SCHEMBL8945476

SCHEMBL8945476

C=Cc1ccccc1COCCCCCCCC

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
THRA P10827 1/20 0.40
THRB P10828 1/20 0.40
ALDH1A1 P00352 3/20 0.37
TSHR P16473 3/20 0.37
LMNA P02545 2/20 0.37
BCHE P06276 2/20 0.37
ACHE P22303 2/20 0.37
NR5A1 Q13285 1/20 0.37
LIPG Q9Y5X9 1/20 0.36
LTA4H P09960 1/20 0.36
CYP3A4 P08684 3/20 0.35
NPC1 O15118 1/20 0.35
RAB9A P51151 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.35
APAF1 O14727 1/20 0.35
RAD52 P43351 1/20 0.35
NPSR1 Q6W5P4 1/20 0.35
TP53 P04637 1/20 0.35
MAPK1 P28482 1/20 0.35
MEN1 O00255 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6678185 1.00 THRA (0.40) THRATHRBALDH1A1TSHRLMNA
SCHEMBL6675423 1.00 THRA (0.40) THRATHRBALDH1A1TSHRLMNA
SCHEMBL7061568 1.00 THRA (0.40) THRATHRBALDH1A1TSHRLMNA
SCHEMBL4895132 0.98 THRA (0.38) THRATHRBALDH1A1TSHRLMNA
SCHEMBL759640 0.94 ALDH1A1 (0.40) THRATHRBALDH1A1TSHRBCHE
SCHEMBL9193908 0.92 ALDH1A1 (0.36) ALDH1A1BCHEACHESMN1; SMN2MEN1
SCHEMBL9193381 0.92 ALDH1A1 (0.36) ALDH1A1BCHEACHESMN1; SMN2MEN1
SCHEMBL9544583 0.87 L3MBTL1 (0.35) THRATHRBALDH1A1BCHEACHE
SCHEMBL4906826 0.87 KDM4E (0.37) THRATHRBALDH1A1LMNANPC1
SCHEMBL8758517 0.87 THRA (0.34) THRATHRBALDH1A1TSHRLIPG

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5589312-A RESIN GRAINS FUJI PHOTO FILM CO., LTD. (JP) 1996-12-31 US claimed
US-20250154361-A1 RECESS FILLING MATERIAL KIT, CURED PRODUCT THEREOF, AND RECESS FILLING METHOD RESONAC CORPORATION (JP) 2025-05-15 US disclosed
CN-114685745-B Method for producing urethane (meth) acrylate and urethane (meth) acrylate resin 株式会社力森诺科 2024-09-17 CN disclosed
CN-114829432-B Radical polymerizable resin composition and cured product thereof 株式会社力森诺科 2024-09-17 CN disclosed
WO-2024142769-A1 RESIN COMPOSITION, COMPOSITE MATERIAL, AND CURED PRODUCTS OF THESE 株式会社レゾナック 2024-07-04 WO disclosed
CN-118255944-A Resin composition, composite material, and cured product thereof 株式会社力森诺科 2024-06-28 CN disclosed
CN-114846032-B Radical polymerizable resin composition and cured product thereof 株式会社力森诺科 2024-06-18 CN disclosed
CN-117813332-A Resin composition, method for producing same, and composite material 株式会社力森诺科 2024-04-02 CN disclosed
EP-4328206-A1 RECESS FILLING MATERIAL KIT, CURED PRODUCT OF SAME, AND RECESS FILLING METHOD Resonac Corporation (JP) 2024-02-28 EP disclosed
CN-110799558-B Radical polymerizable resin composition and structural repair material 株式会社力森诺科 2024-02-20 CN disclosed
CN-117136175-A Recess filling material kit, cured product thereof, and recess filling method 株式会社力森诺科 2023-11-28 CN disclosed
CN-116917249-A Recess filling material kit, cured product thereof, and recess filling method 株式会社力森诺科 2023-10-20 CN disclosed
EP-3533809-B1 RADICAL-POLYMERIZABLE RESIN COMPOSITION SHOWA DENKO KK (JP) 2021-09-29 EP disclosed
EP-3533809-A1 RADICAL-POLYMERIZABLE RESIN COMPOSITION Showa Denko K.K. (JP) 2019-09-04 EP disclosed
EP-3228637-B1 RADICAL-POLYMERIZABLE RESIN COMPOSITION, CURING METHOD THEREOF, METHOD OF PRODUCING SAME, USE OF RADICAL-POLYMERIZABLE RESIN COMPOSITION, AND USE METHOD OF THEREOF SHOWA DENKO KK (JP) 2019-02-20 EP disclosed
US-9969836-B2 Radical-polymerizable resin composition, curing method thereof, method of producing same, use of radical-polymerizable resin composition, and use method of thereof SHOWA DENKO K.K. (JP) 2018-05-15 US disclosed
US-20180009926-A1 RADICAL-POLYMERIZABLE RESIN COMPOSITION, CURING METHOD THEREOF, METHOD OF PRODUCING SAME, USE OF RADICAL-POLYMERIZABLE RESIN COMPOSITION, AND USE METHOD OF THEREOF SHOWA DENKO K.K. (JP) 2018-01-11 US disclosed
EP-3228637-A1 RADICAL-POLYMERIZABLE RESIN COMPOSITION, CURING METHOD THEREOF, METHOD OF PRODUCING SAME, USE OF RADICAL-POLYMERIZABLE RESIN COMPOSITION, AND USE METHOD OF THEREOF Showa Denko K.K. (JP) 2017-10-11 EP disclosed
US-5589312-A RESIN GRAINS FUJI PHOTO FILM CO., LTD. (JP) 1996-12-31 US disclosed