Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | THRB | P10828 | 2/20 | 0.46 |
| ▸ | ALDH1A1 | P00352 | 8/20 | 0.46 |
| ▸ | KDM4E | B2RXH2 | 8/20 | 0.46 |
| ▸ | SMN1; SMN2 | Q16637 | 4/20 | 0.46 |
| ▸ | GAA | P10253 | 1/20 | 0.45 |
| ▸ | POLB | P06746 | 2/20 | 0.43 |
| ▸ | MEN1 | O00255 | 4/20 | 0.42 |
| ▸ | KMT2A | Q03164 | 4/20 | 0.42 |
| ▸ | HTT | P42858 | 2/20 | 0.42 |
| ▸ | AR | P10275 | 1/20 | 0.41 |
| ▸ | NPC1 | O15118 | 1/20 | 0.40 |
| ▸ | RAB9A | P51151 | 1/20 | 0.40 |
| ▸ | TP53 | P04637 | 2/20 | 0.40 |
| ▸ | MAPT | P10636 | 2/20 | 0.40 |
| ▸ | HPGD | P15428 | 2/20 | 0.40 |
| ▸ | TSHR | P16473 | 2/20 | 0.40 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.40 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.40 |
| ▸ | PPARG | P37231 | 1/20 | 0.40 |
| ▸ | LMNA | P02545 | 2/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12404421 | 0.89 | MAPT (0.45) | THRBALDH1A1KDM4ESMN1; SMN2GAA | |
| SCHEMBL12430589 | 0.88 | HTT (0.49) | THRBALDH1A1KDM4ESMN1; SMN2GAA | |
| SCHEMBL137572 | 0.86 | THRB (0.65) | THRBALDH1A1KDM4ESMN1; SMN2GAA | |
| SCHEMBL14173110 | 0.86 | THRB (0.65) | THRBALDH1A1KDM4ESMN1; SMN2GAA | |
| SCHEMBL11132915 | 0.85 | THRB (0.55) | THRBALDH1A1KDM4ESMN1; SMN2GAA | |
| SCHEMBL246239 | 0.85 | THRB (0.55) | THRBALDH1A1KDM4ESMN1; SMN2GAA | |
| SCHEMBL16188011 | 0.84 | SMN1; SMN2 (0.45) | THRBALDH1A1KDM4ESMN1; SMN2GAA | |
| SCHEMBL1618613 | 0.82 | THRB (0.60) | THRBALDH1A1KDM4ESMN1; SMN2GAA | |
| SCHEMBL19770675 | 0.82 | THRB (0.60) | THRBALDH1A1KDM4ESMN1; SMN2GAA | |
| SCHEMBL7631129 | 0.82 | THRB (0.60) | THRBALDH1A1KDM4ESMN1; SMN2GAA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 267 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115386318-B | Anisotropic conductive adhesive, preparation and application thereof in ultra-fine pitch electrode packaging | 中国科学院合肥物质科学研究院 | 2023-10-13 | — | — | CN | claimed |
| US-12460039-B2 | Block copolymer intermediate, block copolymer, and methods for producing same | DIC CORPORATION (JP) | 2025-11-04 | — | — | US | disclosed |
| US-20250219304-A1 | REEL BODY | RESONAC CORPORATION (JP) | 2025-07-03 | — | — | US | disclosed |
| US-12331148-B2 | Block copolymer intermediate, block copolymer, and production methods for same | DIC CORPORATION (JP) | 2025-06-17 | — | — | US | disclosed |
| WO-2025089237-A1 | ADHESIVE COMPOSITION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE | 株式会社レゾナック | 2025-05-01 | — | — | WO | disclosed |
| WO-2025070422-A1 | ADHESIVE COMPOSITION AND CONNECTION STRUCTURE | 株式会社レゾナック | 2025-04-03 | — | — | WO | disclosed |
| WO-2025063142-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM, LAMINATE, AND METHOD FOR PRODUCING CIRCUIT CONNECTION STRUCTURE | 株式会社レゾナック | 2025-03-27 | — | — | WO | disclosed |
| WO-2025041839-A1 | ADHESIVE AGENT COMPOSITION, ADHESIVE AGENT FILM FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING SAME | 株式会社レゾナック | 2025-02-27 | — | — | WO | disclosed |
| US-12227683-B2 | Connector production method and adhesive film | RESONAC CORPORATION (JP) | 2025-02-18 | — | — | US | disclosed |
| WO-2025018368-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTED STRUCTURE, AND METHOD FOR PRODUCING CONNECTED STRUCTURE | 株式会社レゾナック | 2025-01-23 | — | — | WO | disclosed |
| US-20040222408-A1 | SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2004-11-11 | — | — | US | disclosed |
| US-20040214979-A1 | Polyurethanes and polyimides for wires or connectors and a process for connecting wires, curing with curing agents to form films. | FUJINAWA TOHRU | 2004-10-28 | — | — | US | disclosed |
| US-6777464-B1 | ELECTRONIC CIRCUIT-CONNECTING MATERIAL HAVING A SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2004-08-17 | — | — | US | disclosed |
| US-6762249-B1 | RAPID LOW TEMPERATURE SETTING; HIGH ADHESION, STRESS RELEAVING POLYURETHANE RESIN, FREE RADICAL POLYMERIZABLE MATERIAL AND CURING AGENT | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2004-07-13 | — | — | US | disclosed |
| US-20030178138-A1 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | HITACHI CHEMICAL CO., LTD. (JP) | 2003-09-25 | — | — | US | disclosed |
| US-20030141014-A1 | Mixture of electroconductive particles and polymer | HITACHI CHEMICAL CO., LTD. (JP) | 2003-07-31 | — | — | US | disclosed |
| US-20030027942-A1 | Resin composition , adhesive prepared therewith for bonding circuit members,and circuit boards | HITACHI CHEMICAL CO., LTD. (JP) | 2003-02-06 | — | — | US | disclosed |
| EP-1229095-A1 | ADHESIVE AGENT, METHOD FOR CONNECTING WIRING TERMINALS AND WIRING STRUCTURE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-08-07 | — | — | EP | disclosed |
| EP-1223795-A1 | WIRING-CONNECTING MATERIAL AND PROCESS FOR PRODUCING CIRCUIT BOARD WITH THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-07-17 | — | — | EP | disclosed |
| EP-0979854-A1 | CIRCUIT CONNECTING MATERIAL, AND STRUCTURE AND METHOD OF CONNECTING CIRCUIT TERMINAL | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-02-16 | — | — | EP | disclosed |