SCHEMBL8901133 0.74
SCHEMBL4449148 0.74 AMY1A (0.39) ALDH1A1
SCHEMBL29388728 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-9100349-A None JP disclosed
CN-115175951-A Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board 三菱瓦斯化学株式会社 2022-10-11 CN disclosed
JP-H09100349-A THERMOSETTING RESIN COMPOSITION SHIN ETSU CHEM CO LTD 1997-04-15 JP disclosed