⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL715681 | 1.00 | — | — | |
| SCHEMBL10391969 | 1.00 | — | — | |
| SCHEMBL73746 | 1.00 | — | — | |
| SCHEMBL7104338 | 0.87 | — | — | |
| SCHEMBL18427899 | 0.87 | — | — | |
| SCHEMBL3444819 | 0.87 | — | — | |
| SCHEMBL996453 | 0.87 | — | — | |
| SCHEMBL9989320 | 0.87 | — | — | |
| SCHEMBL8201124 | 0.82 | — | — | |
| SCHEMBL16303 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 169 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12027419-B2 | Semiconductor device including liner structure | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED (TW) | 2024-07-02 | — | — | US | claimed |
| CN-118201478-A | Semiconductor device and method for manufacturing the same | 芯联集成电路制造股份有限公司 | 2024-06-14 | — | — | CN | claimed |
| CN-118098984-A | Semiconductor lead frame for automobile circuit board and preparation process thereof | 江苏恒盈电子科技有限公司 | 2024-05-28 | — | — | CN | claimed |
| CN-117820011-A | Multi-material photo-curing 3D printing integrated preparation method of titanium nitride silicon carbide heat absorption and storage heterogeneous ceramic framework | 华中科技大学 | 2024-04-05 | — | — | CN | claimed |
| CN-117255564-A | Spontaneous polarization memory cell and manufacturing method thereof | 温州核芯智存科技有限公司 | 2023-12-19 | — | — | CN | claimed |
| CN-116569342-A | Semiconductor chip, preparation method thereof and electronic equipment | 华为技术有限公司 | 2023-08-08 | — | — | CN | claimed |
| CN-116421062-A | Non-stick pan and manufacturing method thereof | 苏州家益厨具科技有限公司 | 2023-07-14 | — | — | CN | claimed |
| WO-2023102679-A1 | SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE | 华为技术有限公司 | 2023-06-15 | — | — | WO | claimed |
| CN-115332175-A | Semiconductor device and method for forming the same | 台湾积体电路制造股份有限公司 | 2022-11-11 | — | — | CN | claimed |
| CN-110838488-B | Semiconductor device and method for forming the same | 台湾积体电路制造股份有限公司 | 2022-04-26 | — | — | CN | claimed |
| CN-101807526-A | Method for adjusting Schottky barrier height of metal silicide source/drain | INST OF MICROELECTRONICS CAS | 2010-08-18 | — | — | CN | claimed |
| US-20080290337-A1 | Ultrathin Dielectrics and the Application Thereof in Organic Field Effect Transistors | QIMONDA AG (DE) | 2008-11-27 | — | — | US | claimed |
| US-7211520-B2 | Method for fabricating a field effect transistor | INFINEON TECHNOLOGIES AG (DE) | 2007-05-01 | — | — | US | claimed |
| US-20050189536-A1 | Self-assembly organic dielectric layers based on phosphonic acid derivatives | QIMONDA AG (DE) | 2005-09-01 | — | — | US | claimed |
| US-20050191801-A1 | Method for fabricating a field effect transistor | POLARIS INNOVATIONS LIMITED (IE) | 2005-09-01 | — | — | US | claimed |
| US-6800494-B1 | Method and apparatus for controlling copper barrier/seed deposition processes | ADVANCED MICRO DEVICES, INC. | 2004-10-05 | — | — | US | claimed |
| US-20040157392-A1 | CAPACITOR IN AN INTERCONNECT SYSTEM AND METHOD OF MANUFACTURING THEREOF | MARLIN SEMICONDUCTOR LIMITED (IE) | 2004-08-12 | — | — | US | claimed |
| US-6629879-B1 | Chemical mechanical polishing to remove layer of barrier metal from above insulating layer on wafer, irradiating at least one area of wafer with x-rays, analyzing x-rays leaving irradiated area to determine presence of barrier layer metal | ADVANCED MICRO DEVICES, INC. | 2003-10-07 | — | — | US | claimed |
| US-20030183509-A1 | METHOD FOR FORMING A SPUTTERED LAYER AND APPARATUS THEREFOR | FREESCALE SEMICONDUCTOR, INC. | 2003-10-02 | — | — | US | claimed |
| US-6620301-B1 | Method for forming a sputtered layer and apparatus therefor | MOTOROLA, INC. | 2003-09-16 | — | — | US | claimed |