SCHEMBL9013586

SCHEMBL9013586

CC(=Cc1ccccc1)c1cccc(N)c1N

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
BRD4 O60885 1/20 0.43
CREBBP Q92793 1/20 0.43
MAPT P10636 2/20 0.41
ALDH1A1 P00352 3/20 0.40
TSHR P16473 1/20 0.40
AKR1C3 P42330 1/20 0.40
KDM1A O60341 1/20 0.39
NISCH Q9Y2I1 1/20 0.38
FBP1 P09467 1/20 0.37
CD44 P16070 1/20 0.36
DHODH Q02127 1/20 0.36
TRPM8 Q7Z2W7 1/20 0.36
L3MBTL1 Q9Y468 1/20 0.36
GAA P10253 1/20 0.35
MMP2 P08253 1/20 0.35
RECQL P46063 1/20 0.35
MEN1 O00255 1/20 0.35
KMT2A Q03164 1/20 0.35
KDM4E B2RXH2 1/20 0.35
CFTR P13569 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21808158 0.87 MAPT (0.49) BRD4CREBBPMAPTALDH1A1TSHR
SCHEMBL21808157 0.87 MAPT (0.49) BRD4CREBBPMAPTALDH1A1TSHR
SCHEMBL7715071 0.80 TSHR (0.52) BRD4CREBBPALDH1A1TSHRAKR1C3
SCHEMBL11203024 0.73 MAPT (0.47) BRD4CREBBPMAPTALDH1A1TSHR
SCHEMBL10973737 0.73 MAPT (0.47) BRD4CREBBPMAPTALDH1A1TSHR
SCHEMBL30495367 0.73 MAPT (0.47) BRD4CREBBPMAPTALDH1A1TSHR
SCHEMBL7059289 0.73 ALDH1A1 (0.41) BRD4CREBBPMAPTALDH1A1TSHR
SCHEMBL6546330 0.73 ALDH1A1 (0.41) BRD4CREBBPMAPTALDH1A1TSHR
SCHEMBL9442849 0.73 NR4A1 (0.50) BRD4CREBBPMAPTALDH1A1TSHR
SCHEMBL17967366 0.72 NFE2L2 (0.42) MAPTALDH1A1TSHRAKR1C3KDM1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5414125-A Epoxy resin curing agent THE DOW CHEMICAL COMPANY (US) 1995-05-09 US claimed
EP-2726529-A1 HYBRID EPOXY RESINS Dow Global Technologies LLC (US) 2014-05-07 EP disclosed
WO-2013055411-A1 HYBRID EPOXY RESINS DOW GLOBAL TECHNOLOGIES LLC (US) 2013-04-18 WO disclosed
CN-102037045-A Epoxy resins derived from non-seed oil based alkanolamides and process for making the same DOW GLOBAL TECHNOLOGIES INC 2011-04-27 CN disclosed
EP-0745233-A1 CURE CONTROLLED CATALYZED MIXTURES OF EPOXY RESINS AND CURING AGENTS CONTAINING MESOGENIC MOIETIES, B-STAGED AND CURED PRODUCTS THEREFROM THE DOW CHEMICAL COMPANY (US) 1996-12-04 EP disclosed
WO-1995022079-A1 CURE CONTROLLED CATALYZED MIXTURES OF EPOXY RESINS AND CURING AGENTS CONTAINING MESOGENIC MOIETIES, B-STAGED AND CURED PRODUCTS THEREFROM THE DOW CHEMICAL COMPANY (US) 1995-08-17 WO disclosed
US-5414125-A Epoxy resin curing agent THE DOW CHEMICAL COMPANY (US) 1995-05-09 US disclosed
EP-0579743-A1 DIAMINO-ALPHA-ALKYLSTILBENES THE DOW CHEMICAL COMPANY (US) 1994-01-26 EP disclosed