Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GSK3B | P49841 | 9/20 | 0.40 |
| ▸ | PTGS2 | P35354 | 2/20 | 0.38 |
| ▸ | SLK | Q9H2G2 | 1/20 | 0.38 |
| ▸ | GSK3A | P49840 | 2/20 | 0.35 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.35 |
| ▸ | HSP90AB1 | P08238 | 1/20 | 0.35 |
| ▸ | NPC1 | O15118 | 2/20 | 0.34 |
| ▸ | MAPT | P10636 | 2/20 | 0.34 |
| ▸ | RAB9A | P51151 | 2/20 | 0.34 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.34 |
| ▸ | HPGD | P15428 | 1/20 | 0.34 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.34 |
| ▸ | ELANE | P08246 | 1/20 | 0.34 |
| ▸ | MEN1 | O00255 | 1/20 | 0.34 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.34 |
| ▸ | MAOA | P21397 | 1/20 | 0.33 |
| ▸ | MAOB | P27338 | 1/20 | 0.33 |
| ▸ | ADAMTS5 | Q9UNA0 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL23291848 | 0.89 | GSK3B (0.46) | GSK3BPTGS2SLKGSK3AHSP90AA1 | |
| SCHEMBL94106 | 0.84 | GSK3B (0.37) | GSK3BPTGS2SLKGSK3AMEN1 | |
| SCHEMBL3684149 | 0.83 | GSK3B (0.52) | GSK3BPTGS2SLKHSP90AA1HSP90AB1 | |
| SCHEMBL23291858 | 0.80 | SLK (0.49) | GSK3BSLKGSK3AMAPTALDH1A1 | |
| SCHEMBL27860682 | 0.80 | SLK (0.41) | GSK3BPTGS2SLKGSK3AMEN1 | |
| SCHEMBL7193397 | 0.78 | PTGS2 (0.48) | GSK3BPTGS2 | |
| SCHEMBL3677953 | 0.77 | GSK3B (0.60) | GSK3BPTGS2SLKGSK3AMAPT | |
| SCHEMBL2081875 | 0.76 | KIF11 (0.43) | PTGS2MAPT | |
| SCHEMBL23291850 | 0.74 | MAOA (0.47) | GSK3BSLKGSK3AMAOAMAOB | |
| SCHEMBL3673533 | 0.73 | NQO1 (0.47) | GSK3BPTGS2NPC1MAPTRAB9A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 196 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12568848-B2 | Film, laminate, semiconductor wafer with film layer, substrate for mounting a semiconductor with film layer, and semiconductor device | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2026-03-03 | — | — | US | disclosed |
| US-12534559-B2 | Resin composition, resin sheet, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2026-01-27 | — | — | US | disclosed |
| US-12516139-B2 | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2026-01-06 | — | — | US | disclosed |
| EP-3845575-B1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL CO (JP) | 2025-12-10 | — | — | EP | disclosed |
| US-12486371-B2 | Thermally curable resin composition, cured object, resin sheet, prepreg, metal-clad laminate, multilayered printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2025-12-02 | — | — | US | disclosed |
| EP-3805293-B1 | RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD | MITSUBISHI GAS CHEMICAL CO (JP) | 2025-09-17 | — | — | EP | disclosed |
| US-20250270372-A1 | BISMALEIMIDE COMPOUND, RESIN COMPOSITION INCLUDING SAME, CURED OBJECT THEREFROM, SEMICONDUCTOR ELEMENT AND DRY FILM RESIST | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2025-08-28 | — | — | US | disclosed |
| EP-4321541-B1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL CO (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-3992231-B1 | USE OF A FILM IN A PRE-APPLIED UNDERFILL MATERIAL | MITSUBISHI GAS CHEMICAL CO (JP) | 2025-05-28 | — | — | EP | disclosed |
| US-12312323-B2 | Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2025-05-27 | — | — | US | disclosed |
| US-7528488-B2 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | HITACHI CHEMICAL CO., LTD. (JP) | 2009-05-05 | — | — | US | disclosed |
| US-7258918-B2 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | HITACHI CHEMICAL CO., LTD. (JP) | 2007-08-21 | — | — | US | disclosed |
| US-20070166549-A1 | Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure | NOMURA SATOYUKI | 2007-07-19 | — | — | US | disclosed |
| US-7208105-B2 | Mixture of electroconductive particles and polymer | HITACHI CHEMICAL CO., LTD. (JP) | 2007-04-24 | — | — | US | disclosed |
| US-20060260744-A1 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | TSUKAGOSHI ISAO | 2006-11-23 | — | — | US | disclosed |
| US-20060263599-A1 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | TSUKAGOSHI ISAO | 2006-11-23 | — | — | US | disclosed |
| US-20060100314-A1 | Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same | HITACHI CHEMICAL CO., LTD. (JP) | 2006-05-11 | — | — | US | disclosed |
| EP-1628363-A1 | CIRCUIT CONNECTING MATERIAL, FILM-LIKE CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE, AND METHOD OF PRODUCING THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2006-02-22 | — | — | EP | disclosed |
| US-20030178138-A1 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | HITACHI CHEMICAL CO., LTD. (JP) | 2003-09-25 | — | — | US | disclosed |
| US-20030141014-A1 | Mixture of electroconductive particles and polymer | HITACHI CHEMICAL CO., LTD. (JP) | 2003-07-31 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12534559-B2 | Resin composition, resin sheet, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device | ARCN1, EIF2B1, MAT2B | GSK3B 2383/4885PTGS2 2097/4885SLK 3113/4885 |
| US-12568848-B2 | Film, laminate, semiconductor wafer with film layer, substrate for mounting a semiconductor with film layer, and semiconductor device | TET1, TET3, GPX4 | GSK3B 275/4885PTGS2 2756/4885SLK 2413/4885 |
| US-12312323-B2 | Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | ASH2L, RER1, SEM1 | GSK3B 2508/4885PTGS2 2188/4885SLK 2434/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.