SCHEMBL9276702

SCHEMBL9276702

CCC1=CC(=O)N(c2ccc(Cc3ccc(N4C(=O)C=C(CC)C4=O)cc3)cc2)C1=O

nearest known ligand 0.52

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 7/20 0.52
FAAH O00519 3/20 0.52
ALDH1A1 P00352 5/20 0.38
KDM4E B2RXH2 2/20 0.38
HPGD P15428 2/20 0.38
CYP1A2 P05177 1/20 0.38
POLB P06746 1/20 0.38
CYP2C19 P33261 1/20 0.38
TDP1 Q9NUW8 1/20 0.38
MEN1 O00255 2/20 0.35
KMT2A Q03164 2/20 0.35
STAT3 P40763 1/20 0.35
NPSR1 Q6W5P4 1/20 0.35
LMNA P02545 2/20 0.35
SMN1; SMN2 Q16637 2/20 0.35
KCNH2 Q12809 1/20 0.35
TRIP13 Q15645 1/20 0.33
HTT P42858 1/20 0.33
RAB9A P51151 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3444955 0.82 ELANE (0.46) MGLLALDH1A1KDM4EHPGDMEN1
SCHEMBL20842696 0.80 MGLL (0.54) MGLLFAAHALDH1A1HPGDTDP1
SCHEMBL24939824 0.79 DDAH1 (0.53) ALDH1A1KDM4EHPGDPOLBTDP1
SCHEMBL3828130 0.79 MGLL (0.55) MGLLFAAHALDH1A1KDM4EHPGD
SCHEMBL9346203 0.75 MGLL (0.55) MGLLFAAHALDH1A1KDM4EHPGD
SCHEMBL9179167 0.74 MGLL (0.48) MGLLFAAHALDH1A1MEN1KMT2A
SCHEMBL7924193 0.73 MGLL (0.48) MGLLFAAHALDH1A1MEN1KMT2A
3,4-Dimethylphenylmaleimide SCHEMBL9714890 0.70 ELANE (0.33) MGLLALDH1A1KDM4EHPGDMEN1
SCHEMBL6335872 0.70 MGLL (0.59) MGLLMEN1KMT2ALMNAHTT
SCHEMBL4385777 0.70 MGLL (0.49) MGLLFAAHALDH1A1HPGDSTAT3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20220315762-A1 PREPREG, LAMINATE, AND MOLDING TORAY INDUSTRIES, INC. (JP) 2022-10-06 US disclosed
EP-3974175-A1 PREPREG, MULTILAYER BODY AND MOLDED ARTICLE Toray Industries, Inc. (JP) 2022-03-30 EP disclosed
US-5438104-A Maleimide composition, prepreg and fiber-reinforced plastic TORAY INDUSTRIES, INC. (JP) 1995-08-01 US disclosed
EP-0310424-B1 Thermosetting resin composition MITSUI PETROCHEMICAL IND (JP) 1994-01-05 EP disclosed
EP-0540250-A1 Maleimide resin composition, prepreg and fibre-reinforced plastics material TORAY INDUSTRIES, INC. (JP) 1993-05-05 EP disclosed
EP-0195846-B1 PHOTO-CURABLE EPOXY RESIN TYPE COMPOSITION AND CURING PROCESS KABUSHIKI KAISHA TOSHIBA (JP) 1991-07-31 EP disclosed
US-4985478-A Aminobismaleimide, unsaturated epoxy compound, sheet molding compound MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1991-01-15 US disclosed
US-4975471-A Photo-curable epoxy resin type composition KABUSHIKI KAISHA TOSHIBA (JP) 1990-12-04 US disclosed
EP-0195846-A2 Photo-curable epoxy resin type composition and curing process KABUSHIKI KAISHA TOSHIBA (JP) 1986-10-01 EP disclosed
EP-0057018-B1 PHOTO-CURABLE EPOXY RESIN COMPOSITION KABUSHIKI KAISHA TOSHIBA (JP) 1985-06-05 EP disclosed
US-4406764-A Photo-curable epoxy resin composition with organic aluminum and α-ketosilyl compounds TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) 1983-09-27 US disclosed
EP-0057018-A2 Photo-curable epoxy resin composition KABUSHIKI KAISHA TOSHIBA (JP) 1982-08-04 EP disclosed
US-4309512-A MALEIMIDE COMPOUND MODIFIED WITH FURFURYL ACLOHOL, EPOXY RESIN, POLYVINYL FORMAL AND CURING AGENT; DIELECTRIC COATINGS TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) 1982-01-05 US disclosed
EP-0031904-A1 Heat-resistant thermosetting resin composition KABUSHIKI KAISHA TOSHIBA (JP) 1981-07-15 EP disclosed