SCHEMBL9401276

SCHEMBL9401276

CON1CCN(OC)C1=O

nearest known ligand 0.33

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.33
BRD4 O60885 1/20 0.32
BRD2 P25440 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12190462 0.84
SCHEMBL2159616 0.77 LMNA (0.30)
SCHEMBL11607814 0.75 ALDH1A1 (0.30) ALDH1A1
SCHEMBL7446531 0.71
SCHEMBL3236190 0.70 ALDH1A1 (0.41) ALDH1A1
SCHEMBL6936336 0.67
SCHEMBL5962649 0.67
SCHEMBL28799609 0.67
SCHEMBL11434123 0.66
SCHEMBL18116963 0.66

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4615707-A Process for improving fastness of sulphur dyeing on hydroxy group containing fibers SANDOZ LTD. (CH) 1986-10-07 US claimed
JP-6049064-A None JP disclosed
WO-2026100734-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PATTERNED CURED PRODUCT PRODUCTION METHOD, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2026-05-15 WO disclosed
WO-2026100079-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PATTERNED CURED PRODUCT PRODUCTION METHOD, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2026-05-15 WO disclosed
US-20250233103-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, HYBRID BONDING INSULATION FILM FORMING MATERIAL AND SEMICONDUCTOR DEVICE HD MICROSYSTEMS, LTD. (JP) 2025-07-17 US disclosed
US-20250201760-A1 HYBRID BONDING INSULATION MEMBRANE FORMING MATERIAL, METHOD OF PRODUCING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE HD MICROSYSTEMS, LTD. (JP) 2025-06-19 US disclosed
WO-2025099883-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED PRODUCT, PATTERNED CURED PRODUCT, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2025-05-15 WO disclosed
WO-2025094691-A1 INSULATING FILM FORMING MATERIAL, INSULATING FILM FORMING MATERIAL KIT, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HDマイクロシステムズ株式会社 2025-05-08 WO disclosed
WO-2025094400-A1 RESIN COMPOSITION, CURED ARTICLE, METHOD FOR PRODUCING CURED ARTICLE, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2025-05-08 WO disclosed
WO-2025094402-A1 RESIN COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2025-05-08 WO disclosed
EP-2653497-A1 Weather resistant polyoxymethylene compositions Ticona GmbH (DE) 2013-10-23 EP disclosed
EP-2647666-A1 Tribologically modified polyoxymethylene Ticona GmbH (DE) 2013-10-09 EP disclosed
EP-2441786-B1 Glass-fiber reinforced polyoxymethylene TICONA GMBH (DE) 2013-07-31 EP disclosed
US-20130102718-A1 Tribologically Modified Glass-Fiber Reinforced Polyoxymethylene TICONA GMBH (DE) 2013-04-25 US disclosed
EP-2581408-A1 Tribologically modified glass-fiber reinforced polyoxymethylene Ticona GmbH (DE) 2013-04-17 EP disclosed
US-8029912-B2 Coated polyoxymethylenes BASF SE (DE) 2011-10-04 US disclosed
US-20100324184-A1 COATED POLYOXYMETHYLENES BASF SE (DE) 2010-12-23 US disclosed
JP-H0649064-A PYRIMIDINYLOXY@(3754/24)THIO)QUINOLINE N-OXIDE DERIVATIVE AND ITS PRODUCTION AND AGRICULTURAL AND HORTICULTURAL GERMICIDE CONTAINING THE SAME AS ACTIVE INGREDIENT MITSUI TOATSU CHEM INC 1994-02-22 JP disclosed
US-4615707-A Process for improving fastness of sulphur dyeing on hydroxy group containing fibers SANDOZ LTD. (CH) 1986-10-07 US disclosed
US-4039560-A HALO-TITANIUM OR VANADIUM CATALYST MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JA) 1977-08-02 US disclosed