Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GSK3B | P49841 | 10/20 | 0.37 |
| ▸ | PTGS2 | P35354 | 2/20 | 0.36 |
| ▸ | SLK | Q9H2G2 | 1/20 | 0.36 |
| ▸ | GSK3A | P49840 | 2/20 | 0.33 |
| ▸ | TP53 | P04637 | 1/20 | 0.33 |
| ▸ | MMP14 | P50281 | 1/20 | 0.32 |
| ▸ | MEN1 | O00255 | 1/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.32 |
| ▸ | MGAT2 | Q10469 | 1/20 | 0.32 |
| ▸ | ESR1 | P03372 | 1/20 | 0.32 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL23291848 | 0.85 | GSK3B (0.46) | GSK3BPTGS2SLKGSK3AMEN1 | |
| SCHEMBL94696 | 0.84 | GSK3B (0.40) | GSK3BPTGS2SLKGSK3AMEN1 | |
| SCHEMBL3684149 | 0.79 | GSK3B (0.52) | GSK3BPTGS2SLK | |
| SCHEMBL2081875 | 0.79 | KIF11 (0.43) | PTGS2TP53 | |
| SCHEMBL27860682 | 0.77 | SLK (0.41) | GSK3BPTGS2SLKGSK3AMEN1 | |
| SCHEMBL23291858 | 0.77 | SLK (0.49) | GSK3BSLKGSK3AMEN1KMT2A | |
| SCHEMBL7193397 | 0.74 | PTGS2 (0.48) | GSK3BPTGS2 | |
| SCHEMBL3677953 | 0.74 | GSK3B (0.60) | GSK3BPTGS2SLKGSK3AMEN1 | |
| SCHEMBL275843 | 0.71 | TEAD4 (0.48) | MEN1KMT2AESR1ESR2 | |
| SCHEMBL9741002 | 0.71 | TEAD4 (0.48) | MEN1KMT2AESR1ESR2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8501045-B2 | Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-08-06 | — | — | US | disclosed |
| US-8202622-B2 | Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same | HITACHI CHEMICAL CO., LTD. (JP) | 2012-06-19 | — | — | US | disclosed |
| US-20120138868-A1 | CIRCUIT CONNECTING MATERIAL, FILM-LIKE CIRCUIT CONNECTING MATERIAL USING THE CIRCUIT CONNECTING MATERIAL, STRUCTURE FOR CONNECTING CIRCUIT MEMBER, AND METHOD FOR CONNECTING CIRCUIT MEMBER | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-06-07 | — | — | US | disclosed |
| EP-2426787-A1 | CIRCUIT CONNECTING MATERIAL, FILM-LIKE CIRCUIT CONNECTING MATERIAL USING THE CIRCUIT CONNECTING MATERIAL, STRUCTURE FOR CONNECTING CIRCUIT MEMBER, AND METHOD FOR CONNECTING CIRCUIT MEMBER | Hitachi Chemical Company, Ltd. (JP) | 2012-03-07 | — | — | EP | disclosed |
| US-8043709-B2 | Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same | HITACHI CHEMICAL CO., LTD. (JP) | 2011-10-25 | — | — | US | disclosed |
| US-20110247757-A1 | CIRCUIT CONNECTION MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE, AND METHOD OF MANUFACTURING THE SAME | ARIFUKU MOTOHIRO | 2011-10-13 | — | — | US | disclosed |
| US-20110247870-A1 | CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF MANUFACTURING THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-10-13 | — | — | US | disclosed |
| US-8029911-B2 | Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-10-04 | — | — | US | disclosed |
| EP-2182585-B1 | Circuit member connecting structure | HITACHI CHEMICAL CO LTD (JP) | 2011-08-10 | — | — | EP | disclosed |
| EP-2282374-A1 | Circuit material | Hitachi Chemical Company, Ltd. (JP) | 2011-02-09 | — | — | EP | disclosed |
| US-7528488-B2 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | HITACHI CHEMICAL CO., LTD. (JP) | 2009-05-05 | — | — | US | disclosed |
| US-7258918-B2 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | HITACHI CHEMICAL CO., LTD. (JP) | 2007-08-21 | — | — | US | disclosed |
| US-20070166549-A1 | Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure | NOMURA SATOYUKI | 2007-07-19 | — | — | US | disclosed |
| US-7208105-B2 | Mixture of electroconductive particles and polymer | HITACHI CHEMICAL CO., LTD. (JP) | 2007-04-24 | — | — | US | disclosed |
| US-20060263599-A1 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | TSUKAGOSHI ISAO | 2006-11-23 | — | — | US | disclosed |
| US-20060260744-A1 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | TSUKAGOSHI ISAO | 2006-11-23 | — | — | US | disclosed |
| US-20060100314-A1 | Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same | HITACHI CHEMICAL CO., LTD. (JP) | 2006-05-11 | — | — | US | disclosed |
| EP-1628363-A1 | CIRCUIT CONNECTING MATERIAL, FILM-LIKE CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE, AND METHOD OF PRODUCING THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2006-02-22 | — | — | EP | disclosed |
| US-20030178138-A1 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | HITACHI CHEMICAL CO., LTD. (JP) | 2003-09-25 | — | — | US | disclosed |
| US-20030141014-A1 | Mixture of electroconductive particles and polymer | HITACHI CHEMICAL CO., LTD. (JP) | 2003-07-31 | — | — | US | disclosed |