SCHEMBL899404

SCHEMBL899404

OCC1CCC(CO)C2CCCCC12

nearest known ligand 0.39

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.39
PABPC1 P11940 1/20 0.35
APOBEC3A P31941 1/20 0.35
APOBEC3G Q9HC16 1/20 0.35
GBA1 P04062 1/20 0.33
TSHR P16473 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL821002 0.88 TDP1 (0.39) TDP1PABPC1APOBEC3AAPOBEC3G
SCHEMBL2517322 0.80
SCHEMBL13021351 0.78 CYP1A2 (0.44) TDP1PABPC1APOBEC3AAPOBEC3G
SCHEMBL7735125 0.78 CYP1A2 (0.49) TDP1PABPC1APOBEC3AAPOBEC3G
SCHEMBL11114570 0.78 CYP1A2 (0.41) TDP1
SCHEMBL2379725 0.78 CYP1A2 (0.49) TDP1PABPC1APOBEC3AAPOBEC3G
SCHEMBL130804 0.76 TDP1 (0.50) TDP1PABPC1APOBEC3AAPOBEC3GGBA1
SCHEMBL44781 0.76 TDP1 (0.50) TDP1PABPC1APOBEC3AAPOBEC3GGBA1
SCHEMBL130805 0.76 TDP1 (0.50) TDP1PABPC1APOBEC3AAPOBEC3GGBA1
SCHEMBL129425 0.76 TDP1 (0.50) TDP1PABPC1APOBEC3AAPOBEC3GGBA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 170 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-1999061506-A1 THERMOSETTING COATING COMPOSITIONS BASED ON POLYESTERS EASTMAN CHEMICAL COMPANY (US) 1999-12-02 WO claimed
CN-118829690-A Polyethylene terephthalate resin composition and molded article 三菱化学株式会社 2024-10-22 CN disclosed
WO-2024135265-A1 POLYESTER RESIN, RESIN COMPOSITION FOR COSMETIC CONTAINER, MOLDED ARTICLE, AND COSMETIC CONTAINER 三菱瓦斯化学株式会社 2024-06-27 WO disclosed
US-11951720-B2 Thermoplastic resin laminate MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-04-09 US disclosed
CN-117203260-A Polyester resin 三菱瓦斯化学株式会社 2023-12-08 CN disclosed
WO-2023233984-A1 RESIN COMPOSITION 三菱瓦斯化学株式会社 2023-12-07 WO disclosed
EP-3778772-B1 POLYESTER RESIN COMPOSITION MITSUBISHI GAS CHEMICAL CO (JP) 2023-11-29 EP disclosed
CN-115551942-B Resin composition, and optical lens and optical film containing the same 三菱瓦斯化学株式会社 2023-11-10 CN disclosed
WO-2023171754-A1 POLYETHYLENE TEREPHTHALATE RESIN COMPOSITION AND MOLDED ARTICLE 三菱ケミカル株式会社 2023-09-14 WO disclosed
EP-4001343-B1 POLYESTER RESIN, AND MOLDED ARTICLE, STRETCHED FILM AND BOTTLE COMPRISING THE SAME MITSUBISHI GAS CHEMICAL CO (JP) 2023-07-05 EP disclosed
US-20020010309-A1 Polyester resin and molded article MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2002-01-24 US disclosed
EP-1164155-A1 Polyester resin and molded article MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2001-12-19 EP disclosed
WO-1999061506-A1 THERMOSETTING COATING COMPOSITIONS BASED ON POLYESTERS EASTMAN CHEMICAL COMPANY (US) 1999-12-02 WO disclosed
EP-0197458-B1 CURABLE EPOXY RESIN COMPOSITION ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 1991-11-06 EP disclosed
US-4689390-A AMINE-EPOXY ADDUCT REACTED WITH PHENOLIC RESIN, ONE-PACK ASAHI DENKA KOGYO K.K. (JP) 1987-08-25 US disclosed
US-4657953-A CORROSION RESISTANCE ASAHI DENKA KOGYO K.K. (JP) 1987-04-14 US disclosed
EP-0197458-A2 Curable epoxy resin composition ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 1986-10-15 EP disclosed
US-4535103-A POLYEPOXIDES AND EPOXY RESINS CROSSLINKED AND HARDENED WITH PHOSPHOROUS COMPOUNDS, AMINES, AND DIISOCYANATES ASAHI DENKA KOGYO K.K. (JP) 1985-08-13 US disclosed
US-4340716-A EPOXY RESINS AND HARDENERS ASAHI DENKA KOGYO K.K. (JP) 1982-07-20 US disclosed
US-3950451-A COUPLED PRODUCT OF ALKYLPHENOL AND PHENOL-FORMALDEHYDE-DIAMINE CONDENSATE ASAHI DENKA KOGYO K.K. (JA) 1976-04-13 US disclosed