Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NFE2L2 | Q16236 | 6/20 | 0.39 |
| ▸ | CYP19A1 | P11511 | 2/20 | 0.39 |
| ▸ | MAOA | P21397 | 1/20 | 0.39 |
| ▸ | MAOB | P27338 | 1/20 | 0.39 |
| ▸ | NR1H3 | Q13133 | 2/20 | 0.36 |
| ▸ | RELA | Q04206 | 1/20 | 0.35 |
| ▸ | LCK | P06239 | 1/20 | 0.35 |
| ▸ | PDK2 | Q15119 | 1/20 | 0.35 |
| ▸ | FBP1 | P09467 | 1/20 | 0.34 |
| ▸ | APP | P05067 | 2/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5684522 | 0.88 | MAOB (0.42) | NFE2L2CYP19A1MAOAMAOBRELA | |
| SCHEMBL5684532 | 0.88 | MAOB (0.42) | NFE2L2CYP19A1MAOAMAOBRELA | |
| SCHEMBL9118912 | 0.85 | CDC25B (0.34) | — | |
| SCHEMBL9118904 | 0.85 | CDC25B (0.34) | — | |
| SCHEMBL9075196 | 0.74 | MAPK1 (0.42) | NFE2L2CYP19A1MAOAMAOBRELA | |
| SCHEMBL31236759 | 0.74 | MAPK1 (0.42) | NFE2L2CYP19A1MAOAMAOBRELA | |
| SCHEMBL29145309 | 0.72 | CDC25A (0.31) | — | |
| SCHEMBL1901796 | 0.70 | NFE2L2 (0.68) | NFE2L2CYP19A1MAOAMAOBRELA | |
| SCHEMBL1901794 | 0.70 | NFE2L2 (0.68) | NFE2L2CYP19A1MAOAMAOBRELA | |
| SCHEMBL3025090 | 0.69 | MEN1 (0.39) | MAOAMAOB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5388328-A | Forming metal layer, forming resist, filling windows in resist with conductor by plating, forming another windowed resist, filling windows with conductor, dissolving resist, filling spacings with varnish, curing | HITACHI, LTD. (JP) | 1995-02-14 | — | — | US | disclosed |