SCHEMBL9118904

SCHEMBL9118904

C1=C(/C=C/C2=Cc3ccccc32)c2ccccc21

nearest known ligand 0.34

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CDC25B P30305 2/20 0.34
CDC25A P30304 1/20 0.34
MEN1 O00255 2/20 0.31
KMT2A Q03164 2/20 0.31
KDM4E B2RXH2 1/20 0.31
ALDH1A1 P00352 1/20 0.31
LMNA P02545 1/20 0.31
BCHE P06276 1/20 0.31
POLB P06746 1/20 0.31
PTPRC P08575 1/20 0.31
MAPT P10636 1/20 0.31
THRB P10828 1/20 0.31
PKM P14618 1/20 0.31
IDO1 P14902 1/20 0.31
HPGD P15428 1/20 0.31
ALOX15 P16050 1/20 0.31
PTPN1 P18031 1/20 0.31
ACHE P22303 1/20 0.31
CES1 P23141 1/20 0.31
RECQL P46063 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9118906 1.00 CDC25B (0.34) CDC25BCDC25AMEN1KMT2AKDM4E
SCHEMBL9118912 1.00 CDC25B (0.34) CDC25BCDC25AMEN1KMT2AKDM4E
SCHEMBL5684532 0.89 MAOB (0.42) MEN1KMT2AALDH1A1LMNA
SCHEMBL5684522 0.89 MAOB (0.42) MEN1KMT2AALDH1A1LMNA
SCHEMBL29145309 0.85 CDC25A (0.31) CDC25BCDC25A
SCHEMBL9118901 0.85 NFE2L2 (0.39)
SCHEMBL31571666 0.81 MEN1 (0.39) CDC25BCDC25AMEN1KMT2AKDM4E
SCHEMBL17601831 0.81 CDC25A (0.38) CDC25BCDC25AMEN1KMT2AKDM4E
SCHEMBL329788 0.79 ALDH1A1 (0.36) CDC25BCDC25AALDH1A1DRD2DRD4
SCHEMBL29620612 0.79 ALDH1A1 (0.36) CDC25BCDC25AALDH1A1DRD2DRD4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5388328-A Forming metal layer, forming resist, filling windows in resist with conductor by plating, forming another windowed resist, filling windows with conductor, dissolving resist, filling spacings with varnish, curing HITACHI, LTD. (JP) 1995-02-14 US disclosed
US-5300735-A Interconnected multilayer boards and fabrication processes thereof HITACHI, LTD. (JP) 1994-04-05 US disclosed
US-5264646-A Vinylation, benzocyclobutenes, polysiloxanes THE DOW CHEMICAL COMPANY (US) 1993-11-23 US disclosed
US-5243068-A Alkenylation with organic halides THE DOW CHEMICAL COMPANY (US) 1993-09-07 US disclosed
US-5136069-A Reacting with halogenated organic compound in presence of palladium complex catalyst and inorganic hydrogen halide acceptor THE DOW CHEMICAL COMPANY (US) 1992-08-04 US disclosed