SCHEMBL8957993

SCHEMBL8957993

Cc1ccccc1CCc1nc2ccccc2[nH]1

nearest known ligand 0.67

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
GAA P10253 2/20 0.67
MEN1 O00255 1/20 0.67
ALDH1A1 P00352 1/20 0.67
THRB P10828 1/20 0.67
KMT2A Q03164 1/20 0.67
L3MBTL1 Q9Y468 1/20 0.67
POLB P06746 1/20 0.62
PDE10A Q9Y233 2/20 0.61
NPC1 O15118 2/20 0.61
RAB9A P51151 2/20 0.61
EGFR P00533 1/20 0.60
DDAH1 O94760 1/20 0.57
CHRM1 P11229 1/20 0.53
MAPT P10636 1/20 0.52

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8918743 0.87 ATP4A (0.58) GAAMEN1ALDH1A1THRBKMT2A
SCHEMBL4119398 0.85 EGFR (0.74) GAAMEN1ALDH1A1THRBKMT2A
SCHEMBL8974006 0.85 KMT2A (0.55) GAAMEN1ALDH1A1THRBKMT2A
SCHEMBL8974008 0.85 KMT2A (0.72) GAAMEN1ALDH1A1THRBKMT2A
SCHEMBL230157 0.84 POLB (0.84) GAAPOLBPDE10ANPC1RAB9A
SCHEMBL30702409 0.79 MEN1 (0.68) MEN1KMT2APOLBPDE10ANPC1
SCHEMBL8027033 0.79 MEN1 (0.68) MEN1KMT2APOLBPDE10ANPC1
SCHEMBL6368172 0.78 EGFR (0.65) GAAMEN1ALDH1A1THRBKMT2A
SCHEMBL29749508 0.78 DDAH1 (0.72) GAAPOLBPDE10ANPC1RAB9A
SCHEMBL612507 0.78 DDAH1 (0.72) GAAPOLBPDE10ANPC1RAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 EP disclosed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 US disclosed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 EP disclosed