⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9785099 | 0.97 | — | — | |
| SCHEMBL2956125 | 0.97 | — | — | |
| SCHEMBL557306 | 0.97 | — | — | |
| SCHEMBL3229729 | 0.97 | — | — | |
| SCHEMBL931332 | 0.97 | — | — | |
| SCHEMBL648313 | 0.93 | — | — | |
| SCHEMBL28372317 | 0.91 | — | — | |
| SCHEMBL28368189 | 0.88 | MGAM (0.31) | — | |
| SCHEMBL6703624 | 0.88 | LMNA (0.39) | — | |
| SCHEMBL28368573 | 0.88 | MGAM (0.31) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11592945-B2 | Dielectric siloxane particle films and devices having the same | INKRON OY (FI) | 2023-02-28 | — | — | US | disclosed |
| CN-106605309-B | LED lamp, manufacturing method of LED lamp and sealing method of LED device | 英克伦股份有限公司 | 2022-10-18 | — | — | CN | disclosed |
| CN-106661227-B | Dielectric film and manufacturing method thereof, display and manufacturing method thereof, composition and touch panel | 英克伦股份有限公司 | 2022-07-22 | — | — | CN | disclosed |
| US-11289666-B2 | Electrically conductive siloxane particle films, and devices with the same | INKRON OY (FI) | 2022-03-29 | — | — | US | disclosed |
| EP-3158595-B1 | LED LAMP WITH SILOXANE PARTICLE MATERIAL | INKRON OY (FI) | 2021-12-01 | — | — | EP | disclosed |
| EP-3359991-B1 | DISPLAYS COMPRISING DIELECTRIC SILOXANE POLYMER FILMS | INKRON OY (FI) | 2021-09-29 | — | — | EP | disclosed |
| US-11084928-B2 | Transparent siloxane encapsulant and adhesive | INKRON OY (FI) | 2021-08-10 | — | — | US | disclosed |
| US-11001674-B2 | Method of making a siloxane polymer composition | INKRON OY (FI) | 2021-05-11 | — | — | US | disclosed |
| EP-3359373-B1 | METHOD FOR MAKING A 3D PRINTED ARTICLE AND 3D PRINTED ARTICLE | INKRON OY (FI) | 2021-04-14 | — | — | EP | disclosed |
| US-10658554-B2 | LED lamp with siloxane particle material | INKRON OY (FI) | 2020-05-19 | — | — | US | disclosed |
| US-8124239-B2 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2012-02-28 | — | — | US | disclosed |
| US-20100233482-A1 | Organic silicon oxide fine particles and preparation method thereof, porous film-forming composition, porous film and formation method thereof, and semiconductor device | HAMADA YOSHITAKA | 2010-09-16 | — | — | US | disclosed |
| US-7754330-B2 | Organic silicon oxide core-shell particles and preparation method thereof, porous film-forming composition, porous film and formation method thereof, and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-07-13 | — | — | US | disclosed |
| US-20100155121-A1 | SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | FUJITSU LIMITED (JP) | 2010-06-24 | — | — | US | disclosed |
| EP-2163664-A1 | Method for depositing si-containing film, insulator film, and semiconductor device | Shin-Etsu Chemical Co., Ltd. (JP) | 2010-03-17 | — | — | EP | disclosed |
| US-20100061915-A1 | METHOD FOR DEPOSITING SI-CONTAINING FILM, INSULATOR FILM, AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-03-11 | — | — | US | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| US-20090294726-A1 | ORGANIC SILICON OXIDE FINE PARTICLES AND PREPARATION METHOD THEREOF, POROUS FILM-FORMING COMPOSITION, POROUS FILM AND FORMATION METHOD THEREOF, AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-12-03 | — | — | US | disclosed |
| US-20090294922-A1 | ORGANIC SILICON OXIDE FINE PARTICLE AND PREPARATION METHOD THEREOF, POROUS FILM-FORMING COMPOSITION, POROUS FILM AND FORMATION METHOD THEREOF, AND SEMICONDUCTOR DEVICE | PANASONIC CORPORATION (JP) | 2009-12-03 | — | — | US | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |