SCHEMBL94312

SCHEMBL94312

Cc1ccccc1OOC(=O)c1ccccc1

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.57
F2 P00734 1/20 0.57
TDP1 Q9NUW8 3/20 0.50
TSHR P16473 2/20 0.50
ALDH1A1 P00352 2/20 0.50
HSD17B10 Q99714 1/20 0.50
KMT2A Q03164 5/20 0.47
MAPT P10636 4/20 0.47
SMN1; SMN2 Q16637 2/20 0.46
L3MBTL1 Q9Y468 2/20 0.45
RXRA P19793 1/20 0.45
RXRB P28702 1/20 0.45
RXRG P48443 1/20 0.45
SLC6A3 Q01959 1/20 0.45
MEN1 O00255 1/20 0.44
POLB P06746 1/20 0.41
NPC1 O15118 1/20 0.41
RAB9A P51151 1/20 0.41
NOTUM Q6P988 1/20 0.41
PKM P14618 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Formic Acid SCHEMBL27946178 0.93 F2 (0.50) LMNAF2TDP1TSHRALDH1A1
SCHEMBL28795189 0.89 LMNA (0.53) LMNAF2TDP1TSHRALDH1A1
SCHEMBL29611759 0.86 LMNA (0.70) LMNAF2TDP1TSHRALDH1A1
Benzoyl Peroxide SCHEMBL27438754 0.82 LMNA (0.77) LMNAF2TDP1TSHRALDH1A1
SCHEMBL1284160 0.81 KMT2A (0.63) LMNAF2TDP1TSHRHSD17B10
SCHEMBL6204759 0.80 TDP1 (0.51) LMNAF2TDP1TSHRALDH1A1
SCHEMBL1957403 0.79 PTPN1 (0.44) LMNATDP1TSHRALDH1A1HSD17B10
SCHEMBL28080608 0.78 LMNA (0.57) LMNAF2TDP1TSHRALDH1A1
SCHEMBL11312115 0.77 TDP1 (0.54) LMNAF2TDP1TSHRALDH1A1
Hydrogen Peroxide SCHEMBL28159758 0.77 TSHR (0.48) TDP1TSHRALDH1A1KMT2ASMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 287 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8173048-B2 Composition for circuit connection film and circuit connection film using the same CHEIL INDUSTRIES, INC. (KR) 2012-05-08 US claimed
US-20100148130-A1 Composition for circuit connection film and circuit connection film using the same KUKDO ADVANCED MATERIALS CO., LTD. (KR) 2010-06-17 US claimed
EP-0377507-B1 Aqueous dispersion and the preparation of foamed resins therefrom WITCO CORP (US) 1995-03-15 EP claimed
US-12624140-B2 Composition containing compound having polyoxyalkylene chain RESONAC CORPORATION (JP) 2026-05-12 US disclosed
US-12624141-B2 Composition set containing compound having polyoxyalkylene chain RESONAC CORPORATION (JP) 2026-05-12 US disclosed
EP-4679493-A1 METHOD FOR PRODUCING THIN WAFER, WAFER LAMINATE AND TEMPORARY ADHESIVE FOR WAFER PROCESSING SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-01-14 EP disclosed
US-20250346702-A1 COMPOSITION THAT CONTAINS COMPOUND HAVING POLYOXYALKYLENE CHAIN AND ACRYLIC COPOLYMER RESONAC CORP (JP) 2025-11-13 US disclosed
US-20250297092-A1 COMPOSITION THAT CONTAINS COMPOUND HAVING POLYOXYALKYLENE CHAIN AND ESTER-BASED THIXOTROPY-IMPARTING AGENT RESONAC CORPORATION (JP) 2025-09-25 US disclosed
WO-2025109868-A1 THERMOSETTING SILICONE COMPOSITION, DIE BONDING MATERIAL, AND OPTICAL SEMICONDUCTOR DEVICE 信越化学工業株式会社 2025-05-30 WO disclosed
EP-4512837-A1 COMPOSITION THAT CONTAINS COMPOUND HAVING POLYOXYALKYLENE CHAIN AND ACRYLIC COPOLYMER Resonac Corporation (JP) 2025-02-26 EP disclosed
WO-2025018368-A1 ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTED STRUCTURE, AND METHOD FOR PRODUCING CONNECTED STRUCTURE 株式会社レゾナック 2025-01-23 WO disclosed
US-20030141014-A1 Mixture of electroconductive particles and polymer HITACHI CHEMICAL CO., LTD. (JP) 2003-07-31 US disclosed
US-20030027942-A1 Resin composition , adhesive prepared therewith for bonding circuit members,and circuit boards HITACHI CHEMICAL CO., LTD. (JP) 2003-02-06 US disclosed
EP-1229095-A1 ADHESIVE AGENT, METHOD FOR CONNECTING WIRING TERMINALS AND WIRING STRUCTURE HITACHI CHEMICAL COMPANY, LTD. (JP) 2002-08-07 EP disclosed
EP-1223795-A1 WIRING-CONNECTING MATERIAL AND PROCESS FOR PRODUCING CIRCUIT BOARD WITH THE SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2002-07-17 EP disclosed
US-6306947-B1 Printing ink and paint composed of an aqueous emulsion of self-emulsifiable urethane copolymer NIPPON POLYURETHANE INDUSTRY CO., LTD. (JP) 2001-10-23 US disclosed
EP-1057843-A1 Aqueous emulsion, process for producing the same and aqueous paint and aqueous printing ink comprising the same NIPPON POLYURETHANE INDUSTRY CO. LTD. (JP) 2000-12-06 EP disclosed
EP-0906402-A1 BLEACH ACTIVATION UNILEVER N.V. (NL) 1999-04-07 EP disclosed
WO-1997048787-A1 BLEACH ACTIVATION UNILEVER N.V. (NL) 1997-12-24 WO disclosed
WO-1994009104-A1 DETERGENT COMPOSITION UNILEVER PLC (GB) 1994-04-28 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12624140-B2 Composition containing compound having polyoxyalkylene chain PIEZO1, HVCN1, TAF11 LMNA 1150/4885F2 1519/4885TDP1 875/4885
US-12624141-B2 Composition set containing compound having polyoxyalkylene chain SET, SETD1B, SETDB1 LMNA 2491/4885F2 635/4885TDP1 2220/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.