SCHEMBL891995

SCHEMBL891995

CCCCOC(=O)C(C=CC#N)=CC=Cc1ccccc1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 3/20 0.55
TDP1 Q9NUW8 2/20 0.48
POLB P06746 1/20 0.47
MEN1 O00255 1/20 0.44
KMT2A Q03164 1/20 0.44
ALDH1A1 P00352 4/20 0.42
LMNA P02545 2/20 0.42
GAA P10253 1/20 0.42
MAPT P10636 1/20 0.42
APP P05067 1/20 0.41
TSHR P16473 1/20 0.41
L3MBTL1 Q9Y468 1/20 0.41
MCL1 Q07820 1/20 0.40
AKR1B10 O60218 1/20 0.40
AKR1B1 P15121 1/20 0.40
CYP3A4 P08684 1/20 0.39
CYP2D6 P10635 1/20 0.39
CYP2C9 P11712 1/20 0.39
CYP2C19 P33261 1/20 0.39
HPGD P15428 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9436335 0.91 KDM4E (0.50) KDM4ETDP1POLBMEN1KMT2A
SCHEMBL2244824 0.91 KDM4E (0.50) KDM4ETDP1POLBMEN1KMT2A
Butadiene SCHEMBL8384528 0.87 KDM4E (0.47) KDM4ETDP1POLBMEN1KMT2A
Styrene SCHEMBL251166 0.86 KDM4E (0.41) KDM4ETDP1POLBMEN1KMT2A
SCHEMBL7720506 0.85 ALDH1A1 (0.53) KDM4ETDP1POLBMEN1KMT2A
SCHEMBL3221254 0.84 KDM4E (0.57) KDM4ETDP1POLBMEN1KMT2A
Acrylonitrile SCHEMBL8680141 0.83 KDM4E (0.47) KDM4ETDP1POLBMEN1KMT2A
SCHEMBL2499451 0.82 HCAR2 (0.53) KDM4EALDH1A1MAPTAPPTSHR
SCHEMBL9547843 0.81 CASP1 (0.42) KDM4ETDP1MEN1KMT2AALDH1A1
SCHEMBL1234803 0.81 KDM4E (0.54) KDM4ETDP1POLBMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 57 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117042943-A Resin composition for cleaning 大赛璐美华株式会社 2023-11-10 CN claimed
EP-2158359-B1 LATEX-TREATED FILLER SLURRIES FOR USE IN PAPERMAKING FPINNOVATIONS (CA) 2013-09-04 EP claimed
US-8404084-B2 Latex-treated filler slurries for use in papermaking FPINNOVATIONS (CA) 2013-03-26 US claimed
US-8025768-B2 Latex-treated filler slurries for use in papermaking FPINNOVATIONS (CA) 2011-09-27 US claimed
EP-2158359-A1 LATEX-TREATED FILLER SLURRIES FOR USE IN PAPERMAKING FPInnovations (CA) 2010-03-03 EP claimed
WO-2008148204-A1 LATEX-TREATED FILLER SLURRIES FOR USE IN PAPERMAKING FPINNOVATIONS (CA) 2008-12-11 WO claimed
US-20080302496-A1 Latex-treated filler slurries for use in papermaking FPINNOVATIONS 2008-12-11 US claimed
CN-117042943-A Resin composition for cleaning 大赛璐美华株式会社 2023-11-10 CN disclosed
US-20230167610-A1 FIRE RETARDANT PAPER THERMAL CERAMICS, INC. (US) 2023-06-01 US disclosed
CN-111051486-B Resin composition for injection molding machine and mold cleaning agent 旭化成株式会社 2021-10-08 CN disclosed
EP-2516741-B2 ULTRA SMOOTH AND RECYCLABLE PRINTING SHEET AND ITS MANUFACTURING PROCESS AW BRANDING LTD (GB) 2021-05-12 EP disclosed
CN-111770749-A Adhesive composition and patch 积水化学工业株式会社 2020-10-13 CN disclosed
CN-111051486-A Resin composition for injection molding machine and mold cleaning agent 旭化成株式会社 2020-04-21 CN disclosed
US-6390538-B1 Impact absorbing member for vehicle interior KANEKA CORPORATION (JP) 2002-05-21 US disclosed
CN-1346386-A Polycarbonate-base flame-retardant resin composition ASAHI CHEMICAL IND (JP) 2002-04-24 CN disclosed
EP-1112406-A1 SPILL RESISTANT CARPET BACKING THE DOW CHEMICAL COMPANY (US) 2001-07-04 EP disclosed
WO-2001044336-A1 CARPET BACKING COMPOUNDS THICKENED BY HYDROPHOBICALLY-MODIFIED ETHYLENE-OXIDE-BASED URETHANE BLOCK COPOLYMERS DOW GLOBAL TECHNOLOGIES INC. (US) 2001-06-21 WO disclosed
WO-2001034689-A1 LOW ODOR FLOOR COVERING SYSTEM THE DOW CHEMICAL COMPANY (US) 2001-05-17 WO disclosed
WO-2000009798-A1 SPILL RESISTANT CARPET BACKING THE DOW CHEMICAL COMPANY (US) 2000-02-24 WO disclosed
CN-1145940-A Prodn of foamed waterproof heat-insulating material by using boiling furnace slag XU ZHENLIN (CN) 1997-03-26 CN disclosed