SCHEMBL900460

SCHEMBL900460

c1cc(C2CC3CCC2C3)ccc1C1CC2CCC1C2

nearest known ligand 0.66

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.66
POLB P06746 1/20 0.66
GAA P10253 1/20 0.66
KMT2A Q03164 1/20 0.66
SLC6A3 Q01959 8/20 0.46
SLC6A4 P31645 6/20 0.40
L3MBTL1 Q9Y468 1/20 0.34
JAK2 O60674 2/20 0.34
JAK1 P23458 2/20 0.34
TYK2 P29597 2/20 0.34
JAK3 P52333 2/20 0.34
KDM1A O60341 4/20 0.33
MAOB P27338 2/20 0.33
RCOR1 Q9UKL0 2/20 0.33
KCNH2 Q12809 1/20 0.33
KDM1B Q8NB78 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21409728 0.89 MEN1 (0.56) MEN1POLBGAAKMT2ASLC6A3
SCHEMBL23338337 0.89 POLB (0.56) MEN1POLBGAAKMT2ASLC6A3
SCHEMBL3049400 0.89 GAA (0.66) MEN1POLBGAAKMT2ASLC6A3
SCHEMBL25171587 0.89 MEN1 (0.56) MEN1POLBGAAKMT2ASLC6A3
SCHEMBL8673153 0.89 SLC6A3 (0.57) MEN1POLBGAAKMT2ASLC6A3
SCHEMBL6053773 0.89 SLC6A3 (0.57) MEN1POLBGAAKMT2ASLC6A3
SCHEMBL10604179 0.85 MEN1 (0.51) MEN1POLBGAAKMT2ASLC6A3
SCHEMBL548017 0.85 MEN1 (0.51) MEN1POLBGAAKMT2ASLC6A3
SCHEMBL3686002 0.84 KDM1A (0.55) MEN1POLBGAAKMT2ASLC6A3
SCHEMBL23338365 0.84 MEN1 (0.51) MEN1POLBGAAKMT2ASLC6A3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250189891-A1 POLYIMIDE RESIN PRECURSOR TOKYO OHKA KOGYO CO., LTD. (JP) 2025-06-12 US disclosed
US-20250004372-A1 BLOCK COPOLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2025-01-02 US disclosed
CN-118900872-A Polyimide resin precursor 东京应化工业株式会社 2024-11-05 CN disclosed
WO-2023233896-A1 PHOTOSENSITIVE RESIN COMPOSITION 東京応化工業株式会社 2023-12-07 WO disclosed
WO-2023233895-A1 POLYIMIDE RESIN PRECURSOR 東京応化工業株式会社 2023-12-07 WO disclosed
WO-2023176172-A1 POLYIMIDE RESIN PRECURSOR 東京応化工業株式会社 2023-09-21 WO disclosed
WO-2023058385-A1 BLOCK COPOLYMER 東京応化工業株式会社 2023-04-13 WO disclosed
CN-115542668-A Photosensitive resin composition 东京应化工业株式会社 2022-12-30 CN disclosed
EP-2622410-A1 NORBORNANE-BASED PAC BALLAST AND POSITIVE-TONE PHOTOSENSITIVE RESIN COMPOSITION ENCOMPASSING THE PAC Promerus, LLC (US) 2013-08-07 EP disclosed
WO-2012044719-A1 NORBORNANE-BASED PAC BALLAST AND POSITIVE-TONE PHOTOSENSITIVE RESIN COMPOSITION ENCOMPASSING THE PAC PROMERUS LLC (US) 2012-04-05 WO disclosed