SCHEMBL8946209

SCHEMBL8946209

CC(C)=C=C(c1ccccc1)c1ccccc1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.43
CES2 O00748 3/20 0.42
CES1 P23141 3/20 0.42
ELANE P08246 2/20 0.39
L3MBTL1 Q9Y468 4/20 0.38
TSHR P16473 3/20 0.38
DAO P14920 1/20 0.38
NAPRT Q6XQN6 1/20 0.38
TDP1 Q9NUW8 2/20 0.37
ATM Q13315 1/20 0.37
SRD5A2 P31213 1/20 0.37
ESR1 P03372 1/20 0.37
MAPT P10636 2/20 0.36
NPC1 O15118 1/20 0.35
HPGD P15428 1/20 0.35
RAB9A P51151 1/20 0.35
LMNA P02545 1/20 0.35
MAPK1 P28482 1/20 0.35
HTT P42858 1/20 0.35
F2 P00734 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2181511 0.83 ALDH1A1 (0.53) ALDH1A1CES2CES1L3MBTL1TSHR
SCHEMBL2697367 0.74 ALDH1A1 (0.43) ALDH1A1CES2CES1L3MBTL1TSHR
SCHEMBL13908823 0.73 ELANE (0.39) ALDH1A1CES2CES1ELANETSHR
SCHEMBL3841892 0.72 CES1 (0.41) ALDH1A1CES2CES1L3MBTL1TSHR
SCHEMBL28883973 0.72 ALDH1A1 (0.42) ALDH1A1CES2CES1L3MBTL1TSHR
SCHEMBL7136968 0.71 CES1 (0.45) ALDH1A1CES2CES1L3MBTL1TSHR
SCHEMBL22151219 0.70 ALDH1A1 (0.40) ALDH1A1CES2CES1L3MBTL1TSHR
SCHEMBL27296006 0.69 CES1 (0.48) ALDH1A1CES2CES1ELANEL3MBTL1
SCHEMBL1035354 0.67 ESR1 (0.56) ALDH1A1CES2CES1L3MBTL1TSHR
SCHEMBL10877617 0.67 CES2 (0.52) ALDH1A1CES2CES1L3MBTL1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5496910-A BIODEGRADABLE THE DOW CHEMICAL COMPANY (US) 1996-03-05 US claimed
CN-103907183-B The purposes repelling material protection fabrication region is used in semiconductor fab 汉高知识产权控股有限责任公司 2016-08-31 CN disclosed