⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27691586 | 0.98 | PTPN2 (0.46) | — | |
| Hydrochloric Acid SCHEMBL2269210 | 0.98 | PTPN2 (0.46) | — | |
| Formic Acid SCHEMBL27767482 | 0.92 | PTPN2 (0.42) | — | |
| Formamide SCHEMBL28881233 | 0.92 | PTPN2 (0.42) | — | |
| Isopropyl Alcohol SCHEMBL28985050 | 0.90 | AXL (0.43) | — | |
| Benzoic Acid SCHEMBL9555786 | 0.88 | TSHR (0.52) | — | |
| SCHEMBL56103 | 0.81 | — | — | |
| SCHEMBL1353374 | 0.79 | — | — | |
| SCHEMBL28163842 | 0.79 | — | — | |
| SCHEMBL10738874 | 0.77 | ALDH1A1 (0.38) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 533 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119866887-A | Rapid planting and propagation method by utilizing perennial leguminous forage vegetative propagules | 中国科学院植物研究所 | 2025-04-25 | — | — | CN | claimed |
| CN-115974833-B | Preparation method of 3-aminothiophene oxalate | 苏州汉德创宏生化科技有限公司 | 2024-08-02 | — | — | CN | claimed |
| CN-115974833-A | Preparation method of 3-aminothiophene oxalate | 苏州汉德创宏生化科技有限公司 | 2023-04-18 | — | — | CN | claimed |
| EP-3674052-B1 | METHOD FOR PRODUCING METAL-POLYMER RESIN CONJUGATE | PLASTAL CO LTD (KR) | 2022-06-08 | — | — | EP | claimed |
| CN-111072930-B | Fluorine-containing thiophene derivative polymer film PEDOT-F, and preparation method and application thereof | 浙江工业大学 | 2022-05-24 | — | — | CN | claimed |
| US-11235498-B2 | Manufacturing method of metal-polymer resin bonded component | PLASTAL CO., LTD. (KR) | 2022-02-01 | — | — | US | claimed |
| CN-109421207-B | Method for manufacturing metal-polymer resin bonded member | 塑料金属有限公司 | 2021-01-22 | — | — | CN | claimed |
| CN-111848641-A | 4-phenoxy thiophene [3,2-d ] pyrimido alpha-acylamino thioamide compound and preparation method and application thereof | 哈尔滨工业大学（威海） | 2020-10-30 | — | — | CN | claimed |
| US-20200261383-A1 | PHARMACEUTICAL COMPOSITIONS | KALVISTA PHARMACEUTICALS LIMITED (GB) | 2020-08-20 | — | — | US | claimed |
| EP-3674052-A1 | METHOD FOR PRODUCING METAL-POLYMER RESIN CONJUGATE | Plastal Co., Ltd. (KR) | 2020-07-01 | — | — | EP | claimed |
| WO-2007093284-A1 | SOLUTION AND PROCESS TO TREAT SURFACES OF COPPER ALLOYS IN ORDER TO IMPROVE THE ADHESION BETWEEN THE METAL SURFACE AND THE BONDED POLYMERIC MATERIAL | ATOTECH DEUTSCHLAND GMBH (DE) | 2007-08-23 | — | — | WO | claimed |
| EP-1820884-A1 | Solution and process to treat surfaces of copper alloys in order to improve the adhesion between the metal surface and the bonded polymeric material | ATOTECH DEUTSCHLAND GMBH (DE) | 2007-08-22 | — | — | EP | claimed |
| US-20060270849-A1 | Process for producing pyrimidin-4-one compound | UBE INDUSTRIES, LTD. (JP) | 2006-11-30 | — | — | US | claimed |
| CN-1835930-A | Process for producing pyrimidin-4-one compound | UBE INDUSTRIES (JP) | 2006-09-20 | — | — | CN | claimed |
| EP-1637523-A1 | PROCESS FOR PRODUCING PYRIMIDIN-4-ONE COMPOUND | Ube Industries, Ltd. (JP) | 2006-03-22 | — | — | EP | claimed |
| US-20050198745-A1 | Keratin dyeing compounds, keratin dyeing compositions containing them, and use thereof | PROCTER & GAMBLE COMPANY, THE | 2005-09-15 | — | — | US | claimed |
| US-6723385-B1 | PRETREAT COPPER SURFACES SO THAT A TIGHT BOND CAN BE SUBSEQUENTLY FORMED BETWEEN THE PRETREATED COPPER SURFACES AND PLASTIC SUBSTRATES OF PRINTED CIRDUIT BOARDS | ATOTECH DEUTSCHLAND GMBH (DE) | 2004-04-20 | — | — | US | claimed |
| US-6562149-B1 | For firmly bonding laminated multilayered printed circuit boards and for bonding resists to copper | ATOTECH DEUTSCHLAND GMBH (DE) | 2003-05-13 | — | — | US | claimed |
| EP-1051888-B1 | PROCESS AND SOLUTION FOR THE PRELIMINARY TREATMENT OF COPPER SURFACES | ATOTECH DEUTSCHLAND GMBH (DE) | 2002-03-27 | — | — | EP | claimed |
| EP-1055355-B1 | PROCESS FOR THE PRELIMINARY TREATMENT OF COPPER SURFACES | ATOTECH DEUTSCHLAND GMBH (DE) | 2001-12-05 | — | — | EP | claimed |