⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2956125 | 1.00 | — | — | |
| SCHEMBL9785099 | 1.00 | — | — | |
| SCHEMBL557306 | 1.00 | — | — | |
| SCHEMBL3229729 | 1.00 | — | — | |
| SCHEMBL703801 | 0.97 | — | — | |
| SCHEMBL28368573 | 0.91 | MGAM (0.31) | — | |
| SCHEMBL28368189 | 0.91 | MGAM (0.31) | — | |
| SCHEMBL648313 | 0.90 | — | — | |
| SCHEMBL6054003 | 0.89 | TSHR (0.42) | — | |
| SCHEMBL5843473 | 0.89 | TSHR (0.42) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 84 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4570877-A1 | SURFACE TREATMENT AGENT | DAIKIN INDUSTRIES, LTD. (JP) | 2025-06-18 | — | — | EP | disclosed |
| CN-119698451-A | Surface treating agent | 大金工业株式会社 | 2025-03-25 | — | — | CN | disclosed |
| EP-4509551-A1 | SURFACE TREATMENT AGENT | DAIKIN INDUSTRIES, LTD. (JP) | 2025-02-19 | — | — | EP | disclosed |
| WO-2025028568-A1 | SURFACE TREATMENT AGENT | ダイキン工業株式会社 | 2025-02-06 | — | — | WO | disclosed |
| CN-114846377-B | Optical laminate and image display device | 住友化学株式会社 | 2024-12-03 | — | — | CN | disclosed |
| CN-119053645-A | Surface treating agent | 大金工业株式会社 | 2024-11-29 | — | — | CN | disclosed |
| CN-114846374-B | Optical laminate and image display device | 住友化学株式会社 | 2024-11-01 | — | — | CN | disclosed |
| CN-114450375-B | Adhesive composition | 住友化学株式会社 | 2024-10-25 | — | — | CN | disclosed |
| WO-2024150783-A1 | ADHESIVE COMPOSITION, ADHESIVE LAYER, OPTICAL FILM WITH ADHESIVE LAYER, AND DISPLAY DEVICE | 住友化学株式会社 | 2024-07-18 | — | — | WO | disclosed |
| WO-2024034668-A1 | SURFACE TREATMENT AGENT | ダイキン工業株式会社 | 2024-02-15 | — | — | WO | disclosed |
| US-20090294922-A1 | ORGANIC SILICON OXIDE FINE PARTICLE AND PREPARATION METHOD THEREOF, POROUS FILM-FORMING COMPOSITION, POROUS FILM AND FORMATION METHOD THEREOF, AND SEMICONDUCTOR DEVICE | PANASONIC CORPORATION (JP) | 2009-12-03 | — | — | US | disclosed |
| US-20090294726-A1 | ORGANIC SILICON OXIDE FINE PARTICLES AND PREPARATION METHOD THEREOF, POROUS FILM-FORMING COMPOSITION, POROUS FILM AND FORMATION METHOD THEREOF, AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-12-03 | — | — | US | disclosed |
| US-20070178319-A1 | Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device | MATSUSHITA ELECTRIC INDUSTRIAL CO, LTD. (JP) | 2007-08-02 | — | — | US | disclosed |
| US-20070135565-A1 | COMPOSITION FOR FORMING POROUS FILM, POROUS FILM AND METHOD FOR FORMING THE SAME, INTERLEVEL INSULATOR FILM, AND SEMICONDUCTOR DEVICE | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2007-06-14 | — | — | US | disclosed |
| US-7132473-B2 | Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2006-11-07 | — | — | US | disclosed |
| EP-1568744-A1 | COMPOSITION FOR POROUS FILM FORMATION, POROUS FILM, PROCESS FOR PRODUCING THE SAME, INTERLAYER INSULATION FILM AND SEMICONDUCTOR DEVICE | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2005-08-31 | — | — | EP | disclosed |
| EP-1564269-A1 | COMPOSITION FOR POROUS FILM FORMATION, POROUS FILM, PROCESS FOR PRODUCING THE SAME, INTERLAYER INSULATION FILM AND SEMICONDUCTOR DEVICE | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2005-08-17 | — | — | EP | disclosed |
| US-20040216641-A1 | Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. | 2004-11-04 | — | — | US | disclosed |
| US-20040219372-A1 | Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. | 2004-11-04 | — | — | US | disclosed |
| CN-1536023-A | Porous membrane shaping composition, preparation method of porous membrane, porous membrane intercalation insulating film and semiconductor device | ��Խ��ѧ��ҵ��ʽ���� | 2004-10-13 | — | — | CN | disclosed |