Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.32 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.30 |
| ▸ | TSHR | P16473 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10352081 | 0.81 | ALDH1A1 (0.31) | ALDH1A1TDP1 | |
| SCHEMBL9308304 | 0.76 | — | — | |
| SCHEMBL9741265 | 0.75 | — | — | |
| SCHEMBL2851478 | 0.71 | — | — | |
| SCHEMBL17333129 | 0.71 | ALDH1A1 (0.32) | ALDH1A1TDP1SMN1; SMN2TSHR | |
| SCHEMBL9739911 | 0.70 | — | — | |
| SCHEMBL9739895 | 0.70 | — | — | |
| SCHEMBL1414615 | 0.69 | TSHR (0.45) | ALDH1A1TDP1SMN1; SMN2TSHR | |
| SCHEMBL5084659 | 0.69 | TSHR (0.36) | ALDH1A1TDP1SMN1; SMN2TSHR | |
| SCHEMBL10458786 | 0.69 | ALDH1A1 (0.34) | ALDH1A1TDP1SMN1; SMN2TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 49 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-1994004259-A1 | POLYSILOXANE EMULSIONS | PPG INDUSTRIES, INC. (US) | 1994-03-03 | — | — | WO | claimed |
| WO-2024143211-A1 | MEMBER, METHOD FOR MANUFACTURING MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR MEMBER | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143212-A1 | METHOD FOR MANUFACTURING LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR MEMBER, AND RESIN COMPOSITION | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143209-A1 | METHOD FOR PRODUCING MULTILAYER BODY, PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR MEMBER | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143210-A1 | MEMBER, METHOD FOR MANUFACTURING MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR MEMBER | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| US-20240186172-A1 | LAMINATE, RESIN COMPOSITION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2024-06-06 | — | — | US | disclosed |
| US-20240166556-A1 | LAMINATE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2024-05-23 | — | — | US | disclosed |
| WO-2024095885-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED OBJECT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED OBJECT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-05-10 | — | — | WO | disclosed |
| US-20240126171-A1 | HOLLOW STRUCTURE, ELECTRONIC COMPONENT USING SAME, AND NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION | TORAY INDUSTRIES, INC. (JP) | 2024-04-18 | — | — | US | disclosed |
| WO-2024070963-A1 | FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE | 富士フイルム株式会社 | 2024-04-04 | — | — | WO | disclosed |
| US-20180118887-A1 | PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PRECURSOR COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2018-05-03 | — | — | US | disclosed |
| US-20180079864-A1 | POLYIMIDE PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, A SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING POLYIMIDE PRECURSOR COMPOSITION | FUJIFILM CORPORATION (JP) | 2018-03-22 | — | — | US | disclosed |
| US-20180051136-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND ELECTRONIC COMPONENT | TORAY INDUSTRIES, INC. (JP) | 2018-02-22 | — | — | US | disclosed |
| US-20180031970-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2018-02-01 | — | — | US | disclosed |
| EP-3267254-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE | Toray Industries, Inc. (JP) | 2018-01-10 | — | — | EP | disclosed |
| US-9828469-B2 | Polyimide precursor, polyimide resin film produced from said polyimide precursor, display element, optical element, light-receiving element, touch panel and circuit board each equipped with said polyimide resin film, organic EL display, and methods respectively for producing organic EL element and color filter | TORAY INDUSTRIES, INC. (JP) | 2017-11-28 | — | — | US | disclosed |
| US-20160222165-A1 | POLYIMIDE PRECURSOR, POLYIMIDE RESIN FILM PRODUCED FROM SAID POLYIMIDE PRECURSOR, DISPLAY ELEMENT, OPTICAL ELEMENT, LIGHT-RECEIVING ELEMENT, TOUCH PANEL AND CIRCUIT BOARD EACH EQUIPPED WITH SAID POLYIMIDE RESIN FILM, ORGANIC EL DISPLAY, AND METHODS RESPECTIVELY FOR PRODUCING ORGANIC EL ELEMENT AND COLOR FILTER | TORAY INDUSTRIES, INC. (JP) | 2016-08-04 | — | — | US | disclosed |
| US-20150219991-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | TORAY INDUSTRIES, INC. (JP) | 2015-08-06 | — | — | US | disclosed |
| EP-2902846-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | Toray Industries, Inc. (JP) | 2015-08-05 | — | — | EP | disclosed |
| WO-1994004259-A1 | POLYSILOXANE EMULSIONS | PPG INDUSTRIES, INC. (US) | 1994-03-03 | — | — | WO | disclosed |