SCHEMBL8957989

SCHEMBL8957989

Cc1ccccc1C(C)c1nc2ccccc2[nH]1

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.53
POLB P06746 2/20 0.53
IDO1 P14902 1/20 0.53
TAAR1 Q96RJ0 1/20 0.51
MLKL Q8NB16 3/20 0.50
SMN1; SMN2 Q16637 3/20 0.49
NPSR1 Q6W5P4 3/20 0.49
NPC1 O15118 2/20 0.49
HTT P42858 2/20 0.49
RAB9A P51151 2/20 0.49
HPGD P15428 1/20 0.49
KMT2A Q03164 3/20 0.46
ALOX12 P18054 1/20 0.46
MAPK1 P28482 2/20 0.45
ALPL P05186 2/20 0.45
TP53 P04637 2/20 0.44
CYP2D6 P10635 1/20 0.44
CYP2C9 P11712 1/20 0.44
CYP2C19 P33261 1/20 0.44
MEN1 O00255 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8974002 0.85 CYP1A2 (0.46) ALDH1A1POLBIDO1TAAR1MLKL
SCHEMBL2147079 0.84 ALDH1A1 (0.66) ALDH1A1POLBIDO1TAAR1MLKL
SCHEMBL8027030 0.81 ADRA2A (0.57) ALDH1A1POLBIDO1TAAR1MLKL
SCHEMBL3397595 0.78 ALPL (0.58) ALDH1A1POLBIDO1TAAR1MLKL
SCHEMBL16756243 0.78 ALPL (0.58) ALDH1A1POLBIDO1TAAR1MLKL
SCHEMBL16756501 0.78 ALPL (0.58) ALDH1A1POLBIDO1TAAR1MLKL
SCHEMBL30665026 0.77 ALDH1A1 (0.66) ALDH1A1POLBIDO1TAAR1MLKL
SCHEMBL85832 0.77 ALDH1A1 (0.66) ALDH1A1POLBIDO1TAAR1MLKL
SCHEMBL23181664 0.74 POLB (0.61) ALDH1A1POLBIDO1TAAR1MLKL
SCHEMBL22761575 0.74 POLB (0.61) ALDH1A1POLBIDO1TAAR1MLKL

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 EP disclosed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 US disclosed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 EP disclosed