SCHEMBL893285

SCHEMBL893285

Cc1cc(C)cc(-c2cc(C)c(C(Cl)Cl)c(C)c2)c1

nearest known ligand 0.35

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.35
TSHR P16473 3/20 0.35
TP53 P04637 1/20 0.35
CYP3A4 P08684 1/20 0.35
TDP1 Q9NUW8 1/20 0.35
CA1 P00915 1/20 0.35
CA2 P00918 1/20 0.35
RXRA P19793 1/20 0.33
RXRB P28702 1/20 0.33
MEN1 O00255 1/20 0.31
KMT2A Q03164 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7705523 0.85 RAPGEF4 (0.39) ALDH1A1TSHRTP53TDP1CA1
SCHEMBL29613032 0.82 RAPGEF4 (0.38) ALDH1A1TSHR
SCHEMBL892896 0.76 ALDH1A1 (0.35) ALDH1A1TSHRTP53CYP3A4TDP1
SCHEMBL892873 0.76 CA1 (0.40) ALDH1A1TSHRTP53CYP3A4TDP1
SCHEMBL893006 0.76 ALDH1A1 (0.35) ALDH1A1TSHRTP53CYP3A4TDP1
SCHEMBL2531545 0.72 ALDH1A1 (0.53) ALDH1A1TSHRTP53CYP3A4TDP1
SCHEMBL28208954 0.69 ALDH1A1 (0.50) ALDH1A1TSHRTP53CYP3A4TDP1
Water SCHEMBL28158610 0.69 ALDH1A1 (0.50) ALDH1A1TSHRTP53CYP3A4TDP1
SCHEMBL15318953 0.69
SCHEMBL2848311 0.68 RAPGEF4 (0.43) ALDH1A1TSHRTP53TDP1CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8502399-B2 Resin composition for encapsulating semiconductor and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2013-08-06 US disclosed
US-20120080809-A1 RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2012-04-05 US disclosed
US-20080286688-A1 Photosensitive Resin Composition and Cured Product Thereof NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2008-11-20 US disclosed
EP-1710626-A1 PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCT THEREOF Nippon Kayaku Kabushiki Kaisha (JP) 2006-10-11 EP disclosed