SCHEMBL896676

SCHEMBL896676

CC(=O)OCC(C)OCC(C)OCC(C)Oc1ccccc1

nearest known ligand 0.53

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
MTNR1A P48039 8/20 0.53
MTNR1B P49286 8/20 0.53
ALDH1A1 P00352 3/20 0.42
MAPT P10636 1/20 0.40
TSHR P16473 2/20 0.40
MAPK1 P28482 1/20 0.39
TDP1 Q9NUW8 1/20 0.39
HPGD P15428 1/20 0.39
GAA P10253 2/20 0.39
LMNA P02545 1/20 0.39
CYP1A2 P05177 1/20 0.38
CYP2C9 P11712 1/20 0.38
PKM P14618 1/20 0.38
CYP2C19 P33261 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL896832 1.00 MTNR1A (0.53) MTNR1AMTNR1BALDH1A1MAPTTSHR
SCHEMBL9713748 0.88 MTNR1A (0.53) MTNR1AMTNR1BALDH1A1MAPTMAPK1
SCHEMBL9713753 0.88 MTNR1A (0.53) MTNR1AMTNR1BALDH1A1MAPTMAPK1
SCHEMBL12971188 0.85 ALDH1A1 (0.53) MTNR1AMTNR1BALDH1A1MAPTTSHR
SCHEMBL6560469 0.85 MTNR1A (0.47) MTNR1AMTNR1BALDH1A1MAPTTSHR
SCHEMBL11752040 0.84 MAPT (0.57) MTNR1AMTNR1BMAPTGAACYP1A2
SCHEMBL12971076 0.84 MTNR1A (0.47) MTNR1AMTNR1BALDH1A1MAPTTSHR
SCHEMBL28494284 0.82 MTNR1A (0.44) MTNR1AMTNR1BALDH1A1MAPTTSHR
SCHEMBL17459127 0.81 ALDH1A1 (0.59) ALDH1A1MAPTTSHRMAPK1TDP1
SCHEMBL19726534 0.80 MTNR1A (0.54) MTNR1AMTNR1BALDH1A1MAPTTSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250215318-A1 ETCHING COMPOSITION, ETCHING METHOD USING SAME, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT TOKYO OHKA KOGYO CO., LTD. (JP) 2025-07-03 US disclosed
EP-3961676-B1 ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2025-01-22 EP disclosed
WO-2023204141-A1 ETCHING COMPOSITION, ETCHING METHOD USING SAME, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT 東京応化工業株式会社 2023-10-26 WO disclosed
EP-3702387-B1 PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR ETCHING GLASS SUBSTRATE TOKYO OHKA KOGYO CO LTD (JP) 2023-05-10 EP disclosed
EP-3961676-A1 ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2022-03-02 EP disclosed
CN-111624852-A Photosensitive resin composition and method for etching glass substrate 东京应化工业株式会社 2020-09-04 CN disclosed
EP-3702387-A1 PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR ETCHING GLASS SUBSTRATE TOKYO OHKA KOGYO CO., LTD. (JP) 2020-09-02 EP disclosed
US-20120082791-A1 Coating Composition Amenable to Elastomeric Substrates LIVERSAGE ROBERT RICHARD (US) 2012-04-05 US disclosed
US-20090026425-A1 COMPOSITION COMPRISING POLYESTER AMIDE ACID AND THE LIKE AND INK-JET INK COMPOSITION USING THE SAME CHISSO CORPORATION (JP) 2009-01-29 US disclosed