SCHEMBL8959953

SCHEMBL8959953

C=Cc1occ2ccccc12

nearest known ligand 0.35

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.35
HSD17B10 Q99714 3/20 0.35
TSHR P16473 2/20 0.35
CYP2A6 P11509 1/20 0.35
TDP1 Q9NUW8 1/20 0.35
HPRT1 P00492 1/20 0.32
POLB P06746 2/20 0.32
PTPN1 P18031 2/20 0.32
MEN1 O00255 1/20 0.32
KMT2A Q03164 1/20 0.32
HIF1A Q16665 1/20 0.30
CYP1B1 Q16678 1/20 0.30
CYP1A2 P05177 1/20 0.30
THRB P10828 1/20 0.30
HPGD P15428 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL98430 0.78 PTPN1 (0.42) ALDH1A1HSD17B10TSHRCYP2A6TDP1
SCHEMBL533465 0.74 ALDH1A1 (0.44) ALDH1A1TSHRTDP1POLBMEN1
SCHEMBL31115085 0.71 ENPP3 (0.30)
SCHEMBL31115086 0.71 ENPP3 (0.30)
SCHEMBL719864 0.70 ALDH1A1 (0.39) ALDH1A1HSD17B10TSHRCYP2A6TDP1
SCHEMBL7618050 0.70 HCAR2 (0.46) POLBKMT2ACYP1B1HPGD
SCHEMBL707534 0.69 KMT2A (0.53) MEN1KMT2ACYP1B1
SCHEMBL23388532 0.66 ALDH1A1 (0.43) ALDH1A1TSHRTDP1MEN1KMT2A
SCHEMBL4079696 0.65 CYP2A6 (0.42) ALDH1A1HSD17B10TSHRCYP2A6TDP1
SCHEMBL286416 0.65 ALDH1A1 (0.39) ALDH1A1HSD17B10TSHRCYP2A6TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118159576-A Copolymer emulsion, and one-part thermosetting resin composition, two-part thermosetting resin composition, paint, resin cured film, and coating film using the copolymer emulsion 株式会社力森诺科 2024-06-07 CN disclosed
WO-2023085154-A1 COPOLYMER EMULSION, AND ONE-PACK TYPE THERMOSETTING RESIN COMPOSITION, TWO-PACK TYPE THERMOSETTING RESIN COMPOSITION, COATING MATERIAL, RESIN CURED FILM AND COATING FILM EACH USING SAID COPOLYMER EMULSION 株式会社レゾナック 2023-05-19 WO disclosed
US-20100247938-A1 MATERIAL FOR THREE-DIMENSIONAL MODELING, PROCESS FOR PRODUCING THREE-DIMENSIONAL MODEL, AND THREE-DIMENSIONAL MODEL FUJIFILM CORPORATION (JP) 2010-09-30 US disclosed
US-20100247938-A1 MATERIAL FOR THREE-DIMENSIONAL MODELING, PROCESS FOR PRODUCING THREE-DIMENSIONAL MODEL, AND THREE-DIMENSIONAL MODEL FUJIFILM CORPORATION (JP) 2010-09-30 US disclosed
US-5510456-A Bridged cyclic arleneethylene polymers SHOWA DENKO K. K. (JP) 1996-04-23 US disclosed