Known targets — ChEMBL curated mechanism
CACNA1CCACNA1DCACNA1FCACNA1SDPP4HTR1BHTR1D
The experimentally established mechanism targets of Benzoic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.42 |
| ▸ | DAO | P14920 | 1/20 | 0.42 |
| ▸ | NAPRT | Q6XQN6 | 1/20 | 0.42 |
| ▸ | AKT1 | P31749 | 1/20 | 0.41 |
| ▸ | CES2 | O00748 | 1/20 | 0.38 |
| ▸ | CES1 | P23141 | 1/20 | 0.38 |
| ▸ | SRD5A2 | P31213 | 1/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.35 |
| ▸ | L3MBTL1 | Q9Y468 | 3/20 | 0.35 |
| ▸ | OPRD1 | P41143 | 1/20 | 0.34 |
| ▸ | PKM | P14618 | 2/20 | 0.33 |
| ▸ | HDAC3 | O15379 | 1/20 | 0.33 |
| ▸ | HDAC1 | Q13547 | 1/20 | 0.33 |
| ▸ | HDAC2 | Q92769 | 1/20 | 0.33 |
| ▸ | NCOR2 | Q9Y618 | 1/20 | 0.33 |
| ▸ | LMNA | P02545 | 2/20 | 0.33 |
| ▸ | MAPT | P10636 | 2/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.33 |
| ▸ | TP53 | P04637 | 2/20 | 0.32 |
| ▸ | HPGD | P15428 | 2/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Benzoic Acid SCHEMBL11436196 | 0.91 | TSHR (0.52) | TSHRDAONAPRTCES2CES1 | |
| Benzoic Acid SCHEMBL505771 | 0.91 | TSHR (0.52) | TSHRDAONAPRTCES2CES1 | |
| Benzoic Acid SCHEMBL235922 | 0.91 | TSHR (0.52) | TSHRDAONAPRTCES2CES1 | |
| Benzoic Acid SCHEMBL2160785 | 0.88 | TSHR (0.45) | TSHRDAONAPRTCES2CES1 | |
| Benzoic Acid SCHEMBL28085429 | 0.84 | DAO (0.41) | TSHRDAONAPRTCES2CES1 | |
| Benzoic Acid SCHEMBL9894638 | 0.84 | DAO (0.41) | TSHRDAONAPRTCES2CES1 | |
| Terephthalic Acid SCHEMBL28441196 | 0.84 | TSHR (0.48) | TSHRDAONAPRTCES2CES1 | |
| Acrylic Acid SCHEMBL1344429 | 0.83 | LMNA (0.43) | TSHRALDH1A1LMNAALOX15HSD17B10 | |
| Acrylic Acid SCHEMBL22129646 | 0.83 | LMNA (0.43) | TSHRALDH1A1LMNAALOX15HSD17B10 | |
| Acrylic Acid SCHEMBL134218 | 0.83 | LMNA (0.43) | TSHRALDH1A1LMNAALOX15HSD17B10 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 202 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114656818-B | metal oxide dispersion | 凯斯科技股份有限公司 | 2023-11-17 | — | — | CN | claimed |
| US-10907023-B2 | Polymer hollow particle, a method of preparing the same, and composite comprising the polymer hollow particle | KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) | 2021-02-02 | — | — | US | claimed |
| US-20190016868-A1 | POLYMER HOLLOW PARTICLE, A METHOD OF PREPARING THE SAME, AND COMPOSITE COMPRISING THE POLYMER HOLLOW PARTICLE | KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) | 2019-01-17 | — | — | US | claimed |
| US-7879259-B2 | thermoplastic resin and a styrene-acrylonitrile (SAN) copolymer resin, a curing composition, and conductive particles; exhibiting improved adhesion and low contact resistance characteristics | CHEIL INDUSTRIES, INC. (KR) | 2011-02-01 | — | — | US | claimed |
| US-20080099733-A1 | Anisotropic conductive film composition | CHEIL INDUSTRIES, INC. | 2008-05-01 | — | — | US | claimed |
| CN-115698183-B | Resin composition for wiring board material, and prepreg, resin-equipped film, resin-equipped metal foil, metal foil-clad laminate and wiring board using the resin composition | 松下知识产权经营株式会社 | 2024-06-25 | — | — | CN | disclosed |
| CN-114656818-B | metal oxide dispersion | 凯斯科技股份有限公司 | 2023-11-17 | — | — | CN | disclosed |
| US-20230212392-A1 | RESIN COMPOSITION FOR WIRING BOARD MATERIAL, AND PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD IN WHICH SAID RESIN COMPOSITION IS USED | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2023-07-06 | — | — | US | disclosed |
| CN-116200744-A | Flexible copper-clad laminate film, method for producing same, and electrical element comprising same | 东丽尖端素材株式会社 | 2023-06-02 | — | — | CN | disclosed |
| CN-115710438-A | Metal oxide dispersion, thin film composition for display, and optical element for display | 凯斯科技股份有限公司 | 2023-02-24 | — | — | CN | disclosed |
| CN-115702218-A | Infrared-absorbing ultraviolet-curable ink and infrared-absorbing printed matter | 共同印刷株式会社 | 2023-02-14 | — | — | CN | disclosed |
| CN-112384994-B | Coated particles | 日本化学工业株式会社 | 2022-10-04 | — | — | CN | disclosed |
| EP-1378794-A1 | Light sensitive composition and light sensitive planographic printing plate precursor | KONICA CORPORATION (JP) | 2004-01-07 | — | — | EP | disclosed |
| US-20030194649-A1 | Light sensitive compostion, light sensitive planographic printing plate precursor, and image formation method | KONICA CORPORATION (JP) | 2003-10-16 | — | — | US | disclosed |
| EP-1335247-A2 | Light sensitive composition, light sensitive planographic printing plate precursor, and image formation method | KONICA CORPORATION (JP) | 2003-08-13 | — | — | EP | disclosed |
| US-20030113667-A1 | Method of preparing planographic printing plate | FUJIFILM CORPORATION (JP) | 2003-06-19 | — | — | US | disclosed |
| US-6074741-A | ROUGHENED SURFACE LAYER IS FORMED FROM AN ULTRAVIOLET CURING RESIN CONTAINING AT LEAST AN EPOXY COMPOUND AND A PHOTO-CATIONIC POLYMERIZATION INITIATOR, AND BEADS OF A CROSSLINKED ACRYLIC RESIN. | TOMOEGAWA PAPER CO., LTD. (JP) | 2000-06-13 | — | — | US | disclosed |
| EP-0762208-B1 | Light sensitive composition | KONISHIROKU PHOTO IND (JP) | 2000-04-12 | — | — | EP | disclosed |
| US-5773194-A | PHOTOSENSITIVITY; DURABILITY | KONICA CORPORATION (JP) | 1998-06-30 | — | — | US | disclosed |
| EP-0762208-A2 | Light sensitive composition, presensitized lithographic printing plate and image forming method employing the printing plate | KONICA CORPORATION (JP) | 1997-03-12 | — | — | EP | disclosed |