Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GAA | P10253 | 1/20 | 0.44 |
| ▸ | ACHE | P22303 | 1/20 | 0.41 |
| ▸ | TP53 | P04637 | 1/20 | 0.38 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.38 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.38 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.38 |
| ▸ | L3MBTL1 | Q9Y468 | 5/20 | 0.37 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.37 |
| ▸ | NPC1 | O15118 | 1/20 | 0.37 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.37 |
| ▸ | RAB9A | P51151 | 1/20 | 0.37 |
| ▸ | NFKB2 | Q00653 | 1/20 | 0.37 |
| ▸ | RELA | Q04206 | 1/20 | 0.37 |
| ▸ | MAPT | P10636 | 1/20 | 0.36 |
| ▸ | HTR1A | P08908 | 2/20 | 0.36 |
| ▸ | MEN1 | O00255 | 2/20 | 0.35 |
| ▸ | HPGD | P15428 | 2/20 | 0.35 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.35 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29489134 | 1.00 | GAA (0.44) | GAAACHETP53TDP1SMN1; SMN2 | |
| SCHEMBL11033634 | 0.83 | ALDH1A1 (0.38) | GAATDP1ALDH1A1CYP3A4KMT2A | |
| SCHEMBL11108932 | 0.83 | TSHR (0.44) | GAAACHETDP1SMN1; SMN2ALDH1A1 | |
| SCHEMBL11338994 | 0.81 | AR (0.34) | GAAMAPTARCA1CA2 | |
| SCHEMBL9419423 | 0.79 | ALDH1A1 (0.39) | TP53TDP1SMN1; SMN2ALDH1A1L3MBTL1 | |
| SCHEMBL3419472 | 0.79 | AR (0.41) | SMN1; SMN2L3MBTL1KMT2AMAPTMEN1 | |
| SCHEMBL21439789 | 0.79 | ACHE (0.43) | GAAACHETP53TDP1SMN1; SMN2 | |
| SCHEMBL9348336 | 0.79 | TSHR (0.45) | GAATP53SMN1; SMN2ALDH1A1CYP3A4 | |
| SCHEMBL9419412 | 0.79 | CYP1A2 (0.45) | GAAACHETDP1SMN1; SMN2ALDH1A1 | |
| SCHEMBL16707442 | 0.79 | TAAR1 (0.30) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 90 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-101910308-B | Curing composition and cured product prepared by using the same | LG CHEMICAL LTD | 2012-11-21 | — | — | CN | claimed |
| CN-101910308-A | Curing composition and cured product prepared by using the same | LG CHEMICAL LTD | 2010-12-08 | — | — | CN | claimed |
| CN-118251445-A | Cyclic organosiloxane containing imide bond and polymerizable unsaturated bond and curable resin composition containing the same | 信越化学工业株式会社 | 2024-06-25 | — | — | CN | disclosed |
| CN-118043384-A | Prepreg, laminate and printed circuit board | 三菱瓦斯化学株式会社 | 2024-05-14 | — | — | CN | disclosed |
| CN-112236464-B | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2024-02-23 | — | — | CN | disclosed |
| CN-117529509-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-02-06 | — | — | CN | disclosed |
| CN-117500851-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-02-02 | — | — | CN | disclosed |
| CN-117500850-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-02-02 | — | — | CN | disclosed |
| CN-117355545-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-01-05 | — | — | CN | disclosed |
| CN-117222682-A | Cured resin composition and cured product thereof | 日本化药株式会社 | 2023-12-12 | — | — | CN | disclosed |
| CN-116940617-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 日本化药株式会社 | 2023-10-24 | — | — | CN | disclosed |
| CN-1726259-A | Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same | KANEGAFUCHI CHEMICAL IND (JP) | 2006-01-25 | — | — | CN | disclosed |
| CN-1464898-A | Resin composition | KANEGAFUCHI CHEMICAL IND (JP) | 2003-12-31 | — | — | CN | disclosed |
| CN-1379800-A | Cyanate ester based thermoset compositions | GEN ELECTRIC (US) | 2002-11-13 | — | — | CN | disclosed |
| CN-1229817-A | Cyanate ester based thermoset compositions | GEN ELECTRIC (US) | 1999-09-29 | — | — | CN | disclosed |
| EP-0476589-B1 | Multi-layer wiring substrate and production thereof | HITACHI LTD (JP) | 1996-06-12 | — | — | EP | disclosed |
| EP-0271833-B1 | Process for the preparation of aminopyrimidines | HOECHST SCHERING AGREVO GMBH (DE) | 1994-09-07 | — | — | EP | disclosed |
| EP-0476589-A2 | Multi-layer wiring substrate and production thereof | HITACHI, LTD. (JP) | 1992-03-25 | — | — | EP | disclosed |
| US-4831138-A | FROM PROPANEDIIMIDATES DERIVATIVES AND CYANURATES | HOECHST AKTIENGESELLSCHAFT (DE) | 1989-05-16 | — | — | US | disclosed |
| EP-0271833-A2 | Process for the preparation of aminopyrimidines | Hoechst Schering AgrEvo GmbH (DE) | 1988-06-22 | — | — | EP | disclosed |