Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DHFR | P00374 | 1/20 | 0.41 |
| ▸ | MGLL | Q99685 | 5/20 | 0.40 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.39 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.36 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.36 |
| ▸ | NPC1 | O15118 | 1/20 | 0.36 |
| ▸ | MEN1 | O00255 | 1/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1177370 | 0.92 | DHFR (0.43) | DHFRMGLLALDH1A1MAPK1L3MBTL1 | |
| SCHEMBL29763757 | 0.85 | DHFR (0.44) | DHFRMGLLALDH1A1MAPK1L3MBTL1 | |
| SCHEMBL19732909 | 0.83 | DHFR (0.49) | DHFRMGLLALDH1A1MAPK1L3MBTL1 | |
| SCHEMBL2779445 | 0.82 | DHFR (0.48) | DHFRMGLLALDH1A1MAPK1L3MBTL1 | |
| SCHEMBL5772028 | 0.81 | TSHR (0.52) | ALDH1A1MAPK1MEN1KMT2A | |
| SCHEMBL2493818 | 0.79 | DHFR (0.42) | DHFRMGLLALDH1A1NPC1MEN1 | |
| SCHEMBL1643685 | 0.79 | ALDH1A1 (0.47) | DHFRMGLLALDH1A1L3MBTL1 | |
| SCHEMBL1714071 | 0.78 | DHFR (0.54) | DHFRMGLLALDH1A1MAPK1L3MBTL1 | |
| SCHEMBL27669934 | 0.78 | DHFR (0.49) | DHFRMGLLMAPK1L3MBTL1 | |
| SCHEMBL27689055 | 0.78 | CSNK2A1 (0.41) | DHFRMGLLALDH1A1MAPK1L3MBTL1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230340253-A1 | RESIN COMPOSITION AND SHAPED ARTICLE | KURARAY CO., LTD. (JP) | 2023-10-26 | — | — | US | disclosed |
| EP-4219574-A1 | RESIN COMPOSITION AND MOLDED ARTICLE | Kuraray Co., Ltd. (JP) | 2023-08-02 | — | — | EP | disclosed |
| CN-110133963-B | Photosensitive polyimide composition and photoresist film made from same | 新应材股份有限公司 | 2023-03-28 | — | — | CN | disclosed |
| CN-113728056-A | Latent heat storage material | 株式会社钟化 | 2021-11-30 | — | — | CN | disclosed |
| US-11029598-B2 | Photosensitive polyimide composition and photoresist film made thereof | ECHEM SOLUTIONS CORP. (TW) | 2021-06-08 | — | — | US | disclosed |
| CN-112638983-A | Improvements in or relating to curing agents | 赫克塞尔合成有限公司 | 2021-04-09 | — | — | CN | disclosed |
| WO-2020203749-A1 | LATENT HEAT STORAGE MATERIAL | 株式会社カネカ | 2020-10-08 | — | — | WO | disclosed |
| CN-111511809-A | Curing agent composition and resin composition containing same | 赫克塞尔合成有限公司 | 2020-08-07 | — | — | CN | disclosed |
| US-20190243241-A1 | Photosensitive Polyimide Composition and Photoresist Film Made Thereof | ECHEM SOLUTIONS CORP (TW) | 2019-08-08 | — | — | US | disclosed |
| US-20180215913-A1 | HIGH-TEMPERATURE OIL RESISTANT MOLDED COMPONENT FOR AUTOMOBILE | YAZAKI CORPORATION (JP) | 2018-08-02 | — | — | US | disclosed |
| US-9929068-B2 | Film-like wafer mold material, molded wafer, and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-03-27 | — | — | US | disclosed |
| EP-2500934-B1 | Film-like wafer mold material and molded wafer | SHINETSU CHEMICAL CO (JP) | 2015-10-21 | — | — | EP | disclosed |
| US-20120235284-A1 | FILM-LIKE WAFER MOLD MATERIAL, MOLDED WAFER, AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-09-20 | — | — | US | disclosed |
| EP-2500934-A2 | Film-like wafer mold material, molded wafer, and semiconductor device | Shin-Etsu Chemical Co., Ltd. (JP) | 2012-09-19 | — | — | EP | disclosed |
| US-20120139131-A1 | WAFER MOLD MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-06-07 | — | — | US | disclosed |
| EP-2461356-A1 | Wafer mold material and method for manufacturing semiconductor apparatus | Shin-Etsu Chemical Co., Ltd. (JP) | 2012-06-06 | — | — | EP | disclosed |