Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HSD17B1 | P14061 | 1/20 | 0.50 |
| ▸ | HSD17B2 | P37059 | 1/20 | 0.50 |
| ▸ | KMT2A | Q03164 | 7/20 | 0.47 |
| ▸ | MEN1 | O00255 | 6/20 | 0.47 |
| ▸ | KDM4E | B2RXH2 | 5/20 | 0.47 |
| ▸ | MAPT | P10636 | 3/20 | 0.47 |
| ▸ | LMNA | P02545 | 2/20 | 0.47 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.47 |
| ▸ | SREBF2 | Q12772 | 1/20 | 0.47 |
| ▸ | AR | P10275 | 1/20 | 0.45 |
| ▸ | RAB9A | P51151 | 4/20 | 0.45 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.45 |
| ▸ | NPC1 | O15118 | 3/20 | 0.45 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.44 |
| ▸ | HPGD | P15428 | 3/20 | 0.44 |
| ▸ | STAT1 | P42224 | 1/20 | 0.44 |
| ▸ | GFER | P55789 | 1/20 | 0.44 |
| ▸ | POLB | P06746 | 1/20 | 0.43 |
| ▸ | GAA | P10253 | 1/20 | 0.43 |
| ▸ | PKM | P14618 | 1/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11507047 | 0.82 | HSD17B1 (0.49) | HSD17B1HSD17B2KMT2AMEN1KDM4E | |
| SCHEMBL3424409 | 0.75 | HSD17B1 (0.58) | HSD17B1HSD17B2KMT2AMEN1KDM4E | |
| SCHEMBL1858562 | 0.73 | EIF4E (0.61) | HSD17B1HSD17B2KMT2AMEN1KDM4E | |
| SCHEMBL11213828 | 0.70 | SREBF2 (0.82) | KMT2AMEN1KDM4EMAPTLMNA | |
| SCHEMBL11215130 | 0.70 | SREBF2 (0.82) | KMT2AMEN1KDM4EMAPTLMNA | |
| SCHEMBL11212983 | 0.70 | SREBF2 (0.82) | KMT2AMEN1KDM4EMAPTLMNA | |
| SCHEMBL1180965 | 0.70 | HSD17B1 (0.84) | HSD17B1HSD17B2KMT2AMEN1KDM4E | |
| SCHEMBL3605142 | 0.70 | CDC25A (0.69) | KMT2AMEN1KDM4EMAPTLMNA | |
| SCHEMBL11614949 | 0.69 | MEN1 (0.60) | KMT2AMEN1KDM4EMAPTLMNA | |
| SCHEMBL11464717 | 0.69 | SREBF2 (0.79) | KMT2AMEN1KDM4EMAPTLMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0202498-B1 | USE OF A THERMO-SETTING, POLYMERIZABLE COMPOSITION AND WIRING BOARD | HITACHI, LTD. (JP) | 1990-07-11 | — | — | EP | claimed |
| US-4738900-A | HEAT RESISTANT DIELECTRIC LAYER OF A POLYMER OF AN AROMATIC DIMALEIMIDE AND AN AROMATIC DICYANAMIDE | HITACHI, LTD. (JP) | 1988-04-19 | — | — | US | claimed |
| EP-0202498-A2 | Use of a thermo-setting, polymerizable composition and wiring board | HITACHI, LTD. (JP) | 1986-11-26 | — | — | EP | claimed |
| US-4546168-A | POLYMERIZABLE EPOXY COMPOUNDS, PHENOLIC COMPOUNDS, AND TRIALLYL ISOCYANURATE COMPOUNDS | HITACHI, LTD. (JP) | 1985-10-08 | — | — | US | claimed |
| US-4486583-A | MOLDING MATERIALS, COATINGS | HITACHI, LTD. (JP) | 1984-12-04 | — | — | US | claimed |
| US-4482703-A | Thermosetting resin composition comprising dicyanamide and polyvalent imide | HITACHI, LTD. (JP) | 1984-11-13 | — | — | US | claimed |
| EP-0476589-B1 | Multi-layer wiring substrate and production thereof | HITACHI LTD (JP) | 1996-06-12 | — | — | EP | disclosed |
| EP-0476589-A2 | Multi-layer wiring substrate and production thereof | HITACHI, LTD. (JP) | 1992-03-25 | — | — | EP | disclosed |
| EP-0153603-B1 | THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRODUCTION OF CURED PRODUCT | HITACHI, LTD. (JP) | 1992-01-02 | — | — | EP | disclosed |
| EP-0102052-B1 | HEAT-RESISTANT RESIN, THERMOSETTING COMPOSITION AFFORDING THE SAME AND PREPOLYMER THEREOF | HITACHI, LTD. (JP) | 1990-10-31 | — | — | EP | disclosed |
| US-4738900-A | HEAT RESISTANT DIELECTRIC LAYER OF A POLYMER OF AN AROMATIC DIMALEIMIDE AND AN AROMATIC DICYANAMIDE | HITACHI, LTD. (JP) | 1988-04-19 | — | — | US | disclosed |
| EP-0202498-A2 | Use of a thermo-setting, polymerizable composition and wiring board | HITACHI, LTD. (JP) | 1986-11-26 | — | — | EP | disclosed |
| US-4607094-A | Thermosetting resin composition from aromatic cyanamide | HITACHI, LTD. (JP) | 1986-08-19 | — | — | US | disclosed |
| US-4546168-A | POLYMERIZABLE EPOXY COMPOUNDS, PHENOLIC COMPOUNDS, AND TRIALLYL ISOCYANURATE COMPOUNDS | HITACHI, LTD. (JP) | 1985-10-08 | — | — | US | disclosed |
| EP-0153603-A2 | Thermosetting resin composition, cured product, and production of cured product | HITACHI, LTD. (JP) | 1985-09-04 | — | — | EP | disclosed |
| US-4486583-A | MOLDING MATERIALS, COATINGS | HITACHI, LTD. (JP) | 1984-12-04 | — | — | US | disclosed |
| US-4482703-A | Thermosetting resin composition comprising dicyanamide and polyvalent imide | HITACHI, LTD. (JP) | 1984-11-13 | — | — | US | disclosed |
| EP-0123262-A2 | Resin encapsulated semiconductor device and process for producing the same | HITACHI, LTD. (JP) | 1984-10-31 | — | — | EP | disclosed |
| EP-0078039-A1 | Thermosetting resin composition, prepolymer thereof and cured article thereof | Hitachi, Ltd. (JP) | 1983-05-04 | — | — | EP | disclosed |