SCHEMBL928519

SCHEMBL928519

O=C(CCl)c1ccc(Oc2ccccc2)cc1Cl

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.56
MAPK1 P28482 3/20 0.56
HIF1A Q16665 2/20 0.56
POLB P06746 2/20 0.49
MITF O75030 1/20 0.49
HTT P42858 1/20 0.49
RNF4 P78317 1/20 0.49
KMO O15229 1/20 0.48
MEN1 O00255 2/20 0.47
KMT2A Q03164 2/20 0.47
NPC1 O15118 1/20 0.47
RAB9A P51151 1/20 0.47
SMN1; SMN2 Q16637 1/20 0.47
STK39 Q9UEW8 3/20 0.46
BTK Q06187 1/20 0.45
AKR1C3 P42330 1/20 0.44
ERCC5 P28715 2/20 0.43
FEN1 P39748 2/20 0.43
FFAR1 O14842 1/20 0.43
GAA P10253 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20006624 0.89 ALDH1A1 (0.67) ALDH1A1MAPK1HIF1AMEN1KMT2A
SCHEMBL19471693 0.86 ALDH1A1 (0.44) ALDH1A1MAPK1HIF1APOLBMITF
SCHEMBL17870007 0.83 POLB (0.57) ALDH1A1MAPK1POLBKMOKMT2A
SCHEMBL29883084 0.83 BTK (0.54) POLBKMOSTK39BTKAKR1C3
SCHEMBL28850320 0.82 KMO (0.51) POLBKMOSTK39BTKAKR1C3
SCHEMBL28949679 0.81 KMO (0.50) ALDH1A1MAPK1POLBMITFHTT
SCHEMBL28039268 0.81 PARP10 (0.56) ALDH1A1POLBKMOKMT2ASTK39
SCHEMBL15725371 0.80 MAPT (0.53) ALDH1A1MAPK1HIF1AMEN1KMT2A
SCHEMBL27874063 0.79 POLB (0.60) ALDH1A1MAPK1POLBHTTKMO
SCHEMBL18756750 0.78 XDH (0.51) ALDH1A1POLBKMOMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 292 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024135958-A1 LAMINATED FILM FOR SOLAR MODULE HAVING EXCELLENT RADIATION COOLING PROPERTIES, AND SOLAR MODULE COMPRISING SAME 이근수 2024-06-27 WO disclosed
WO-2024128438-A1 COATING FILM FOR SOLAR MODULE USING ORGANIC-INORGANIC HYBRID POLYMER COATING COMPOSITION 이근수 2024-06-20 WO disclosed
EP-4382578-A1 INK COMPOSITION FOR OLED PACKAGING AND APPLICATION THEREOF Hangzhou First Applied Material Co., Ltd. (CN) 2024-06-12 EP disclosed
WO-2024101181-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING FILM, PATTERN FORMATION METHOD, AND LIGHT EMITTING ELEMENT 信越化学工業株式会社 2024-05-16 WO disclosed
US-11977329-B2 Photosensitive compositions, preparation methods thereof, and quantum dot polymer composite prepared therefrom SAMSUNG ELECTRONICS CO., LTD. (KR) 2024-05-07 US disclosed
US-11958998-B2 Compositions, quantum dot polymer composites prepared therefrom, and devices including the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2024-04-16 US disclosed
WO-2024075586-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING FILM, PATTERN FORMATION METHOD, AND LIGHT-EMITTING ELEMENT 信越化学工業株式会社 2024-04-11 WO disclosed
WO-2024024841-A1 COMPOSITION FOR ELECTRONIC DEVICE SEALING, ELECTRONIC DEVICE SEALING FILM, AND METHOD FOR FORMING ELECTRONIC DEVICE SEALING FILM コニカミノルタ株式会社 2024-02-01 WO disclosed
WO-2024024942-A1 ELECTRONIC DEVICE SEALING COMPOSITION, ELECTRONIC DEVICE SEALING FILM, AND METHOD FOR FORMING ELECTRONIC DEVICE SEALING FILM コニカミノルタ株式会社 2024-02-01 WO disclosed
WO-2024024836-A1 COMPOSITION FOR ENCAPSULATING ELECTRONIC DEVICE, ELECTRONIC DEVICE ENCAPSULATION FILM, AND METHOD FOR FORMING ELECTRONIC DEVICE ENCAPSULATION FILM コニカミノルタ株式会社 2024-02-01 WO disclosed
US-20080090177-A1 Resin Composition Comprising Cardo Resin, Method for Forming Pattern Using the Resin Composition and Color Filter Using Pattern Formed by the Method CHEIL INDUSTRIES INC. (KR) 2008-04-17 US disclosed
US-20080020300-A1 Photosensitive Resin Composition for Color Filter of Image Sensor and Color Filter of Image Sensor Using the Same CHEIL INDUSTRIES INC. 2008-01-24 US disclosed
US-20070154820-A1 Photosensitive resin composition and black matrix using the same CHEIL INDUSTRIES, INC. (KR) 2007-07-05 US disclosed
US-6929821-B2 Process for forming a pattern of fluorescent substrate and plasma display panel THE NIPPON SYNTHETIC CHEMICAL INDUSTRY CO., LTD. (JP) 2005-08-16 US disclosed
US-6806032-B2 NEGATIVE-TYPE PHOTOSENSITIVE RESIN IS A PRODUCT OF MICHAEL ADDITION REACTION BETWEEN AN AMINO GROUP CONTAINING COMPOUND AND AN METH(ACRYLATED)POLYETHYLENE GLYCOL TOKYO OHKA KOGYO CO., LTD. (JP) 2004-10-19 US disclosed
US-20030170569-A1 Negative-type photosensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 2003-09-11 US disclosed
US-20020106446-A1 PROCESS FOR FORMING A PATTERN OF FLUORESCENT SUBSTRATE AND PLASMA DISPLAY PANEL BEHR SYSTEMS, INC. 2002-08-08 US disclosed
US-6312860-B1 INORGANIC PHOSPHOR, CAPABLE OF EMITTING BLUE COLOR UPON ULTRAVIOLET IRRADIATION, AND COPPER OR A COPPER COMPOUND; NO DETERIORATION IN THE BRIGHTNESS OR VARIATION IN THE COLORATION OF THE PHOSPHOR. DAI NIPPON PRINTING CO., LTD. (JP) 2001-11-06 US disclosed
US-6106992-A PHOTORESIST FILM COMPRISING BASE FILM, PHOTOSENSITIVE RESIN COMPOSITION LAYER COMPRISING A FLUORESCENT SUBSTANCE, A PHOTOSENSITIVE RESIN, AND A VOLATILE ORGANIC MATERIAL; USEFUL FOR PRODUCING FLUORESCENT SUBSTANCE DISPLAY DAI NIPPON PRINTING CO., LTD. (JP) 2000-08-22 US disclosed
US-6066431-A SIMPLIFIED PROCESS FOR FORMING FLUORESCENT SUBSTANCE PATTERN FOR DISPLAY DEVICE WHICH ELIMINATES WET PROCESS DEVELOPING STEP DAI NIPPON PRINTING CO., LTD. (JP) 2000-05-23 US disclosed